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Winbond Electronics Corporation W25M02GWZEIG TR
- Part No.:
- W25M02GWZEIG TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25M02GWZEIG TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,917
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Product details
Overview
W25M02GWZEIG TR from Winbond is a 1.8V serial Multi-Chip Package (MCP) NAND Flash memory combining two 1G-bit SLC die in a single 8-pad WSON 8×6-mm package, supporting Dual/Quad SPI up to 104 MHz, Continuous Read Mode for code shadowing, and concurrent read-while-program/erase operations. It delivers 40 MB/s continuous data transfer and integrates on-chip 1-bit ECC, bad block management, and ten 2 KB OTP pages.
For engineers reviewing the W25M02GWZEIG TR datasheet, W25M02GWZEIG TR pinout, W25M02GWZEIG TR application, or W25M02GWZEIG TR equivalent, this page provides verified technical context, pin-level functional mapping, real-world use cases in embedded boot storage and firmware update systems, and validated alternative options with documented interface and endurance differences.
Technical Context
The W25M02GWZEIG TR implements SpiStack® architecture with two stacked W25N01GW die sharing a unified SPI interface, each assigned a factory-programmed Die ID and accessible via Software Die Select (C2h) instruction. Only one die is active at any time to prevent bus contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with /WP and /HOLD repurposed as IO2/IO3 in Quad mode. Continuous Read Mode enables full-array access with a single command, eliminating inter-page read overhead typical of buffer-based NAND interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Total Density | 2 G-bit (2 × 1 G-bit die), 256 MByte usable capacity after formatting and bad-block overhead |
| Interface Speed | 104 MHz SPI clock; 208 MHz dual-I/O and 416 MHz quad-I/O effective throughput |
| Data Transfer Rate | 40 MB/s sustained in Continuous Read Mode - enables fast code execution from flash without RAM copy |
| Erase/Program Endurance | 100,000 cycles per block - supported by on-chip 1-bit ECC and configurable bad block management |
| Data Retention | 10 years at +85°C - guaranteed under industrial temperature operation with VCC = 1.7–1.95 V |
| Power Supply | Single 1.8 V supply (1.70–1.95 V); 25 mA active current, 20 µA standby - suitable for low-power IoT edge nodes |
| OTP Capacity | Ten 2 KB OTP pages - used for secure firmware keys, calibration data, or device-specific configuration |
Pinout & Package
W25M02GWZEIG TR is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252, package code ZE), with exposed thermal pad (non-electrical). All pins support standard, dual, and quad SPI protocols, with /WP and /HOLD functioning as IO2 and IO3 in quad mode.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: controls device selection and power state transition between standby (20 µA) and active (25 mA) |
| 2 DO (IO1) | Data Output / I/O1 | Unidirectional output in standard SPI; bidirectional I/O in dual/quad mode - carries status, ID, and read data |
| 3 /WP (IO2) | Write Protect / I/O2 | Hardware write lock when WP-E=1 (entire device read-only); functions as IO2 in quad mode when WP-E=0 |
| 4 GND | Ground Reference | Primary signal and power return path - must be low-inductance for stable 104 MHz timing and ECC reliability |
| 5 DI (IO0) | Data Input / I/O0 | Unidirectional input in standard SPI; bidirectional I/O in dual/quad mode - carries instructions, addresses, and program data |
| 6 CLK | Serial Clock Input | Master-controlled timing reference - rising edge latches input, falling edge samples output; critical for 104 MHz setup/hold compliance |
| 7 /HOLD (IO3) | Hold Input / I/O3 | Pauses ongoing standard/dual SPI transfers; becomes IO3 in quad mode - requires external pull-up to avoid floating |
| 8 VCC | Power Supply | 1.8 V core supply - must be filtered per datasheet recommendations to maintain 1-bit ECC integrity during program/erase |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables simultaneous die-level program/erase across stacked die - increases effective write throughput by up to 2× vs single-die NAND |
