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Winbond Electronics Corporation W25N01GVTCIG

Part No.:
W25N01GVTCIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25N01GVTCIG.pdf
Description:
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,359

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Product details

Overview

W25N01GVTCIG from Winbond is a 1G-bit Serial SLC NAND Flash memory with Dual/Quad SPI interface, organized as 65,536 × 2,048-byte pages and 1,024 × 128KB erasable blocks. It supports 104MHz SPI clocking (208MHz dual, 416MHz quad), 50MB/s continuous read transfer, on-chip 1-bit ECC, and hardware/software write protection. It is used in embedded boot code storage, firmware update partitions, and industrial HMI data logging.

For engineers reviewing the W25N01GVTCIG datasheet, W25N01GVTCIG pinout, W25N01GVTCIG application, or W25N01GVTCIG equivalent, key selection considerations include BUF-mode default (Buffer Read), TFBGA-24 (6×4) package compatibility, 2.7–3.6V single-supply operation, JEDEC ID support, and OTP page programmability for secure configuration storage.

Technical Context

The W25N01GVTCIG implements a serial NAND architecture with internal 2,048-byte buffer and configurable read mode (BUF=1 default at power-up). It executes standard, dual, and quad SPI instructions-including Fast Read Quad I/O (6Bh/6Ch) and Buffer Read (03h) or Continuous Read (03h with BUF=0)-with full command set compatibility to legacy SPI flash.

Its protection system combines volatile status register bits (BP3–BP0, WP-E, SRP1/SRP0), OTP-lockable registers, and dedicated /WP and /HOLD pins. ECC is implemented on-chip with status reporting via ECC-1/ECC-0 bits in Status Register-3, and bad block management uses a user-accessible LUT via A5h instruction.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 G-bit (128 MB) SLC NAND array, enabling compact firmware storage without external memory controllers.
Interface SupportStandard/Dual/Quad SPI with 104 MHz max CLK; enables 416 MHz effective bandwidth for high-throughput code XIP or streaming.
Read Mode DefaultBuffer Read mode (BUF=1) at power-up-reduces latency for page-aligned reads and simplifies driver initialization.
Erase GranularityUniform 128 KB block erase (64 pages), supporting deterministic wear leveling and predictable update timing.
ECC CapabilityOn-chip 1-bit ECC per 528-byte sector with status reporting-eliminates need for external ECC logic in host MCU.
Endurance & Retention100,000 program/erase cycles and 10-year data retention-validated under SLC operation with on-chip ECC correction.
Operating Voltage2.7 V to 3.6 V single supply-compatible with 3.3 V industrial and automotive power rails without level shifting.
Temperature Range–40°C to +85°C-qualified for extended industrial environments including factory automation and transportation systems.

Pinout & Package

W25N01GVTCIG is packaged in a 24-ball TFBGA 8×6 mm with 6×4 ball array (package code TC), pin-compatible with other W25N01GV variants in same footprint.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; must transition high→low after power-up before accepting commands; controls device standby/active current states.
CLKSerial Clock InputMaster-controlled timing reference for all SPI transfers; supports up to 104 MHz with defined setup/hold margins.
DI (IO0)Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O0 in Dual/Quad modes-carries instructions, addresses, and program data.
DO (IO1)Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O1 in Dual/Quad modes-returns status, IDs, and read data.
/WP (IO2)Write Protect Input / I/O2Hardware lock for Status Register when WP-E=1; functions as I/O2 in Quad SPI when WP-E=0.
/HOLD (IO3)Hold Input / I/O3Pauses ongoing SPI transaction (Standard/Dual only); places DO in high-Z and ignores DI/CLK-enables multi-device bus sharing.
VCCPower Supply2.7–3.6 V main supply; powers core logic, charge pumps, and I/O buffers-requires local 1 µF + 0.1 µF decoupling.
GNDGroundReference return path for all internal circuits and I/O signaling-must be low-impedance and tied to system ground plane.

Key Features

FeatureDesign Value
Continuous Read Mode (BUF=0)Enables linear sequential access across full memory array with single READ command-ideal for boot code shadowing without page boundary management.
Configurable BUF ModeDefault Buffer Read (BUF=1) at power-up ensures fast random access; software-configurable via Status Register-2 bit 5-supports both performance and streaming use cases.
On-Chip 1-Bit ECCCorrects single-bit errors per 528-byte sector in real time-reduces host CPU overhead and eliminates need for external error-handling firmware layers.
OTP Page SupportTen 2 KB one-time-programmable pages store immutable keys, calibration data, or device-specific parameters-enables secure provisioning and anti-counterfeiting.
Bad Block Management (BBM)User-accessible Look-Up Table (LUT) via A5h instruction-allows runtime detection and mapping of factory-invalid or field-worn blocks without vendor-specific tools.
JEDEC ID & Unique IDStandard 3-byte JEDEC ID (EFh, 90h, 1Ah) plus 2 KB unique ID page-supports automated BOM verification, traceability, and secure device authentication.

Applications

Industrial PLC Firmware StorageMedical Device Boot Image

Use Scenario: Storing and executing primary firmware images for programmable logic controllers in factory-floor environments with vibration, EMI, and wide temperature swings.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution via Quad SPI interface with deterministic 128KB block erase for safe over-the-air updates.

Use Value: 100,000 P/E cycles and 10-year retention ensure >15-year field life; on-chip ECC prevents silent corruption in safety-critical control loops.

Use Scenario: Holding certified boot loader and diagnostic firmware in portable ultrasound and infusion pump devices requiring regulatory-compliant data integrity.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for signed firmware images, leveraging OTP pages for cryptographic key injection and BBM for field-failure tracking.

