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Winbond Electronics Corporation W25M02GVZEJG
- Part No.:
- W25M02GVZEJG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25M02GVZEJG.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,243
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Product details
Overview
W25M02GVZEJG from Winbond is a 2 G-bit (2 × 1 G-bit) Serial SLC NAND Flash MCP with dual/quad SPI interface, supporting concurrent die operations and continuous read mode for code shadowing. It integrates two W25N01GV dies in a single 8-pad WSON 8×6-mm package, operates at 2.7–3.6 V, delivers up to 50 MB/s continuous data transfer, and features on-chip 1-bit ECC and hardware/software write protection.
For engineers reviewing the W25M02GVZEJG datasheet, W25M02GVZEJG pinout, W25M02GVZEJG application, or W25M02GVZEJG equivalent, key selection considerations include dual-die concurrency support, 104 MHz SPI clock capability, 128 KB uniform block erase architecture, JEDEC ID compatibility, and flexible buffer vs. continuous read mode configuration via BUF bit in Status Register-2.
Technical Context
The W25M02GVZEJG implements SpiStack® architecture with factory-assigned Die IDs and Software Die Select (C2h) instruction, enabling independent access to each stacked die while sharing all I/O pins. Only one die is active on the SPI bus at any time to prevent contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with Fast Read Quad I/O achieving 416 MHz equivalent throughput. The device uses volatile and OTP-lockable status/configuration registers (SR-1/SR-2) to control ECC enable (ECC-E), read mode (BUF), write protection (WP-E), and OTP access (OTP-E).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 G-bit (2 × 1 G-bit) total, organized as two independent 1 G-bit SLC NAND dies |
| Interface | Standard/Dual/Quad SPI with shared CLK, /CS, IO0–IO3; /WP and /HOLD repurposed as IO2/IO3 in Quad mode |
| Max Clock Frequency | 104 MHz standard SPI; 208 MHz equivalent for Dual I/O; 416 MHz equivalent for Quad I/O |
| Data Transfer Rate | Up to 50 MB/s in Continuous Read Mode - enables efficient full-array sequential access without page boundary management |
| Erase/Program Endurance | 100,000 cycles per block, validated with on-chip 1-bit ECC (1 bit/528 byte) |
| Data Retention | 10 years at +85°C - specified under JEDEC JESD22-A117 conditions with ECC enabled |
| Operating Voltage | 2.7 V to 3.6 V - single-supply operation compatible with industrial 3.3 V rail systems |
| Temperature Range | −40°C to +85°C - qualified for extended industrial applications without derating |
Pinout & Package
W25M02GVZEJG is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252 compliant, package code ZE), with exposed thermal pad. Pin 1 is marked by a dot; pin numbering follows counter-clockwise orientation from top-left corner in top view.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | /CS | Active-low chip select; must transition high→low before instruction acceptance; tracks VCC during power-up/down |
| 2 | DO (IO1) | Data output in Standard SPI; bidirectional I/O1 in Dual/Quad SPI; used for status/data reads on falling CLK edge |
| 3 | /WP (IO2) | Hardware write protect input when WP-E=1; functions as IO2 in Quad SPI when WP-E=0 |
| 4 | GND | Digital ground reference; connects to PCB thermal pad for thermal dissipation |
| 5 | DI (IO0) | Data input in Standard SPI; bidirectional I/O0 in Dual/Quad SPI; accepts instructions/addresses on rising CLK edge |
| 6 | CLK | Input-only serial clock; synchronous timing reference for all SPI transfers; max 104 MHz |
| 7 | /HOLD (IO3) | Hold function input when active low; serves as IO3 in Quad SPI when WP-E=0 |
| 8 | VCC | Primary power supply (2.7–3.6 V); decoupling capacitor required within 10 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Independent read-while-program/erase across two stacked dies - improves effective throughput without host intervention |
| Continuous Read Mode | Single Read command accesses entire memory array sequentially - eliminates need for repeated Page Data Read commands in boot/code-fetch scenarios |
| Software Die Select (C2h) | Enables host to activate specific die (Die #0 or Die #1) using factory-assigned 8-bit Die ID - essential for managing dual-die address space |
| Configurable ECC | ECC-E bit in SR-2 enables/disables on-chip 1-bit correction - allows trade-off between reliability and latency in deterministic firmware environments |
| OTP Protection | Ten 2 KB OTP pages + SRP bits lock critical configuration (e.g., BP bits, WP-E) - prevents field reprogramming of security-critical settings |
| Bad Block Management | Hardware-accelerated BBM with LUT access (A5h) and failure tracking (A9h) - reduces host driver complexity for NAND wear leveling |
Applications
| Firmware Storage | Industrial HMI Boot |
|---|---|
|
Use Scenario: Storing bootloader, FPGA configuration bitstream, and application firmware in space-constrained embedded controllers. IC Role / Device Role / Timing Role: Primary non-volatile storage device interfaced directly to MCU SPI controller; provides deterministic read latency for cold-boot execution. Use Value: Continuous Read Mode enables direct shadowing of 2 MB+ firmware images into RAM without software-managed page boundaries - reducing boot time by ~35% vs. discrete NAND with external controller. |
Use Scenario: Reliable boot media for human-machine interface panels operating in wide-temperature industrial environments. IC Role / Device Role / Timing Role: Dual-die NAND flash providing redundant firmware partitions; accessed via Quad SPI for high-speed GUI asset loading. Use Value: Concurrent Program/Erase allows background firmware update on one die while executing from the other - eliminating system downtime during OTA updates. |
| Edge AI Sensor Node | Medical Diagnostic Module |
|
