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Winbond Electronics Corporation W25N01GVZEIT TR

Part No.:
W25N01GVZEIT TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25N01GVZEIT TR.pdf
Description:
IC FLASH 1GBIT SPI 104MHZ 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,674

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Product details

Overview

W25N01GVZEIT TR from Winbond is a 1G-bit (128MB) Serial SLC NAND Flash memory with Dual/Quad SPI interface, organized as 65,536 × 2,048-byte pages and 1,024 × 128KB erasable blocks. It operates from 2.7V to 3.6V, supports up to 104MHz SPI clock (416MHz equivalent in Quad I/O), delivers 50MB/s continuous read throughput, and features on-chip 1-bit ECC for memory array integrity. It is used in embedded boot storage, firmware code shadowing, and data logging where space-constrained SPI-based NAND is required.

For engineers reviewing the W25N01GVZEIT TR datasheet, W25N01GVZEIT TR pinout, W25N01GVZEIT TR application, or W25N01GVZEIT TR equivalent, key selection criteria include its default Continuous Read Mode (BUF=0), WSON-8 package compatibility, hardware/software write protection flexibility, and support for JEDEC ID, Unique ID, and OTP pages - all critical for secure, reliable NAND integration in industrial and automotive control systems.

Technical Context

The W25N01GVZEIT TR implements a dedicated NAND flash controller with integrated buffer management, supporting both Buffer Read (BUF=1) and Continuous Read (BUF=0) modes - the latter enabling seamless sequential access without repeated Page Data Read commands. Its command set includes full Dual/Quad I/O Fast Read variants (e.g., 6Bh/6Ch, EBh/ECh) and block-level erase (D8h), with status registers providing real-time ECC-0/1, P-FAIL/E-FAIL, and BUSY flags.

It uses a 2,048-byte internal page buffer for program operations and supports configurable protection via volatile BP[3:0] bits and OTP-lockable SRP[1:0], WP-E, and SR1-L bits. The /WP and /HOLD pins serve dual roles: dedicated control inputs in Standard/Dual SPI, and IO2/IO3 in Quad SPI - requiring host logic to manage mode-dependent pin behavior.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density1 G-bit (128 M-byte) SLC NAND array, enabling compact firmware storage without parallel bus overhead
Interface SupportStandard/Dual/Quad SPI with 104 MHz max CLK; enables 416 MHz effective bandwidth using Quad I/O instructions
Read Mode DefaultContinuous Read Mode (BUF = 0) at power-up - eliminates inter-command latency for linear code/data fetch
Erase GranularityUniform 128 KB block erase (64 pages per block), simplifying wear leveling and bad-block management
ECC CapabilityOn-chip 1-bit ECC per 528-byte sector, with status bits (ECC-1/ECC-0) reporting correction success/failure
Endurance & Retention≥100,000 program/erase cycles and ≥10-year data retention under industrial temperature conditions
Supply Voltage2.7 V to 3.6 V single supply - compatible with standard 3.3 V I/O domains and low-power MCU interfaces

Pinout & Package

W25N01GVZEIT TR is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252, package code ZE), with exposed thermal pad (non-electrical). Pin assignments are fixed and non-remappable; all signals operate at 3.3 V logic levels with CMOS-compatible drive strength.

Pin/Terminal Circuit Role Design Meaning
/CSChip Select InputActive-low enable: high = standby (10 µA), low = active (25 mA); must transition high→low before instruction acceptance
DO (IO1)Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; high-impedance when /CS high or /HOLD low
/WP (IO2)Write Protect Input / I/O2Hardware lock for Status Register when WP-E=1; otherwise functions as Quad SPI I/O2; requires external pull-up if unused
GNDGround ReferencePrimary return path for VCC and I/O; must be low-inductance connection to minimize noise during fast read/write transitions
DI (IO0)Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for instruction/address/data loading on CLK rising edge
CLKSerial Clock InputMaster-controlled timing reference; supports up to 104 MHz; edge-triggered for all SPI modes
/HOLD (IO3)Hold Input / I/O3Pauses ongoing Standard/Dual SPI transfer when low; becomes Quad SPI I/O3 during Quad operations - must be pulled high externally
VCCPower Supply2.7–3.6 V supply; decoupling capacitor (≥1 µF) required within 5 mm of pin to stabilize during 104 MHz switching

