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Winbond Electronics Corporation W25N01GVTBIG

Part No.:
W25N01GVTBIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25N01GVTBIG.pdf
Description:
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,240

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Product details

Overview

W25N01GVTBIG from Winbond is a 1G-bit (128MB) Serial SLC NAND Flash memory with Dual/Quad SPI interface, organized as 65,536 × 2,048-byte pages and 1,024 × 128KB erasable blocks. It supports 104MHz SPI clock, on-chip 1-bit ECC, hardware/software write protection, and operates from 2.7V–3.6V for embedded code shadowing and data storage in space-constrained systems.

For engineers reviewing the W25N01GVTBIG datasheet, W25N01GVTBIG pinout, W25N01GVTBIG application, or W25N01GVTBIG equivalent, key selection considerations include its default Continuous Read Mode (BUF=0), TFBGA 8x6-mm 24-ball (TB/TC) package, 50MB/s continuous transfer rate, and support for JEDEC ID, Unique ID, and ten 2KB OTP pages.

Technical Context

The W25N01GVTBIG implements a standard SPI-compatible command set extended for Dual/Quad I/O operation, with dedicated /CS, CLK, and bidirectional IO0–IO3 pins enabling up to 416MHz equivalent bandwidth via Fast Read Quad I/O instructions. Its internal architecture includes a 2,048-byte page buffer, configurable ECC engine, and three status registers (SR-1 volatile/OTP-lockable, SR-2 volatile, SR-3 read-only) governing protection, configuration, and real-time error reporting.

It features dual operational modes: Buffer Read (BUF=1) requiring explicit Page Data Read commands, and Continuous Read (BUF=0, default for W25N01GVTBIG), enabling seamless sequential access across the full 1G-bit array without intermediate addressing. Block erase is uniform at 128KB, and bad block management is handled via an on-die Look-Up Table accessible via A5h instruction.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 1G-bit (128M-byte) SLC NAND array - enables high-capacity firmware/data storage in compact footprint.
Interface Dual/Quad SPI with CLK, /CS, IO0–IO3 - supports 104MHz clock, 208/416MHz equivalent bandwidth for fast XIP or streaming.
Read Mode Default Continuous Read (BUF=0) - eliminates need for repeated Page Data Read commands during linear access.
Erase Granularity 128KB uniform block erase (64 pages) - simplifies wear leveling and file system alignment.
ECC On-chip 1-bit ECC per 528-byte sector - corrects single-bit errors transparently; status bits (ECC-1/ECC-0) report correction events.
Endurance & Retention 100,000 program/erase cycles and 10-year data retention - validated with on-chip ECC enabled.
Operating Voltage 2.7V–3.6V single supply - compatible with standard 3.3V logic domains and low-power embedded rails.
Temperature Range –40°C to +85°C - qualified for industrial-grade operation without derating.

Pinout & Package

W25N01GVTBIG uses the 24-ball TFBGA 8x6-mm package (Package Code TB or TC, 5×5 or 6×4 ball array), optimized for high-density PCB layouts. Pin assignments are fixed per ball position and functionally identical between TB and TC variants.

Pin/Terminal Circuit Role Design Meaning
B2 CLK Input: Serial clock synchronizing all SPI transactions; max 104MHz frequency defines throughput ceiling.
C2 /CS Input: Active-low chip select enabling device communication; must transition high→low after power-up to accept commands.
D2 DO (IO1) I/O: Bidirectional data line used for output in Standard/Dual SPI and bidirectional I/O in Quad SPI mode.
D3 DI (IO0) I/O: Bidirectional data line used for input in Standard/Dual SPI and bidirectional I/O in Quad SPI mode.
C4 /WP (IO2) I/O: Dual-function pin - active-low hardware write protect when WP-E=1; otherwise IO2 in Quad SPI or software WP control.
D4 /HOLD (IO3) I/O: Active-low pause signal for Standard/Dual SPI; suspends ongoing reads without deselecting device.
B3 GND Ground reference for all I/O and core logic; requires low-impedance connection for signal integrity.
B4 VCC Power supply input (2.7–3.6V); decoupling capacitor required near ball for stable operation during burst transfers.

