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Winbond Electronics Corporation W25M02GWTCIG TR
- Part No.:
- W25M02GWTCIG TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GWTCIG TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,079
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Product details
Overview
W25M02GWTCIG TR from Winbond is a 2G-bit (2 × 1G-bit) Serial MCP Flash memory built with two stacked W25N01GW SLC NAND dies in a single package, supporting Dual/Quad SPI interface, 104 MHz clock, 40 MB/s continuous read throughput, and concurrent die operations for enhanced program/erase efficiency - deployed in embedded boot code storage and firmware update modules.
For engineers reviewing the W25M02GWTCIG TR datasheet, W25M02GWTCIG TR pinout, W25M02GWTCIG TR application, or W25M02GWTCIG TR equivalent, key selection considerations include dual-die concurrency support, 1.7–1.95 V supply compatibility, hardware/software write protection modes, and WSON 8x6-mm or TFBGA 8x6-mm package options for space-constrained PCB layouts.
Technical Context
The W25M02GWTCIG TR implements SpiStack® architecture with factory-assigned Die ID#s, enabling independent software-selectable access to each of two stacked 1G-bit SLC NAND dies via the C2h instruction. Only one die is active on the shared SPI bus at any time to prevent contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with Fast Read Quad I/O achieving up to 416 MHz equivalent bandwidth. Continuous Read Mode eliminates inter-page command overhead, while on-chip 1-bit ECC corrects errors per 528-byte sector and reports status via SR-3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (2 × 1G-bit) = 256 MByte total, organized as two independent 128 MByte SLC NAND arrays |
| Interface | Dual/Quad SPI with standard, dual, and quad I/O protocols; supports C2h software die select and FFh device reset |
| Max Clock Frequency | 104 MHz (standard/Dual/Quad); enables 208 MHz (Dual I/O) or 416 MHz (Quad I/O) effective data rates |
| Data Transfer Rate | 40 MB/s sustained in Continuous Read Mode - eliminates page boundary latency for linear code execution |
| Voltage Supply | 1.70–1.95 V single supply - compatible with low-voltage SoC I/O domains and reduces power delivery complexity |
| Endurance & Retention | 100,000 program/erase cycles with on-chip 1-bit ECC; 10-year data retention at +85°C |
| Operating Temp | –40°C to +85°C industrial grade - validated across full temperature range for automotive infotainment and industrial HMI |
Pinout & Package
W25M02GWTCIG TR is available in 8-pad WSON 8×6 mm (package code ZE) and 24-ball TFBGA 8×6 mm (package codes TB/TC). The WSON variant uses surface-mount pads with exposed thermal pad; TFBGA variants use fine-pitch solder balls in 5×5 (TB) or 6×4 (TC) arrays.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: drives device into active state when low; high-impedance DO/IOs and standby current (~20 µA) when high |
| CLK | Serial Clock Input | Master-controlled timing reference; rising edge latches input (DI/IO0–3), falling edge samples output (DO/IO0–3) |
| DI (IO0) | Data Input / Bidirectional I/O 0 | Standard SPI data input; becomes bidirectional IO0 in Dual/Quad mode - used for instruction/address/data load |
| DO (IO1) | Data Output / Bidirectional I/O 1 | Standard SPI data output; becomes bidirectional IO1 in Dual/Quad mode - used for status/data readback |
| /WP (IO2) | Write Protect Input / Bidirectional I/O 2 | In Software Protection mode (WP-E=0): functions as IO2 in Quad mode; in Hardware mode (WP-E=1): dedicated active-low lock for all writes |
| /HOLD (IO3) | Hold Input / Bidirectional I/O 3 | In Standard/Dual mode: pauses ongoing SPI transfer when pulled low; in Quad mode: serves as IO3 - must be pulled high externally |
| VCC | Power Supply | 1.70–1.95 V core supply; decoupling capacitor required near pad/ball per layout guidelines |
| GND | Ground | Reference return path; WSON variant includes exposed thermal pad tied to PCB ground plane for thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables "Read while Program/Erase" and independent multi-die erase/program - increases effective throughput by overlapping latency-bound operations |
| Continuous Read Mode | Single Read command accesses entire memory array without intermediate Page Data Read instructions - ideal for XIP-capable microcontrollers |
| On-Chip 1-Bit ECC | Corrects single-bit errors per 528-byte sector; ECC status bits (ECC-1/ECC-0) in Status Register-3 report correction events and failure conditions |
| Flexible Write Protection | Hardware mode locks entire device (including OTP pages) when /WP grounded; software mode allows granular BP[3:0] block protection via Status Register-1 |
| Die-Level Addressing | Factory-assigned Die ID# enables selective activation of either die using C2h instruction - preserves isolation between firmware partitions or redundant banks |
Applications
| Boot Code Storage | Firmware Update Module |
|---|---|
|
Use Scenario: Stores primary bootloader and secure ROM image for ARM Cortex-M or RISC-V SoCs requiring fast, reliable cold-start execution. IC Role / Device Role / Timing Role: Nonvolatile storage for first-stage boot code; accessed via Continuous Read Mode to minimize startup latency. Use Value: 40 MB/s read rate and uniform 128 KB block erase enable deterministic boot timing and rapid field updates without external RAM buffering. |
Use Scenario: Hosts field-upgradable firmware images in industrial gateways, where over-the-air (OTA) updates require atomic write/verify cycles. IC Role / Device Role / Timing Role: Dual-die architecture allows background programming of one die while executing from the other - enabling zero-downtime updates. Use Value: Concurrent operations reduce update window by >40% versus single-die NAND; on-chip ECC ensures integrity during partial-program failures. |
| Secure Parameter Storage | Redundant Configuration Memory |
|
Use Scenario: Stores calibrated sensor offsets, cryptographic keys, and device-specific configuration in medical IoT edge nodes. IC Role / Device Role / Timing Role: Leverages ten 2 KB OTP pages and 2 KB Unique ID page for immutable, tamper-resistant parameter storage. Use Value: OTP pages are one-time programmable and locked via OTP-L bit - prevents accidental or malicious rewrites of critical calibration data. |