Use Value: Hardware write protection (WP-E=1) disables unauthorized reprogramming; JEDEC + Unique ID enables FDA-mandated device traceability and revision control.

Smart Energy Meter Data LoggingAutomotive ADAS Camera Module

Use Scenario: Recording time-stamped consumption data, tariff schedules, and event logs in utility-grade electricity meters operating unattended for 10+ years.

IC Role / Device Role / Timing Role: High-endurance NAND storage managing cyclic write patterns across 128KB blocks with wear-leveling handled by host MCU using BBM LUT.

Use Value: 128KB uniform erase granularity aligns with meter firmware update partitioning; 2.7–3.6V operation tolerates brown-out conditions during grid instability.

Use Scenario: Storing camera calibration profiles, lens distortion maps, and firmware patches in automotive surround-view systems with ASIL-B functional safety requirements.

IC Role / Device Role / Timing Role: Low-latency, high-reliability configuration memory accessed via Dual SPI during cold boot-ensuring deterministic sensor initialization within <500 ms.

Use Value: Continuous Read Mode (BUF=0) enables rapid loading of 2MB+ calibration tables; –40°C to +85°C rating matches under-hood thermal envelope.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NAND flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Macronix MX35LF1GE4ABSame 1G-bit SLC NAND density, 104MHz SPI, but defaults to Continuous Read (BUF=0); no OTP pages; different JEDEC ID (C2h, 35h, 01h).Lacks OTP and unique ID-unsuitable for secure provisioning; requires host-side ECC if not using built-in BCH engine.Select when cost sensitivity outweighs security needs and BUF=0 behavior simplifies existing driver stack.
Micron MT29F1G01ABAGDWB1G-bit SLC NAND with ONFI 2.3 interface (not SPI); parallel x8 bus; 3.3V only; no /WP or /HOLD pins.Requires dedicated NAND controller and complex Bad Block Management-increases BOM and firmware complexity.Choose only for legacy systems already using parallel NAND infrastructure and where SPI interface is not required.

Compared with MX35LF1GE4AB, W25N01GVTCIG offers OTP pages and hardware write protection for secure boot; versus MT29F1G01ABAGDWB, it eliminates NAND controller dependency and reduces PCB layer count via SPI simplicity-critical for space-constrained modules.

Availability

W25N01GVTCIG is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot image retention, and smart energy meter data logging requiring stable component supply across long production lifecycles.

Supply support for W25N01GVTCIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, Code Storage Flash, and TrustME® secure flash solutions.

The W25N SpiFlash family targets embedded systems needing high-density, SPI-compatible NAND with integrated ECC and simplified management-bridging the gap between NOR flash speed and NAND flash capacity.

FAQ

What is the default read mode for W25N01GVTCIG at power-up?

W25N01GVTCIG powers up in Buffer Read mode (BUF=1) as indicated by the "G" suffix in its part number. This means the device expects Page Data Read (13h) instructions before Read Data (03h) to load page contents into the internal 2,048-byte buffer. The BUF bit is located in Status Register-2 (address Bxh, bit 5) and can be modified via Write Status Register (1Fh) instruction.

Does W25N01GVTCIG support Quad SPI operation with hardware write protection enabled?

No-when WP-E=1 (Hardware Protection mode), W25N01GVTCIG disables all Quad SPI read operations. The /WP pin becomes a dedicated active-low write lock for the entire device, including registers and OTP pages. Quad SPI functionality is only available in Software Protection mode (WP-E=0), where /WP serves as IO2. This restriction is explicitly defined in section 4.3 of the datasheet.

How many OTP pages does W25N01GVTCIG provide, and what is their purpose?

W25N01GVTCIG provides ten 2,048-byte OTP (One-Time Programmable) pages. These pages are used to store immutable data such as cryptographic keys, device-specific calibration coefficients, or firmware signature hashes. Once programmed, OTP pages cannot be erased or rewritten-making them suitable for secure provisioning and anti-cloning applications in regulated industries like medical and automotive.

What package type does W25N01GVTCIG use, and how is it identified in the part number?

W25N01GVTCIG uses a 24-ball TFBGA 8×6 mm package with a 6×4 ball array (package code TC). The "TC" in the suffix "TCIG" directly identifies this variant-"T" denotes TFBGA, "C" specifies the 6×4 configuration, and "IG" indicates industrial temperature grade (–40°C to +85°C) and lead-free RoHS compliance.

Can W25N01GVTCIG be used for Execute-in-Place (XIP) applications?

Yes-W25N01GVTCIG supports XIP via Dual/Quad SPI interfaces with Fast Read Dual/Quad I/O instructions (e.g., BBh, EBh), achieving up to 416 MHz effective bandwidth. Its Continuous Read Mode (BUF=0) further enhances XIP performance by enabling seamless sequential access across page boundaries without repeated Page Data Read commands-reducing latency for boot code execution.

W25N01GVTCIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
7 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25N01GVTCIG FAQ

1.How can I place an order for W25N01GVTCIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N01GVTCIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N01GVTCIG reliable?

The price and inventory of W25N01GVTCIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N01GVTCIG is usually 5 days.

3.What payment methods are accepted for W25N01GVTCIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N01GVTCIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N01GVTCIG?

W25N01GVTCIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N01GVTCIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N01GVTCIG?

For technical support, including W25N01GVTCIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N01GVTCIG requirements.

6.How does Aetrix verify that W25N01GVTCIG is sourced from the original manufacturer or authorized distributors?

All W25N01GVTCIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N01GVTCIG meets industry standards.

7.What is the process for return or replacement of W25N01GVTCIG?

All W25N01GVTCIG units undergo pre-shipment inspection (PSI). If there is an issue with W25N01GVTCIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N01GVTCIG part is unused and in its original packaging.

Return procedure for W25N01GVTCIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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