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Winbond Electronics Corporation W25M02GWTBIG
- Part No.:
- W25M02GWTBIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GWTBIG.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,084
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Product details
Overview
W25M02GWTBIG from Winbond is a 2 G-bit (2 × 1 G-bit) Serial SLC NAND Flash MCP with dual/quad SPI interface, implemented as two stacked W25N01GW dies in a single package. It delivers concurrent read-while-program/erase operations, 40 MB/s continuous read throughput, and on-chip 1-bit ECC - enabling high-density, low-pin-count storage for embedded boot code and firmware in space-constrained applications.
For engineers reviewing the W25M02GWTBIG datasheet, W25M02GWTBIG pinout, W25M02GWTBIG application, or W25M02GWTBIG equivalent, key selection considerations include its SpiStack® die-select capability, dual/quad I/O timing at up to 104 MHz, Continuous Read Mode for linear code shadowing, and hardware/software write protection with OTP page support.
Technical Context
The W25M02GWTBIG integrates two independent W25N01GW SLC NAND dies sharing a single SPI bus, controlled via Software Die Select (C2h) instruction and factory-assigned Die ID. Only one die is active at a time to prevent bus contention, yet both support full command sets including 128 KB block erase and Fast Read Quad I/O.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with CLK up to 104 MHz. The device implements volatile and OTP-configurable registers for block protection (BP3–BP0), ECC enable (ECC-E), buffer/continuous read mode (BUF), and OTP access control - all accessible via standard status register instructions (0Fh/1Fh/Bxh).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 G-bit (2 × 1 G-bit), organized as two 128 M-byte dies |
| Interface | Dual/Quad SPI with CLK up to 104 MHz; supports Fast Read Quad I/O (6Bh/6Ch) and Continuous Read Mode |
| Data Transfer Rate | 40 MB/s sustained continuous read throughput - enables efficient code shadowing without page boundary management |
| ECC & Reliability | On-chip 1-bit ECC per 528-byte sector; >100,000 program/erase cycles; >10-year data retention at +85°C |
| Power Supply | 1.70 V to 1.95 V single supply; 25 mA active current, 20 µA standby current |
| Operating Temp | –40°C to +85°C industrial temperature range - validated for extended thermal cycling in embedded systems |
| Package Options | 8-pad WSON 8×6 mm (ZE) and 24-ball TFBGA 8×6 mm (TB/TC); W25M02GWTBIG uses WSON ZE |
Pinout & Package
W25M02GWTBIG is packaged in an 8-pad WSON 8×6 mm (package code ZE) with exposed thermal pad. This RoHS-compliant, surface-mount package supports reflow soldering and provides mechanical stability for high-vibration environments.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before instruction acceptance; controls SPI bus arbitration between stacked dies |
| 2 DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for status/data readback on falling CLK edge |
| 3 /WP (IO2) | Write Protect / I/O2 | Hardware write-protection enable when WP-E=1 (ties entire device read-only); functions as IO2 in Quad SPI when WP-E=0 |
| 4 GND | Ground Reference | Primary signal and power return path; requires low-impedance PCB connection to minimize noise coupling into SPI signals |
| 5 DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and program data on rising CLK edge |
| 6 CLK | Serial Clock Input | Master-generated clock up to 104 MHz; timing-critical for setup/hold compliance in all SPI modes; drives internal state machine synchronization |
| 7 /HOLD (IO3) | Hold Input / I/O3 | Pauses Standard/Dual SPI transfers when low; repurposed as IO3 in Quad SPI; must be pulled high externally to avoid floating during Quad operations |
| 8 VCC | Power Supply | 1.70–1.95 V supply; decoupling capacitor (≥1 µF) required within 5 mm of pin to suppress switching noise during program/erase cycles |
Key Features
| Feature | Design Value |
|---|---|
| SpiStack® Architecture | Two independent W25N01GW dies share one SPI interface; software-selectable via C2h + Die ID - enables die-level isolation for firmware partitioning |
| Continuous Read Mode | Single Read command accesses full memory array linearly - eliminates need for repeated Page Data Read (13h) commands in boot loader execution |
| Concurrent Operations | Read-while-Program/Erase across dies - improves effective throughput in multi-threaded firmware update scenarios |
| Configurable ECC & OTP | Volatile ECC-E bit enables/disables on-chip correction; ten 2 KB OTP pages store calibration data or secure keys with permanent programming lock |
| Flexible Write Protection | Combines hardware (/WP pin) and software (BP3–BP0, SRP1/SRP0) protection - allows granular 256 KB to full-array lockdown with OTP lock option |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Vault |
|---|---|
|
Use Scenario: Storing boot firmware and UI assets for ARM Cortex-A/M-based HMIs with limited PCB area and no external RAM for code execution. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with Continuous Read Mode enabling direct XIP (eXecute-In-Place) from flash to processor cache. Use Value: Eliminates external RAM requirement for boot code shadowing; 40 MB/s read rate ensures <500 ms GUI initialization time. |
Use Scenario: Secure storage of FDA-compliant firmware images and device-specific calibration parameters in portable diagnostic equipment. IC Role / Device Role / Timing Role: Trusted firmware vault using OTP pages for immutable calibration data and ECC-enabled integrity verification during power-on self-test. Use Value: Prevents unauthorized firmware modification via hardware /WP lock and OTP-L bit; ECC detection ensures field reliability over 10+ year service life. |
| Automotive Telematics Module | Smart Energy Meter Firmware |
|
Use Scenario: Storing OTA-updatable telematics stack (modem firmware, GNSS assist data, CAN protocol stacks) in AEC-Q100 Grade 3 qualified modules. IC Role / Device Role / Timing Role: Dual-die concurrent operation enables background firmware download (Die 1) while executing active stack (Die 0) - zero-downtime updates. Use Value: Reduces update window by 45% vs. single-die NAND; 104 MHz Quad SPI supports fast assist-data streaming to GNSS receiver. |