Use Scenario: Maintains mirrored copies of system configuration tables across two independent dies in railway signaling controllers. IC Role / Device Role / Timing Role: Uses Software Die Select (C2h) to isolate redundant banks; bad block management (A1h/A5h) maintains LUT-based fault tolerance. Use Value: Independent die health monitoring and automatic LUT-based remapping ensure >99.99% uptime under extended field operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVTCIG TR | Same 2G-bit capacity and SpiStack® architecture but rated for –40°C to +105°C extended temperature range; identical pinout and instruction set | Required for under-hood automotive ECUs or outdoor telecom base stations operating above +85°C | Select W25M02GVTCIG TR when ambient operating temperature exceeds +85°C; otherwise W25M02GWTCIG TR is optimal for industrial-grade cost/performance balance |
| MT29F2G01ABAGDWB-IT:C | 2G-bit SLC NAND in 24-ball TFBGA; supports ONFI 2.3 interface instead of SPI; no concurrent die or Continuous Read Mode | Suitable for FPGA-based controllers with parallel NAND interfaces; not drop-in replaceable due to different protocol and timing model | Choose MT29F2G01ABAGDWB-IT:C only if host controller lacks SPI NAND support but provides ONFI-compatible NAND controller logic |
Compared with W25M02GVTCIG TR, the W25M02GWTCIG TR trades extended temperature rating for lower unit cost and identical functionality in industrial environments; versus MT29F2G01ABAGDWB-IT:C, it delivers SPI-native integration, die concurrency, and Continuous Read Mode - eliminating need for external buffer management logic.
Availability
W25M02GWTCIG TR is available at Aetrix Electronics and suitable for embedded boot code storage, firmware update modules, secure parameter storage, and redundant configuration memory requiring stable component supply across long-lifecycle industrial programs.
Supply support for W25M02GWTCIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing components since 1987.
The W25M series is designed specifically for high-density, low-pin-count serial NAND applications demanding concurrent operations and seamless integration with microcontroller SPI peripherals - targeting space-constrained, cost-sensitive embedded systems.
FAQ
What is the difference between W25M02GWTCIG TR and W25M02GVTCIG TR?
The W25M02GWTCIG TR is rated for –40°C to +85°C operation, while the W25M02GVTCIG TR extends to +105°C. Both share identical pinout, instruction set, SpiStack® architecture, and 2G-bit capacity. The 'W' suffix denotes industrial temperature grade; 'V' indicates extended automotive-grade operation. W25M02GWTCIG TR is optimized for cost-sensitive industrial applications where ambient temperature remains within +85°C.
Does W25M02GWTCIG TR support true concurrent read and program operations across both dies?
Yes - W25M02GWTCIG TR supports "Read while Program/Erase" across dies via its SpiStack® architecture. Using the C2h Software Die Select instruction, one die can be placed in active program/erase mode while the other remains accessible for read operations. This concurrency is hardware-enforced and does not require host-side arbitration, directly improving effective throughput in firmware update and logging applications.
How is write protection implemented on W25M02GWTCIG TR?
W25M02GWTCIG TR offers dual-mode write protection: Software mode (WP-E = 0) uses Block Protect bits (BP3–BP0) in Status Register-1 to protect configurable memory regions, while /WP functions as IO2 in Quad mode; Hardware mode (WP-E = 1) dedicates /WP as an active-low global lock - grounding /WP disables all write/program/erase commands, including OTP page programming and register writes. Both modes are OTP-lockable for permanent configuration.
What package types are available for W25M02GWTCIG TR?
W25M02GWTCIG TR is offered in two RoHS-compliant packages: 8-pad WSON 8×6 mm (package code ZE) with exposed thermal pad, and 24-ball TFBGA 8×6 mm in two ball-array variants - 5×5 (package code TB) and 6×4 (package code TC). All variants share identical electrical characteristics and pin/ball assignments per datasheet Figures 1a–1b, enabling layout reuse across form factors.
Can W25M02GWTCIG TR be used as a direct replacement for standard SPI NOR flash in existing designs?
No - W25M02GWTCIG TR is a serial SLC NAND device with different command structure, ECC requirements, bad block management, and erase granularity (128 KB blocks vs. NOR's smaller sectors). It requires NAND-aware firmware drivers and cannot substitute NOR without host software and error-handling logic modifications. Its value lies in higher density and lower cost per bit - not pin- or instruction-level compatibility with NOR.
W25M02GWTCIG TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GWTCIG TR FAQ
1.How can I place an order for W25M02GWTCIG TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GWTCIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GWTCIG TR reliable?
The price and inventory of W25M02GWTCIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GWTCIG TR is usually 5 days.
3.What payment methods are accepted for W25M02GWTCIG TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GWTCIG TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GWTCIG TR?
W25M02GWTCIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GWTCIG TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GWTCIG TR?
For technical support, including W25M02GWTCIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GWTCIG TR requirements.
6.How does Aetrix verify that W25M02GWTCIG TR is sourced from the original manufacturer or authorized distributors?
All W25M02GWTCIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GWTCIG TR meets industry standards.
7.What is the process for return or replacement of W25M02GWTCIG TR?
All W25M02GWTCIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GWTCIG TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GWTCIG TR part is unused and in its original packaging.
Return procedure for W25M02GWTCIG TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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