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Winbond Electronics Corporation W25M512JVCIQ TR
- Part No.:
- W25M512JVCIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M512JVCIQ TR.pdf
- Description:
- IC FLASH 512MBIT SPI 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,527
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Product details
Overview
W25M512JVCIQ TR from Winbond is a 3V, 512M-bit (2 × 256M-bit) Serial MCP Flash memory combining two stacked W25Q256JV die in a single 8-pad WSON 8×6-mm package. It supports Standard/Dual/Quad SPI interfaces, concurrent read-while-program/erase operations, and 4-byte addressing - enabling high-throughput data storage in space-constrained embedded systems.
For engineers reviewing the W25M512JVCIQ TR datasheet, W25M512JVCIQ TR pinout, W25M512JVCIQ TR application, or W25M512JVCIQ TR equivalent, key selection criteria include concurrent die access capability, 104 MHz Quad SPI timing, 4KB uniform sector architecture, and software die select (C2h) instruction support for independent die control.
Technical Context
The W25M512JVCIQ TR implements SpiStack® architecture with two independent W25Q256JV dies sharing one SPI bus. Die selection is managed exclusively via Software Die Select (C2h) instruction, with each die assigned a unique factory-programmed Die ID. Bus arbitration ensures only one die is active at any time to prevent contention.
It supports three address modes (3-byte default, 4-byte enabled via B7h), full instruction compatibility across Standard/Dual/Quad SPI, and hardware reset only on SOIC/TFBGA packages - not on the WSON variant. The /RESET pin is absent in WSON; reset relies solely on software (66h/99h) or power-cycle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 M-bit total (2 × 256 M-bit die), organized as 131,072 × 256-byte pages per die |
| Interface Speed | 104 MHz clock rate; enables up to 50 MB/s continuous Quad I/O read throughput |
| Erase Granularity | Uniform 4 KB sectors, plus 32 KB and 64 KB blocks - supports fine-grained firmware partitioning |
| Endurance & Retention | ≥100,000 program/erase cycles per sector; >20 years data retention at +85°C |
| Supply Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V logic and low-power industrial rails |
| Operating Temp | –40°C to +85°C - qualified for extended-temperature industrial and automotive cabin applications |
| Security Features | Three 256-byte OTP-locked security registers; individual sector/block lock (36h/39h); SFDP discoverability |
Pinout & Package
W25M512JVCIQ TR uses the 8-pad WSON 8×6-mm package (Package Code E), lead-free and RoHS-compliant. No /RESET pin is present - reset is software-only via 66h/99h instructions.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (/CS) | Chip Select Input | Active-low enable for SPI command execution; must be deasserted between instructions to avoid bus contention |
| 2 (DO / IO1) | Data Output / I/O1 | Primary output during Standard/Dual SPI reads; bidirectional in Dual/Quad I/O modes |
| 3 (IO2) | Data Input/Output 2 | Used only in Quad SPI mode (IO0–IO3); enables 4-bit parallel data transfer per clock cycle |
| 4 (GND) | Ground Reference | Signal and power return path; requires low-impedance PCB connection to minimize noise coupling |
| 5 (DI / IO0) | Data Input / I/O0 | Primary input for Standard SPI writes; bidirectional in Dual/Quad I/O; carries address/data during programming |
| 6 (CLK) | Serial Clock Input | Master-generated edge-triggered clock; timing-critical for setup/hold compliance at 104 MHz |
| 7 (IO3) | Data Input/Output 3 | Quad SPI-only pin; completes 4-bit data lane; unused in Standard/Dual modes |
| 8 (VCC) | Power Supply | 2.7–3.6 V supply; requires local 1 µF + 0.1 µF decoupling near pad to suppress switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables simultaneous background erase/program on one die while reading from the other - eliminates suspend/resume overhead and improves effective write bandwidth |
| Software Die Select (C2h) | Allows explicit, deterministic selection of either die via dedicated instruction - required before any operation targeting a specific die |
| 4-Byte Address Mode | Extends addressable space beyond 16 MB (3-byte limit) to full 512 M-bit capacity - essential for large firmware images and OTA updates |
| Program/Erase Suspend | Permits temporary pause of long-duration erase/program operations to service urgent read requests - critical for real-time system responsiveness |
| Individual Sector Lock | Supports per-sector (4 KB) write protection via 36h/39h instructions - enables secure bootloader, parameter, and calibration data isolation |
Applications
| Firmware Storage in IoT Edge Nodes | Secure Bootloader Partitioning |
|---|---|
|
Use Scenario: Storing MCU firmware, configuration, and sensor calibration data in battery-powered wireless sensors with limited PCB area. IC Role / Device Role / Timing Role: Primary non-volatile code and data storage device interfaced directly to ARM Cortex-M microcontroller via Quad SPI. Use Value: Concurrent operations allow over-the-air firmware update (erase/program one die) while executing current application (read from other die), minimizing downtime. |
Use Scenario: Isolating immutable bootloader code from field-upgradable application firmware in industrial gateways. IC Role / Device Role / Timing Role: Dual-die MCP providing physically separate, independently protected memory regions for boot and app code. Use Value: Individual sector lock (36h) secures bootloader sectors; software die select (C2h) prevents accidental cross-die writes during field updates. |
| Automotive Instrument Cluster Display | Medical Device Configuration Storage |
|