Key Features

Feature Design Value
Continuous Read Mode (BUF=0)Enables uninterrupted sequential access across page boundaries using a single Read command - reduces host CPU overhead by eliminating per-page address reissuance
Configurable Write ProtectionCombines software (BP[3:0], SRP[1:0]) and hardware (/WP pin + WP-E bit) locks - allows selective protection of boot sectors while permitting runtime firmware updates elsewhere
Integrated 1-bit ECC EngineCorrects single-bit errors on-the-fly during read; reports uncorrectable multi-bit errors via ECC-1/ECC-0 status bits - eliminates need for external ECC logic in resource-constrained designs
Bad Block Management (BBM)Supports LUT-based invalid block tracking with A1h/A5h instructions - enables robust field-reliable NAND management without host-side BBM table maintenance
OTP & Unique ID PagesIncludes ten 2KB OTP pages (write-once) and one 2KB Unique ID page - supports secure device binding, calibration data storage, and cryptographic key seeding

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Storing bootloader and OS kernel images in programmable logic controllers operating in harsh environments with wide temperature swings.

IC Role / Device Role / Timing Role: Primary non-volatile boot medium interfaced directly to ARM Cortex-M7 MCU via Quad SPI XIP-capable interface.

Use Value: 128KB uniform block erase and 100K-cycle endurance ensure long-term reliability during frequent firmware updates; Continuous Read Mode accelerates kernel load time by >35% vs. legacy buffer-read NAND.

Use Scenario: Hosting boot code and configuration data for head-unit microcontrollers in vehicles requiring AEC-Q100-compliant components.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for signed firmware images, accessed during cold boot via Dual SPI with hardware write-protection enabled.

Use Value: On-chip 1-bit ECC and OTP pages eliminate external error-correction ICs and provide immutable calibration data storage - reducing BOM count and meeting ISO 26262 ASIL-B requirements.

Medical Diagnostic Device Logging Smart Energy Meter Firmware

Use Scenario: Capturing time-stamped sensor logs and diagnostic snapshots in portable ultrasound equipment with strict power budget constraints.

IC Role / Device Role / Timing Role: Low-power NAND storage managed by an MSP432 host, leveraging standby current of 10 µA and 2.7 V minimum operation.

Use Value: 10-year data retention and -40°C to +85°C rating guarantee log integrity over device lifetime; /HOLD pin enables deterministic pause/resume during concurrent ADC sampling.

Use Scenario: Storing metering firmware and tariff tables in utility-grade smart meters deployed in outdoor enclosures with extended thermal exposure.

IC Role / Device Role / Timing Role: Field-upgradable code storage interfaced to RISC-V SoC via Standard SPI, with /WP pin hardwired to GND for permanent write lock after commissioning.

Use Value: Hardware write protection prevents unauthorized firmware modification; 128KB block granularity aligns with OTA update packet size, minimizing erase overhead during remote upgrades.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NAND flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
Macronix MX35LF1GE4ABSame 1G-bit SLC NAND density, but uses octal DTR interface (not SPI); no /HOLD or /WP pins; requires different controller IPTargeted at high-throughput applications like eMMC replacement; not drop-in SPI-compatibleSelect only if migrating to octal interface and redesigning PCB layout and driver stack
Micron MT29F1G08ABAParallel NAND interface (x8 bus), no SPI support; requires external controller or NAND-aware MCU; lacks on-chip ECC and OTP pagesUsed in legacy systems with NAND controllers; higher pin count and board areaChoose only when existing design already uses parallel NAND infrastructure and cannot adopt serial interface

Compared with MX35LF1GE4AB and MT29F1G08ABA, the W25N01GVZEIT TR provides SPI-native integration, lower pin count, built-in ECC and OTP, and seamless migration path from SPI NOR - making it optimal for new designs prioritizing layout simplicity, security, and firmware agility.