Key Features

Feature Design Value
Continuous Read Mode (BUF=0) Enables uninterrupted sequential access across entire memory array using single Read command - reduces host CPU overhead in boot/code-shadowing use cases.
Configurable ECC Engine 1-bit error correction per 528-byte sector with real-time status reporting (ECC-1/ECC-0 bits) - eliminates need for external ECC logic in host controller.
Hardware Write Protection /WP pin disables all program/erase operations when WP-E=1 and /WP grounded - provides tamper-resistant firmware lockdown independent of software state.
Bad Block Management (BBM) On-die Look-Up Table (LUT) stores invalid block addresses; accessed via A5h instruction - simplifies host driver development and improves field reliability.
OTP & Identity Pages Ten 2KB OTP pages plus dedicated 2KB Unique ID and 2KB Parameter pages - supports secure device binding, calibration data storage, and factory configuration.

Applications

Industrial HMI Firmware Storage Edge IoT Sensor Data Logging

Use Scenario: Storing boot firmware and UI assets for touch-based HMIs in factory automation panels.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Dual/Quad SPI interface enabling fast GUI rendering from flash.

Use Value: Continuous Read Mode (BUF=0) allows direct execution of compressed firmware images without buffering, reducing RAM footprint by >30%.

Use Scenario: Local buffering of time-stamped sensor readings (temperature, vibration, humidity) in battery-powered edge nodes.

IC Role / Device Role / Timing Role: High-endurance data logger with 100K P/E cycles and ECC-protected writes ensuring integrity over 5+ years of field deployment.

Use Value: On-chip 1-bit ECC and BBM LUT eliminate host-side error handling complexity, cutting firmware development time by ~2 weeks.

Medical Diagnostic Device Boot Image Smart Meter Firmware Vault

Use Scenario: Secure storage of certified bootloader and application binaries in portable ultrasound and ECG devices.

IC Role / Device Role / Timing Role: Trusted firmware vault with hardware write protection (/WP grounded + WP-E=1) preventing unauthorized updates.

Use Value: OTP pages store cryptographic keys and calibration coefficients; once programmed, they are permanently immutable - meeting IEC 62304 Class C requirements.

Use Scenario: Tamper-resistant storage of metering firmware, tariff tables, and regulatory compliance data in ANSI C12.22-compliant smart meters.

IC Role / Device Role / Timing Role: Long-retention (10-year) non-volatile memory with JEDEC ID and Unique ID for field asset tracking and firmware version control.

Use Value: Dual-mode protection (SRP bits + /WP hardware lock) ensures firmware cannot be overwritten during power glitches or ESD events - critical for revenue-grade accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25N01GVTAIG Same die, SOIC 300-mil (SF) package with 16-pin through-hole footprint; no /HOLD or /WP pins routed - only IO0/IO1 active for Dual SPI. Limited to board-level designs requiring through-hole assembly or legacy socket compatibility; lacks hardware write protection flexibility. Select W25N01GVTAIG only when SOIC mounting is mandatory and /WP-/HOLD functionality is unused.
MT29F1G08ABAEAH4 1G-bit SLC NAND with parallel ONFI 2.3 interface (48-pin TSOP), not SPI - requires dedicated NAND controller, no built-in ECC or BBM. Suitable for high-throughput media controllers but incompatible with SPI microcontrollers; host must implement full NAND management stack. Choose MT29F1G08ABAEAH4 only when migrating from legacy parallel NAND platforms with existing controller IP and layout space for TSOP.

Compared with W25N01GVTBIG, W25N01GVTAIG trades TFBGA density and hardware protection for through-hole manufacturability, while MT29F1G08ABAEAH4 replaces SPI simplicity with higher raw bandwidth at the cost of significant host firmware complexity and no integrated ECC.

Availability

W25N01GVTBIG is available at Aetrix Electronics and suitable for industrial HMI firmware storage, edge IoT sensor data logging, medical diagnostic device boot image storage, and smart meter firmware vault applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for W25N01GVTBIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, PSRAM, and audio codecs, with global manufacturing and quality certifications.

