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Winbond Electronics Corporation W25M02GWTBIT TR
- Part No.:
- W25M02GWTBIT TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GWTBIT TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,661
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Product details
Overview
W25M02GWTBIT TR from Winbond is a 1.8V Serial MCP (Multi-Chip Package) NAND Flash memory comprising two stacked W25N01GW SLC die in a single 8-pin WSON package, delivering 2 G-bit (2 × 1 G-bit) density with Dual/Quad SPI interface, 104 MHz clock support, and concurrent read-while-program/erase capability for embedded code storage and data logging.
For engineers reviewing the W25M02GWTBIT TR datasheet, W25M02GWTBIT TR pinout, W25M02GWTBIT TR application, or W25M02GWTBIT TR equivalent, this device enables high-throughput serial NAND in space-constrained designs requiring ECC-managed reliability, software die select, and continuous read mode for boot code shadowing.
Technical Context
The W25M02GWTBIT TR implements SpiStack® architecture with two independent 1 G-bit SLC NAND dies sharing one SPI bus; each die has a factory-assigned Die ID and is selected via Software Die Select (C2h) instruction. Only one die is active at a time to prevent bus contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with Fast Read Quad I/O achieving up to 416 MHz effective throughput. Continuous Read Mode eliminates page boundary overhead, enabling linear access across the full 256 MB array without repeated Page Data Read commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 G-bit (2 × 1 G-bit), organized as two 128 MB die with uniform 128 KB erase blocks |
| Interface | Dual/Quad SPI compatible; supports Standard, Dual I/O, and Quad I/O protocols with shared CLK, /CS, and bidirectional IOx pins |
| Max Clock Frequency | 104 MHz - enables 208 MB/s (Dual) or 416 MB/s (Quad) effective data rate using Fast Read instructions |
| ECC & Reliability | On-chip 1-bit ECC per 528-byte page; ECC status bits (ECC-1/ECC-0) report correction success/failure; ≥100,000 P/E cycles |
| Power Supply | 1.70 V to 1.95 V single supply; 25 mA active current, 20 µA standby current; -40°C to +85°C industrial temperature range |
| Special Modes | Continuous Read Mode (BUF=0) for seamless full-array access; Buffer Read Mode (BUF=1) for page-aligned reads; software-configurable OTP lock and SR protection |
| Unique Features | Software Die Select (C2h); factory-assigned Die ID; 2 KB Unique ID page; 2 KB Parameter page; ten 2 KB OTP pages (write-once) |
Pinout & Package
W25M02GWTBIT TR is packaged in an 8-pad WSON 8×6 mm (Package Code ZE), surface-mount, lead-free, RoHS-compliant package with exposed thermal pad (not electrically connected). Pin assignments are validated per Figure 1a of Winbond's W25M02GW datasheet Revision D.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; places DO/IO pins in high-impedance state when high; required low-to-high transition before new instruction acceptance after power-up |
| 2 DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for status/data read on falling CLK edge |
| 3 /WP (IO2) | Write Protect Input / I/O2 | Hardware write-protection control when WP-E=1 (GND = full read-only); functions as IO2 in Quad SPI when WP-E=0 |
| 4 GND | Ground Reference | Primary signal and power ground; must be low-impedance connection for stable timing and ECC operation |
| 5 DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and program data on rising CLK edge |
| 6 CLK | Serial Clock Input | Master-controlled clock; all SPI transactions synchronized to rising/falling edges; max 104 MHz frequency supported |
| 7 /HOLD (IO3) | Hold Input / I/O3 | Pauses Standard/Dual SPI transfers when low; becomes IO3 in Quad SPI operations; requires external pull-up to avoid floating |
| 8 VCC | Power Supply | 1.70–1.95 V supply; decoupling capacitor (≥1 µF) required near pin for noise immunity during high-speed read/write |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables Read-While-Program/Erase across die boundaries, improving effective throughput by eliminating sequential wait states |
| Continuous Read Mode | Single Read command accesses contiguous memory beyond page boundaries-critical for XIP boot code execution without address wrap logic |
| Software Die Select (C2h) | Allows host to switch active die without hardware reconfiguration; essential for redundant firmware storage or dual-bank OTA updates |
| Configurable ECC & Bad Block Management | User-enabled on-chip 1-bit ECC corrects single-bit errors; BBM LUT accessible via A5h instruction for deterministic invalid block handling |
| OTP Protection Architecture | Ten 2 KB OTP pages plus SRP/SRP0 bits allow permanent locking of configuration registers, parameter pages, and security-critical firmware metadata |
Applications
| Industrial HMI Firmware Storage | Edge IoT Data Logger |
|---|---|
|
Use Scenario: Storing GUI assets, boot firmware, and configuration binaries in compact panel PCs with limited PCB real estate. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Continuous Read Mode and ECC-protected integrity verification. Use Value: Eliminates need for external RAM buffering during boot; 128 KB uniform erase blocks simplify field firmware update partitioning. |
Use Scenario: Local buffering of sensor telemetry in battery-powered gateways before cloud upload, requiring endurance and retention. IC Role / Device Role / Timing Role: High-cycle data journaling device with >100K P/E cycles, 10-year data retention, and bad-block-aware wear leveling. Use Value: On-die ECC and BBM LUT reduce host MCU firmware complexity; Quad SPI enables fast burst writes during wake-up windows. |
| Medical Diagnostic Boot Image | Automotive Infotainment Cache |
|