Use Scenario: Storing display assets (fonts, icons, UI bitmaps) and vehicle-specific calibration tables in digital dashboards. IC Role / Device Role / Timing Role: High-speed Quad SPI flash delivering burst reads to graphics controller at >40 MB/s to sustain 60 Hz UI refresh. Use Value: 104 MHz clock + 4-byte addressing supports >100 MB of display assets within single compact WSON package - no board space penalty for dual-die density. |
Use Scenario: Retaining patient-specific therapy parameters, usage logs, and regulatory audit trails in portable infusion pumps. IC Role / Device Role / Timing Role: Secure, long-life data logger with tamper-resistant sector locking and 20+ year data retention at elevated temperatures. Use Value: Three OTP-locked security registers store cryptographic keys; individual sector lock ensures calibration data cannot be overwritten without explicit unlock sequence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial MCP flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M512JVEIQ | Same die, identical specs, but in 16-pin SOIC 300-mil package with dedicated /RESET pin | Requires PCB layout change; suitable where hardware reset assertion is mandatory for safety-critical boot sequencing | Select W25M512JVEIQ only if /RESET pin is required; otherwise W25M512JVCIQ TR saves board area and cost |
| IS25LP512M | 512 M-bit single-die Quad SPI flash (no stacked die); lacks concurrent operations and software die select | Cannot perform read-while-erase; requires external logic or firmware coordination for background updates | Choose IS25LP512M only if concurrent operation is unnecessary and simpler single-die management is preferred |
Compared with W25M512JVEIQ, W25M512JVCIQ TR trades hardware reset for smaller footprint and lower profile; compared with IS25LP512M, it delivers true concurrent die access - enabling zero-downtime firmware updates without external buffering or complex scheduling.
Availability
W25M512JVCIQ TR is available at Aetrix Electronics and suitable for industrial IoT gateways, automotive infotainment head units, and medical diagnostic equipment requiring stable component supply, long-term lifecycle assurance, and compact high-density flash storage.
Supply support for W25M512JVCIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing devices.
The W25M SpiStack® product line was designed to deliver higher density and concurrent operation capability in standard low-pin-count packages - specifically targeting space-constrained embedded systems needing robust, high-throughput non-volatile storage.
FAQ
What is the package type and lead count of W25M512JVCIQ TR?
W25M512JVCIQ TR uses an 8-pad WSON (Wafer-Level Small Outline No-Lead) package measuring 8 mm × 6 mm. It has no external leads - pads are soldered directly to the PCB. This package does not include a /RESET pin; reset functionality is software-controlled only via instructions 66h and 99h.
Does W25M512JVCIQ TR support true concurrent read-while-erase or read-while-program?
Yes, W25M512JVCIQ TR supports true concurrent operations: one die can execute program or erase while the other die services read commands. This is enabled by the SpiStack® architecture and requires explicit software die selection (C2h) before each operation. No suspend/resume is needed, improving effective throughput in firmware update scenarios.
How is die selection implemented in W25M512JVCIQ TR?
Die selection in W25M512JVCIQ TR is performed exclusively via the Software Die Select instruction (C2h), followed by a 1-byte die ID (00h for Die 0, 01h for Die 1). This instruction must be issued before any read, program, or erase command targeting a specific die. There is no hardware die select pin - all control is software-managed.
What is the maximum clock frequency supported by W25M512JVCIQ TR in Quad SPI mode?
W25M512JVCIQ TR supports up to 104 MHz clock frequency in Quad SPI mode, achieving an effective data rate of 416 Mbps (104 MHz × 4 bits). This enables continuous read speeds up to 50 MB/s, verified under standard operating conditions (VCC = 3.0–3.6 V, TA = –40°C to +85°C).
Can W25M512JVCIQ TR be used in place of a standard W25Q256JV?
No - W25M512JVCIQ TR is not a drop-in replacement for W25Q256JV. While it contains two W25Q256JV dies, it requires software die selection (C2h) before every operation and uses different status register behavior due to dual-die coordination. Direct substitution without firmware changes will result in undefined behavior or bus contention.
W25M512JVCIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25M512JVCIQ TR FAQ
1.How can I place an order for W25M512JVCIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M512JVCIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M512JVCIQ TR reliable?
The price and inventory of W25M512JVCIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M512JVCIQ TR is usually 5 days.
3.What payment methods are accepted for W25M512JVCIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M512JVCIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M512JVCIQ TR?
W25M512JVCIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M512JVCIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M512JVCIQ TR?
For technical support, including W25M512JVCIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M512JVCIQ TR requirements.
6.How does Aetrix verify that W25M512JVCIQ TR is sourced from the original manufacturer or authorized distributors?
All W25M512JVCIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M512JVCIQ TR meets industry standards.
7.What is the process for return or replacement of W25M512JVCIQ TR?
All W25M512JVCIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M512JVCIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M512JVCIQ TR part is unused and in its original packaging.
Return procedure for W25M512JVCIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25M512JVCIQ TR Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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