My Inquiry
My Account
Winbond Electronics Corporation W25M512JWBIQ TR
- Part No.:
- W25M512JWBIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M512JWBIQ TR.pdf
- Description:
- IC FLASH 512MBIT SPI 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,173
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25M512JWBIQ TR from Winbond is a 1.8V Serial MCP Flash memory combining two 256M-bit W25Q256JW-IQ die in a single 8-pad WSON 8×6-mm package, supporting concurrent read-while-program/erase operations, 104MHz Quad SPI interface, and 4KB uniform sector architecture for embedded firmware storage and parameter logging.
For engineers reviewing the W25M512JWBIQ TR datasheet, W25M512JWBIQ TR pinout, W25M512JWBIQ TR application, or W25M512JWBIQ TR equivalent, this device enables high-density, low-pin-count flash expansion with independent die access via Software Die Select (C2h), 4-byte addressing, and configurable output drive strength for signal integrity optimization in space-constrained designs.
Technical Context
The W25M512JWBIQ TR implements SpiStack® architecture with two stacked W25Q256JW-IQ dies sharing a single SPI bus (CLK, /CS, IO0–IO3); each die is uniquely addressable via Software Die Select (C2h) and factory-assigned Die ID#, enabling independent program/erase and read operations without bus contention.
It supports three address modes (3-byte default, 4-byte enabled via B7h, persistent via ADP bit), full instruction set compatibility with standard/dual/quad SPI protocols, and concurrent operations including simultaneous die erase and cross-die suspend/resume - all while maintaining JEDEC-compliant SFDP register access and 64-bit unique die ID per stack element.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 M-bit (2 × 256 M-bit) total, organized as two independent 32 MB arrays |
| Interface Speed | 104 MHz clock rate; 208 MB/s dual I/O, 416 MB/s quad I/O effective throughput |
| Page & Sector Size | 256-byte programmable pages; uniform 4 KB sectors enable fine-grained data partitioning |
| Endurance & Retention | ≥100,000 program/erase cycles per sector; ≥20 years data retention at +85°C |
| Supply Voltage | 1.7 V to 1.95 V operation - compatible with modern low-voltage SoCs and PMICs |
| Operating Temp | -40°C to +85°C industrial grade - validated across full voltage and timing margins |
| Security Registers | Three 256-byte OTP-lockable security registers for key storage or firmware binding |
Pinout & Package
W25M512JWBIQ TR is packaged in an 8-pad WSON 8×6-mm (Package Code E) with exposed thermal pad. This compact, lead-free, RoHS-compliant surface-mount package supports reflow soldering and provides optimal thermal performance for high-throughput programming cycles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (/CS) | Chip Select Input | Active-low enable for SPI command decoding; must be held high between transactions to avoid spurious commands |
| 2 (DO / IO1) | Data Output / I/O1 | Primary data output in standard/dual SPI; bidirectional in quad mode; requires pull-up for open-drain compatibility |
| 3 (IO2) | Data Input/Output 2 | Enables dual/quad read/write; unused in standard SPI; must be driven low or terminated during non-quad operation |
| 4 (GND) | Ground Reference | Common return path for VCC and I/O; critical for noise immunity in high-speed SPI signaling |
| 5 (DI / IO0) | Data Input / I/O0 | Primary data input in standard/dual SPI; bidirectional in quad mode; used for all write instructions and status reads |
| 6 (CLK) | Serial Clock Input | Edge-triggered master clock; timing-critical path requiring controlled impedance trace routing |
| 7 (IO3) | Data Input/Output 3 | Enables full quad I/O mode; required for 416 MB/s throughput; must be stable before CLK assertion in fast-read sequences |
| 8 (VCC) | Power Supply | 1.7–1.95 V supply; decoupling capacitor (≥1 µF X5R) required within 3 mm of pin for transient current stability |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Independent die access allows simultaneous read from one die while programming/erasing the other - eliminating wait states in OTA firmware updates |
| Software Die Select (C2h) | Single-byte instruction selects active die without hardware reconfiguration - enables dynamic load balancing across stacked memory banks |
| 4-Byte Address Mode | Persistent 4-byte addressing (via ADP bit) eliminates address wraparound beyond 16 MB - essential for >16 MB firmware images and secure boot partitions |
| Program/Erase Suspend | Interrupt long erase operations (e.g., 64 KB block) to service urgent reads - maintains real-time responsiveness in safety-critical systems |
| Individual Block Lock | Per-sector (4 KB) lock/unlock via 36h/39h instructions - enables granular protection of calibration data, keys, or configuration tables |
| Output Driver Strength | Volatile/non-volatile DRV1/DRV0 bits adjust slew rate and drive current - optimizes signal integrity on long PCB traces or high-capacitance buses |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing field-upgradable firmware and runtime configuration for programmable logic controllers operating in harsh environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with concurrent read-while-erase capability to minimize downtime during firmware patching. Use Value: Enables zero-downtime firmware updates by reading active code from one die while erasing/reprogramming the other - meeting IEC 61131-3 cycle-time requirements. |
Use Scenario: Hosting boot code and sensor calibration data for vision-based driver assistance modules requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with individual sector locking and 20-year data retention at +85°C. Use Value: Prevents unauthorized modification of calibration parameters via per-sector lock bits (36h), while SFDP register ensures deterministic initialization timing for ISO 26262 startup sequences. |
| Medical IoT Sensor Node | Smart Home Gateway |
|
Use Scenario: Logging patient vital sign history and storing encrypted firmware in battery-powered portable diagnostic devices. IC Role / Device Role / Timing Role: Low-power (10 µA standby) flash memory with 1.8 V operation and suspend/resume for energy-efficient data capture. Use Value: Extends battery life via ultra-low standby current and reduces host CPU wake time using fast-read quad I/O (6Ch) for burst data retrieval. |