The W25N SpiFlash family was designed specifically to bring NAND density and cost-efficiency to SPI-based microcontroller platforms - eliminating the need for external NAND controllers while retaining robustness for industrial and medical applications.

FAQ

What is the default read mode for W25N01GVTBIG and how does it affect system design?

W25N01GVTBIG powers up in Continuous Read Mode (BUF=0), allowing linear access across the full 1G-bit array with a single Read command - no intermediate Page Data Read instructions required. This reduces host CPU interrupt load and simplifies firmware for boot code shadowing. Unlike Buffer Read Mode (BUF=1), Continuous Read avoids page-boundary stalls, improving effective throughput in streaming applications. The mode is configured via Status Register-2 bit BUF and persists across power cycles.

Does W25N01GVTBIG support Quad SPI operation and what pins are required?

Yes, W25N01GVTBIG fully supports Quad SPI operation using IO0 (DI), IO1 (DO), IO2 (/WP), and IO3 (/HOLD) as bidirectional data lines. All Fast Read Quad I/O instructions (e.g., 6Bh, EBh) are functional when BUF=0 or BUF=1. However, /WP and /HOLD revert to dedicated control functions only in Standard/Dual SPI mode; in Quad SPI, those pins serve exclusively as IO2 and IO3. The TFBGA package exposes all four I/Os on balls D3, D2, C4, and D4 respectively.

How is hardware write protection implemented on W25N01GVTBIG?

Hardware write protection on W25N01GVTBIG is enabled by setting WP-E=1 in Status Register-1 and grounding the /WP pin (C4 ball). When active, this disables all program, erase, and status register write operations - making the entire device read-only, including OTP and Unique ID pages. Quad SPI read commands are also blocked. This mode provides physical tamper resistance independent of software state, critical for certified medical or utility firmware. WP-E is OTP-lockable, preventing accidental reconfiguration after programming.

What ECC capability does W25N01GVTBIG provide and how is it monitored?

W25N01GVTBIG integrates a hardware 1-bit ECC engine correcting single-bit errors per 528-byte sector. ECC status is reported in Status Register-3 bits ECC-1 and ECC-0: '00' = no error, '01' = 1-bit correction applied, '10' = uncorrectable multi-bit error. The LUT-F bit indicates if the BBM Look-Up Table is full. ECC is always active during read operations and requires no host intervention - unlike external ECC solutions, it imposes zero latency penalty and eliminates host-side syndrome calculation.

Can W25N01GVTBIG be used in place of standard SPI NOR flash in existing designs?

W25N01GVTBIG is not a drop-in replacement for SPI NOR flash due to fundamental architectural differences: it uses page-based programming (2KB), block-based erasure (128KB), and requires Bad Block Management. While instruction sets overlap (e.g., 03h Read, 06h Write Enable), NOR-equivalent random-access reads are inefficient. It excels in sequential code shadowing or bulk data logging where NAND's density/cost advantage outweighs erase granularity constraints - but requires NAND-aware firmware and filesystem (e.g., YAFFS2, UBIFS) rather than simple NOR-like memory mapping.

W25N01GVTBIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
7 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25N01GVTBIG FAQ

1.How can I place an order for W25N01GVTBIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N01GVTBIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N01GVTBIG reliable?

The price and inventory of W25N01GVTBIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N01GVTBIG is usually 5 days.

3.What payment methods are accepted for W25N01GVTBIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N01GVTBIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N01GVTBIG?

W25N01GVTBIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N01GVTBIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N01GVTBIG?

For technical support, including W25N01GVTBIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N01GVTBIG requirements.

6.How does Aetrix verify that W25N01GVTBIG is sourced from the original manufacturer or authorized distributors?

All W25N01GVTBIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N01GVTBIG meets industry standards.

7.What is the process for return or replacement of W25N01GVTBIG?

All W25N01GVTBIG units undergo pre-shipment inspection (PSI). If there is an issue with W25N01GVTBIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N01GVTBIG part is unused and in its original packaging.

Return procedure for W25N01GVTBIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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