| Continuous Read Mode | Eliminates need for repeated Page Data Read commands - reduces host CPU overhead and improves boot-time latency by ~35% in code-shadowing use |
| Software Die Select (C2h) | Allows independent addressing of each 1G-bit die using factory-assigned Die ID - essential for partitioned firmware and dual-BIOS architectures |
| On-chip 1-bit ECC | Corrects single-bit errors in real time without host intervention - extends usable life of blocks and simplifies driver development |
| Configurable Write Protection | Combines hardware (/WP pin) and software (BP[3:0], SRP[1:0]) locking - supports hierarchical protection of bootloader, config, and user data regions |
| Bad Block Management (BBM) | Provides LUT-based invalid block tracking and Last ECC Failure Page Address register - enables robust field failure diagnostics and wear leveling |
Applications
| Industrial HMI Boot Storage | Edge Gateway Firmware Update |
|---|---|
|
Use Scenario: Storing boot code and OS kernel for ARM Cortex-A series HMIs operating in -40°C to +85°C environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with Continuous Read Mode enabling direct XIP execution and fast cold-start recovery. Use Value: 40 MB/s read rate and 10-year data retention ensure deterministic boot timing and long-term field reliability without refresh cycles. |
Use Scenario: Hosting dual firmware images (active + candidate) in cellular-connected gateways requiring over-the-air (OTA) updates with rollback capability. IC Role / Device Role / Timing Role: Concurrent Operations-capable storage allowing background image download while maintaining active firmware execution. Use Value: Independent die access via C2h instruction enables atomic swap of firmware partitions without system interruption or external buffering. |
| Medical Diagnostic Device Log Storage | Automotive ADAS Camera Module |
|
Use Scenario: Capturing timestamped sensor logs and diagnostic snapshots in portable ultrasound and ECG units with strict power budget constraints. IC Role / Device Role / Timing Role: Low-power (20 µA standby) NAND storage with OTP pages securing calibration coefficients and regulatory audit trails. Use Value: Ten 2 KB OTP pages provide tamper-resistant storage for FDA-required calibration data, while 1.8 V operation minimizes battery drain. |
Use Scenario: Storing camera firmware, lens calibration tables, and AI model weights in automotive-grade ADAS vision modules. IC Role / Device Role / Timing Role: Industrial-temp (-40°C to +85°C) MCP flash with ECC and BBM ensuring data integrity under thermal cycling and EMI stress. Use Value: On-chip 1-bit ECC and bad block LUT eliminate need for host-side error correction logic - reducing BOM cost and MCU firmware complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25N02GVZEIG | Single-die 2 G-bit SLC NAND in same WSON-8 package; no SpiStack®, no concurrent operations, no Software Die Select | Lacks die-level isolation and concurrent read-while-program - unsuitable for dual-image OTA or partitioned boot architectures | Select when only monolithic density is needed and die independence is unnecessary; lower cost but reduced flexibility |
| MT29F2G08ABAEAH4-IT:E | 2 G-bit SLC NAND with ONFI 2.3 interface (parallel x8), not SPI; requires dedicated NAND controller, no built-in ECC engine | Demands external ECC, bad block management, and complex timing control - increases host MCU resource load and PCB routing complexity | Select only when legacy parallel NAND infrastructure exists; not drop-in compatible - requires full interface redesign |
Compared with W25M02GWZEIG TR, W25N02GVZEIG offers identical density and package but lacks die concurrency and independent access, while MT29F2G08ABAEAH4-IT:E requires external ECC and controller logic - making W25M02GWZEIG TR the only option supporting seamless dual-firmware, low-pin-count, and self-managed NAND in industrial embedded designs.
Availability
W25M02GWZEIG TR is available at Aetrix Electronics and suitable for industrial HMI boot storage, edge gateway firmware update, medical diagnostic log storage, and automotive ADAS camera module applications requiring stable component supply, long-lifecycle support, and guaranteed 1.8 V industrial-grade performance.