Use Scenario: Secure storage of certified boot images and calibration tables in portable ultrasound or ECG devices. IC Role / Device Role / Timing Role: Trusted code repository with OTP-locked parameter page and SRP-protected status registers for regulatory compliance. Use Value: Factory-programmed Unique ID enables device-level traceability; hardware write-protect prevents accidental corruption during service mode. |
Use Scenario: Caching map tiles and UI assets in head units where thermal cycling and vibration demand robust NAND management. IC Role / Device Role / Timing Role: High-bandwidth serial NAND with Concurrent Operations to sustain simultaneous audio decode and graphics load. Use Value: 416 MB/s Quad I/O throughput reduces cache miss latency; industrial temp range (-40°C to +85°C) ensures reliability under dashboard conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVTAIG TR | Same die stack and SPI interface, but TFBGA 24-ball (6×4) package (Code TC); no WSON option; identical electrical specs and instruction set | Preferred for high-density routing or thermal dissipation needs; requires different footprint and reflow profile vs. WSON | Select when board layout favors BGA mounting or when enhanced thermal performance is required over ultra-compact size |
| GD5F2GQ4UCYIGR | 2 G-bit SLC NAND from GigaDevice; supports Octal SPI (up to 800 MB/s), but lacks SpiStack® concurrent operations and software die select | Better raw bandwidth for streaming, but no multi-die management; requires external ECC and BBM implementation | Choose for maximum sequential throughput where die independence and built-in NAND management are not required |
Compared with W25M02GWTBIT TR, W25M02GVTAIG TR offers identical functionality in a different package, while GD5F2GQ4UCYIGR trades SpiStack® intelligence for higher interface speed and external NAND controller dependency.
Availability
W25M02GWTBIT TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, edge IoT data logging, medical diagnostic boot image retention, automotive infotainment caching, and secure parameter storage requiring stable component supply across long-lifecycle programs.
Supply support for W25M02GWTBIT TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25M series is part of Winbond's SpiFlash® MCP product line, designed specifically to bring high-density, ECC-managed NAND Flash into standard SPI-based microcontroller systems without requiring dedicated NAND controllers.
FAQ
What is the exact memory organization of the W25M02GWTBIT TR?
The W25M02GWTBIT TR contains two stacked 1 G-bit SLC NAND dies (W25N01GW), each with 128 MB capacity, organized into 1,024 uniform 128 KB erase blocks (2,048 pages per die). Total logical address space is 256 MB, accessible via 4-byte addressing. The SpiStack® architecture allows independent die access using Software Die Select (C2h).
Does the W25M02GWTBIT TR support Quad SPI read commands with 4-byte addressing?
Yes, the W25M02GWTBIT TR supports Fast Read Quad I/O with 4-Byte Address (ECh instruction) and Fast Read Quad Output with 4-Byte Address (6Ch instruction), both operating at up to 104 MHz clock frequency. These commands deliver up to 416 MB/s effective throughput and are fully compatible with standard SPI controllers supporting extended addressing.
How does the Continuous Read Mode work in the W25M02GWTBIT TR?
In Continuous Read Mode (BUF=0), the W25M02GWTBIT TR executes a single Read command that streams data continuously across page and block boundaries without requiring additional Page Data Read (13h) instructions. This eliminates address wrap overhead and enables true linear access to the full 256 MB array-ideal for XIP boot code execution and firmware shadowing.
Can the W25M02GWTBIT TR be used without implementing external ECC?
Yes-the W25M02GWTBIT TR includes on-chip 1-bit ECC per 528-byte page, which is enabled via the ECC-E bit in Status Register-2. When enabled, it automatically corrects single-bit errors and reports status via ECC-1/ECC-0 bits in Status Register-3. External ECC is optional but recommended only for mission-critical applications requiring >1-bit correction.
What is the function of the /WP pin on the W25M02GWTBIT TR in Hardware Protection mode?
When WP-E=1 in the Protection Register, the /WP pin on the W25M02GWTBIT TR becomes a dedicated active-low hardware write-protect input. If tied to GND, all Program, Erase, and Status Register Write operations are disabled-including OTP programming and register modification-making the entire device read-only, with Quad SPI read operations also disabled.
W25M02GWTBIT TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GWTBIT TR FAQ
1.How can I place an order for W25M02GWTBIT TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GWTBIT TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GWTBIT TR reliable?
The price and inventory of W25M02GWTBIT TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GWTBIT TR is usually 5 days.
3.What payment methods are accepted for W25M02GWTBIT TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GWTBIT TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GWTBIT TR?
W25M02GWTBIT TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GWTBIT TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GWTBIT TR?
For technical support, including W25M02GWTBIT TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GWTBIT TR requirements.
6.How does Aetrix verify that W25M02GWTBIT TR is sourced from the original manufacturer or authorized distributors?
All W25M02GWTBIT TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GWTBIT TR meets industry standards.
7.What is the process for return or replacement of W25M02GWTBIT TR?
All W25M02GWTBIT TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GWTBIT TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GWTBIT TR part is unused and in its original packaging.
Return procedure for W25M02GWTBIT TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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