Use Scenario: Holding Linux kernel, rootfs, and over-the-air update packages in Wi-Fi/Zigbee gateway devices with tight board space constraints. IC Role / Device Role / Timing Role: High-density (512 M-bit) serial flash in 8×6-mm WSON package - replaces dual SOIC devices to save >40% PCB area. Use Value: Delivers 52 MB/s continuous read throughput (via 6Bh) to accelerate boot time and reduce OTA update window - critical for consumer-grade reliability expectations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial MCP flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M512JWMIQ | Same die stack and pinout, but rated for -40°C to +105°C extended temperature range | Required for under-hood automotive or outdoor industrial deployments exceeding +85°C ambient | Select W25M512JWMIQ when thermal environment exceeds +85°C; otherwise W25M512JWBIQ TR suffices for standard industrial use. |
| IS25LP512M | 512 M-bit single-die Quad SPI flash (no stacked die or concurrent ops); supports octal DTR mode up to 200 MHz | Lacks die-select and concurrent read-while-erase; better suited for simpler boot-only applications without firmware update concurrency needs | Choose IS25LP512M only if concurrent operations are unnecessary and octal interface compatibility is prioritized over MCP density efficiency. |
Compared with W25M512JWMIQ, the W25M512JWBIQ TR trades extended temperature tolerance for lower cost and identical functionality in standard industrial conditions; versus IS25LP512M, it delivers true concurrent die access and smaller footprint but lacks octal DTR support - making it superior for OTA-update-intensive embedded systems where space and update latency matter most.
Availability
W25M512JWBIQ TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, medical IoT sensor node logging, and smart home gateway code execution requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W25M512JWBIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND flash, RAM, and trusted computing components since 1987.
The W25M SpiStack® series was designed to deliver high-density serial flash in minimal footprint packages while enabling concurrent operations - specifically targeting space-constrained, firmware-intensive embedded systems needing rapid OTA updates and robust data retention.
FAQ
What is the difference between W25M512JWBIQ TR and W25M512JWMIQ?
The W25M512JWBIQ TR and W25M512JWMIQ share identical electrical specifications, pinout, and feature set except for operating temperature range: W25M512JWBIQ TR is rated for -40°C to +85°C, while W25M512JWMIQ extends to +105°C. Both support concurrent operations, Software Die Select (C2h), and 4-byte addressing. The W25M512JWBIQ TR is optimized for standard industrial applications where ambient temperature remains within the 85°C limit.
Does W25M512JWBIQ TR support hardware reset via /RESET pin?
No, the W25M512JWBIQ TR does not include a /RESET pin. That function is only available on the 16-pin SOIC 300-mil (Package Code F) and TFBGA variants. The W25M512JWBIQ TR uses the 8-pad WSON 8×6-mm package (Package Code E), which omits /RESET; system-level reset must be handled via software reset instructions (66h/99h) or power cycling.
How is die selection implemented in W25M512JWBIQ TR?
Dies in the W25M512JWBIQ TR are selected exclusively via the Software Die Select instruction (C2h), followed by a 1-byte die ID (00h for Die 0, 01h for Die 1). No hardware pins or address lines control die selection. After issuing C2h + ID, all subsequent commands target that die until another C2h instruction is sent. This enables dynamic, runtime-controlled access without PCB layout changes.
Can W25M512JWBIQ TR operate in 4-byte address mode by default?
No, W25M512JWBIQ TR powers up in 3-byte address mode (ADS = 0). To enable 4-byte mode, the Enter 4-Byte Address Mode instruction (B7h) must be issued. For persistence across power cycles, the ADP bit (bit 0 of Status Register-3) must be set non-volatilely using instruction 11h - otherwise, the device reverts to 3-byte mode after reset or power-up.
What is the purpose of the IO2 and IO3 pins on W25M512JWBIQ TR?
On the W25M512JWBIQ TR, IO2 (Pin 3) and IO3 (Pin 7) are dedicated to dual and quad SPI operations. They remain inactive in standard SPI mode (using only DI/DO/CLK/CS). In dual SPI, IO2 is unused; in quad SPI, both IO2 and IO3 carry data during fast-read and page-program sequences. Their presence enables 416 MB/s effective throughput - critical for reducing firmware load time in resource-constrained hosts.
W25M512JWBIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (6x8)
W25M512JWBIQ TR FAQ
1.How can I place an order for W25M512JWBIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M512JWBIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M512JWBIQ TR reliable?
The price and inventory of W25M512JWBIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M512JWBIQ TR is usually 5 days.
3.What payment methods are accepted for W25M512JWBIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M512JWBIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M512JWBIQ TR?
W25M512JWBIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M512JWBIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M512JWBIQ TR?
For technical support, including W25M512JWBIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M512JWBIQ TR requirements.
6.How does Aetrix verify that W25M512JWBIQ TR is sourced from the original manufacturer or authorized distributors?
All W25M512JWBIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M512JWBIQ TR meets industry standards.
7.What is the process for return or replacement of W25M512JWBIQ TR?
All W25M512JWBIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M512JWBIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M512JWBIQ TR part is unused and in its original packaging.
Return procedure for W25M512JWBIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25M512JWBIQ TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