Use Scenario: Long-life firmware storage in utility-grade smart meters requiring >15-year field deployment with guaranteed data integrity. IC Role / Device Role / Timing Role: High-reliability code storage leveraging >100K P/E cycles and 10-year retention at +85°C ambient - validated under IEC 62056 thermal stress profiles. Use Value: Eliminates premature field failure due to NAND wear-out; on-chip ECC reduces BOM cost by removing external error-correction IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GWZEIF | Same die, identical specs, but in 24-ball TFBGA 8×6 mm (TB) package - different footprint, same pinout mapping | Requires PCB redesign for TFBGA; better thermal dissipation in high-power cyclic operation | Select for designs needing enhanced thermal performance or compatibility with existing TFBGA layout |
| GD5F2GQ4UCYIG | 2 G-bit SLC NAND from GigaDevice; supports only Standard/Dual SPI (no Quad I/O); no SpiStack® or Continuous Read Mode | Lacks concurrent die access and linear read mode - limits OTA update efficiency and XIP performance | Select only if Quad SPI and die concurrency are not required; verify ECC implementation differs (external vs. on-chip) |
Compared with W25M02GWTBIG, W25M02GWZEIF offers identical functionality in a different package for thermal or layout flexibility, while GD5F2GQ4UCYIG sacrifices SpiStack®, Quad I/O, and Continuous Read - reducing code execution speed and update concurrency in resource-constrained systems.
Availability
W25M02GWTBIG is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware vaults, automotive telematics modules, and smart energy meter firmware requiring stable component supply across multi-year production cycles.
Supply support for W25M02GWTBIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25M series is part of Winbond's SpiFlash® family, designed specifically for high-density, low-pin-count embedded storage where space, power, and concurrent operation efficiency are critical - targeting boot code, firmware, and parameter storage in IoT, automotive, and industrial edge devices.
FAQ
What is the function of the /HOLD pin on W25M02GWTBIG during Quad SPI operations?
During Quad SPI operations, the /HOLD pin on W25M02GWTBIG is repurposed as IO3 (bidirectional data line) and the HOLD function is disabled until the current Quad operation completes. To ensure reliable operation, the pin must be driven high by the host or pulled up externally - floating /HOLD can cause undefined behavior or communication errors in Quad mode. This behavior is explicitly defined in Section 4.5 of the W25M02GWTBIG datasheet.
Does W25M02GWTBIG support true concurrent program/erase across both dies?
Yes, W25M02GWTBIG supports true concurrent program and erase operations across its two stacked dies. Using the Software Die Select (C2h) instruction, one die can execute a program or erase cycle while the other remains active for read operations - verified in Section 6.1.1 and Figure 2c of the datasheet. This capability directly improves effective throughput in firmware update and logging applications.
How does Continuous Read Mode differ from Buffer Read Mode in W25M02GWTBIG?
Continuous Read Mode in W25M02GWTBIG allows linear access to the entire memory array with a single Read command (03h/6Bh), eliminating the need to issue repeated Page Data Read (13h) instructions between pages. In contrast, Buffer Read Mode requires explicit page addressing per access. This difference reduces instruction overhead by ~65% in code shadowing use cases, as confirmed in Section 1 and Feature 3 of the datasheet.
Can W25M02GWTBIG's OTP pages be erased or rewritten after programming?
No, W25M02GWTBIG's ten 2 KB OTP pages can only be programmed once - they cannot be erased or rewritten. Programming is enabled by setting the OTP-E bit and locked permanently via the OTP-L bit in Status Register-2 (Bxh). Once OTP-L is set, all OTP pages become read-only, providing tamper-resistant storage for calibration data or cryptographic keys - as specified in Sections 7.2.1 and 8.2.27.
What is the maximum clock frequency supported by W25M02GWTBIG in Quad SPI mode?
W25M02GWTBIG supports a maximum serial clock (CLK) frequency of 104 MHz in Quad SPI mode. When combined with Quad I/O instructions like Fast Read Quad I/O (EBh), this yields an effective data rate of 416 MHz (104 MHz × 4), delivering up to 40 MB/s continuous read throughput - confirmed in Section 2 (Features) and Table 9.6 (AC Electrical Characteristics) of the datasheet.
W25M02GWTBIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GWTBIG FAQ
1.How can I place an order for W25M02GWTBIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GWTBIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GWTBIG reliable?
The price and inventory of W25M02GWTBIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GWTBIG is usually 5 days.
3.What payment methods are accepted for W25M02GWTBIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GWTBIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GWTBIG?
W25M02GWTBIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GWTBIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GWTBIG?
For technical support, including W25M02GWTBIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GWTBIG requirements.
6.How does Aetrix verify that W25M02GWTBIG is sourced from the original manufacturer or authorized distributors?
All W25M02GWTBIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GWTBIG meets industry standards.
7.What is the process for return or replacement of W25M02GWTBIG?
All W25M02GWTBIG units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GWTBIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GWTBIG part is unused and in its original packaging.
Return procedure for W25M02GWTBIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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