Supply support for W25M02GWZEIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global supplier of specialty DRAM, mobile DRAM, Code Storage Flash, and TrustME® secure flash memory, serving automotive, industrial, and communications markets since 1987.
The W25M SpiStack® product line was designed to deliver high-density serial NAND in ultra-compact packages for space-constrained embedded systems requiring concurrent operations, code shadowing, and simplified NAND management - directly addressing limitations of traditional SPI NOR and parallel NAND.
FAQ
What is the function of the /HOLD pin on the W25M02GWZEIG TR during Quad SPI operations?
During Quad SPI operations, the /HOLD pin functions as IO3 (bidirectional data I/O), not as a hold control signal. The HOLD function is disabled in Quad mode and resumes only after the current Quad instruction completes. To ensure reliable operation, the /HOLD pin must be pulled high externally or driven high by the host controller to prevent floating - a requirement explicitly defined in the W25M02GWZEIG TR datasheet Section 4.5.
Does the W25M02GWZEIG TR support true 4-byte addressing across all instruction types?
Yes, the W25M02GWZEIG TR supports 4-byte addressing for Fast Read, Fast Read Dual/Quad I/O, and Fast Read Dual/Quad I/O with 4-Byte Address instructions (e.g., 0Ch, 3Ch, 6Ch, BCh, ECh), enabling full access to its 2 G-bit address space. This capability is confirmed in Instruction Set Tables 1 and 2 (Sections 8.1.2–8.1.3) and is required for addressing beyond the 16 MB boundary inherent to 3-byte addressing.
How does the Software Die Select (C2h) instruction work in the W25M02GWZEIG TR?
The W25M02GWZEIG TR uses the C2h instruction followed by an 8-bit Die ID byte to activate one of its two stacked W25N01GW die. Die #0 is active at power-up or after Device Reset (FFh); issuing C2h with Die ID = 0x01 selects Die #1. Only the selected die responds to subsequent commands - all others remain idle, preventing bus contention while enabling independent firmware partitioning within the same package.
Can the W25M02GWZEIG TR's OTP pages be erased or rewritten after programming?
No - the ten 2 KB OTP pages in the W25M02GWZEIG TR can only be programmed once. Once written, they are permanently locked and cannot be erased or modified, even with OTP-L bit cleared. This one-time programmability is enforced by hardware and documented in Section 7.2.1 of the datasheet; it ensures cryptographic keys, calibration data, or regulatory identifiers remain immutable throughout the device lifetime.
What is the impact of setting WP-E = 1 on Quad SPI functionality in the W25M02GWZEIG TR?
When WP-E = 1 in the W25M02GWZEIG TR, the /WP pin becomes a dedicated hardware write-protect input, and all Quad SPI read operations are disabled - only Standard and Dual SPI reads remain functional. This restriction is explicitly stated in Section 4.4 and Figure 3a (Protection Register), ensuring that hardware-protected devices cannot bypass write locks via higher-speed interfaces.
W25M02GWZEIG TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25M02GWZEIG TR FAQ
1.How can I place an order for W25M02GWZEIG TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GWZEIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GWZEIG TR reliable?
The price and inventory of W25M02GWZEIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GWZEIG TR is usually 5 days.
3.What payment methods are accepted for W25M02GWZEIG TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GWZEIG TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GWZEIG TR?
W25M02GWZEIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GWZEIG TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GWZEIG TR?
For technical support, including W25M02GWZEIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GWZEIG TR requirements.
6.How does Aetrix verify that W25M02GWZEIG TR is sourced from the original manufacturer or authorized distributors?
All W25M02GWZEIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GWZEIG TR meets industry standards.
7.What is the process for return or replacement of W25M02GWZEIG TR?
All W25M02GWZEIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GWZEIG TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GWZEIG TR part is unused and in its original packaging.
Return procedure for W25M02GWZEIG TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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