Use Scenario: Local logging of time-stamped sensor fusion data (IMU, temperature, gas) in battery-powered edge nodes. IC Role / Device Role / Timing Role: High-endurance data logger with ECC-enabled writes; leverages 128 KB uniform erase blocks for wear-leveling efficiency. Use Value: 100,000 program/erase cycles and 10-year retention at +85°C ensure >5 years of daily logging without degradation - validated with on-chip ECC correction. |
Use Scenario: Storing calibrated sensor coefficients, safety-critical diagnostic algorithms, and audit logs in Class II medical devices. IC Role / Device Role / Timing Role: Secure configuration store with OTP-locked parameter pages and hardware write-protect (/WP grounded). Use Value: OTP pages preserve factory calibration data immutably; SRP bits prevent accidental overwrite of SR-1 - meeting IEC 62304 SW safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die, SOIC 300-mil package (16-pin); no /WP or /HOLD dedicated pins - both repurposed as NC; IO0–IO3 available only in Quad mode | Larger footprint; requires PCB redesign; lacks hardware write-protect pin; better for legacy board upgrades with SOIC sockets | Select when mechanical compatibility with existing SOIC footprints is mandatory and hardware WP is not required. |
| MT29F2G01ABAGDWB-IT | 2 G-bit SLC NAND from Micron; parallel NAND interface (not SPI); requires external controller; no integrated ECC or BBM | Higher raw bandwidth but adds controller BOM cost and firmware overhead; no continuous read mode or die concurrency | Select only when migrating from legacy parallel NAND designs and external controller resources are available. |
Compared with W25M02GVSIQ, W25M02GVZEJG offers smaller footprint, dedicated /WP and /HOLD pins for robust hardware protection, and superior thermal performance in WSON. Against MT29F2G01ABAGDWB-IT, W25M02GVZEJG eliminates external controller dependency, integrates ECC/BBM, and enables faster boot via Continuous Read Mode - reducing total system component count by ≥3.
Availability
W25M02GVZEJG is available at Aetrix Electronics and suitable for industrial HMI boot, edge AI sensor logging, medical diagnostic firmware storage, and automotive infotainment subsystems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for W25M02GVZEJG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs since 1987.
The W25M series belongs to Winbond's SpiFlash® MCP product line, designed specifically to deliver high-density NAND functionality in low-pin-count SPI packages for space-constrained, high-reliability embedded systems.
FAQ
What is the exact memory organization of the W25M02GVZEJG?
The W25M02GVZEJG contains two independent 1 G-bit SLC NAND dies (W25N01GV) stacked in a single package. Each die has 128 MB (134,217,728 bytes) capacity, organized in 1,024 blocks of 128 KB each, with 64 pages per block and 2,048 bytes per page. Total usable density is 256 MB after accounting for bad block overhead and ECC metadata.
Does the W25M02GVZEJG support true quad SPI with all four I/O lines active simultaneously?
Yes, the W25M02GVZEJG supports true Quad SPI operation using IO0–IO3 for both input and output on a single data lane. Fast Read Quad I/O (EBh/ECh) and Quad Load Program Data (32h/34h) instructions use all four lines concurrently, achieving 416 MHz equivalent throughput at 104 MHz CLK - confirmed in Section 6.1.4 and Table 8.1.2 of the datasheet.
How does the Continuous Read Mode differ from Buffer Read Mode in the W25M02GVZEJG?
In Continuous Read Mode (BUF=1), a single Read command (03h) accesses the entire memory array sequentially without requiring intermediate Page Data Read (13h) commands. In Buffer Read Mode (BUF=0), each 2 KB page must be explicitly loaded via 13h before reading - increasing command overhead. This distinction is defined in Sections 1.1 and Figure 19a/b.
Can both dies in the W25M02GVZEJG be programmed simultaneously?
No - the SpiStack® architecture enforces single-die activation at any time to avoid SPI bus contention. While "Multi Die Program/Erase" is listed as a feature, it refers to rapid sequential programming across dies using Software Die Select (C2h), not true parallel execution. Section 4.1 and Figure 2a confirm only one die controls the bus per operation.
What is the role of the /WP pin on the W25M02GVZEJG in hardware versus software protection modes?
When WP-E=1 (Hardware Protection mode), /WP is a dedicated active-low input: grounding it disables all Write/Program/Erase functions globally. When WP-E=0 (Software Protection mode), /WP functions as IO2 in Quad SPI and only protects Status Register-1 via BP bits - confirmed in Section 4.4 and Figure 3a.
W25M02GVZEJG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25M02GVZEJG FAQ
1.How can I place an order for W25M02GVZEJG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVZEJG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVZEJG reliable?
The price and inventory of W25M02GVZEJG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVZEJG is usually 5 days.
3.What payment methods are accepted for W25M02GVZEJG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVZEJG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVZEJG?
W25M02GVZEJG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVZEJG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVZEJG?
For technical support, including W25M02GVZEJG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVZEJG requirements.
6.How does Aetrix verify that W25M02GVZEJG is sourced from the original manufacturer or authorized distributors?
All W25M02GVZEJG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVZEJG meets industry standards.
7.What is the process for return or replacement of W25M02GVZEJG?
All W25M02GVZEJG units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVZEJG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVZEJG part is unused and in its original packaging.
Return procedure for W25M02GVZEJG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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