Availability

W25N01GVZEIT TR is available at Aetrix Electronics and suitable for industrial automation, automotive infotainment, and medical diagnostics requiring stable component supply, long-lifecycle assurance, and guaranteed traceability.

Supply support for W25N01GVZEIT TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND, PSRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25N SpiFlash family was designed specifically to bring NAND density and cost-efficiency to SPI-based systems - bridging the gap between NOR's ease-of-use and NAND's storage scalability, with integrated ECC and BBM to simplify system-level NAND management.

FAQ

What is the default read mode for W25N01GVZEIT TR at power-up?

The W25N01GVZEIT TR powers up in Continuous Read Mode (BUF = 0), meaning it executes sequential reads across page boundaries without requiring repeated Page Data Read commands. This behavior is defined in the datasheet revision L and distinguishes it from the W25N01GVZEIG TR variant, which defaults to Buffer Read Mode (BUF = 1). The BUF bit is stored in Configuration Register (Status Register-2) and can be modified via Write Status Register instruction (1Fh).

Does W25N01GVZEIT TR support Quad SPI commands, and what pins are used?

Yes, W25N01GVZEIT TR fully supports Quad SPI commands including Fast Read Quad I/O (EBh/ECh) and Quad Load Program Data (32h/34h). In Quad mode, IO0–IO3 function as bidirectional data lines: DI (IO0), DO (IO1), /WP (IO2), and /HOLD (IO3). Note that /WP and /HOLD lose their control functionality in Quad mode and become dedicated I/O pins - requiring host firmware to manage pin role switching based on selected SPI mode.

How does the on-chip ECC work in W25N01GVZEIT TR, and how is it reported?

The W25N01GVZEIT TR implements a hardware 1-bit ECC engine correcting single-bit errors per 528-byte sector. During read operations, ECC status is reported in Status Register-3 (Cxh) via ECC-1 and ECC-0 bits: 00 = no error, 01 = corrected, 10 = uncorrectable. These bits are cleared automatically on next read or write; they do not require explicit clearing. ECC is always enabled when ECC-E bit = 1 in Configuration Register and cannot be disabled in hardware.

Can W25N01GVZEIT TR be used as a direct replacement for SPI NOR flash in existing designs?

W25N01GVZEIT TR is not a pin-to-pin or functional drop-in replacement for SPI NOR flash due to fundamental differences in command set, erase granularity (128KB blocks vs. 4KB sectors), and lack of execute-in-place (XIP) without host-managed caching. However, it can replace NOR in firmware storage applications where the host MCU implements NAND-aware drivers - especially where >64MB density, lower cost-per-bit, and integrated ECC are priorities over raw random-access speed.

What package type and dimensions does W25N01GVZEIT TR use?

W25N01GVZEIT TR uses the 8-pad WSON (Wafer-Level Small Outline No-Lead) package measuring 8 mm × 6 mm × 0.75 mm (JEDEC MO-252), with package code ZE. It features an exposed thermal pad on the bottom (non-electrical) and complies with RoHS and halogen-free standards. The pinout matches Figure 1a in the datasheet revision L, with /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC arranged in standard counter-clockwise order.

W25N01GVZEIT TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25N01GVZEIT TR FAQ

1.How can I place an order for W25N01GVZEIT TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N01GVZEIT TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N01GVZEIT TR reliable?

The price and inventory of W25N01GVZEIT TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N01GVZEIT TR is usually 5 days.

3.What payment methods are accepted for W25N01GVZEIT TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N01GVZEIT TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N01GVZEIT TR?

W25N01GVZEIT TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N01GVZEIT TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N01GVZEIT TR?

For technical support, including W25N01GVZEIT TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N01GVZEIT TR requirements.

6.How does Aetrix verify that W25N01GVZEIT TR is sourced from the original manufacturer or authorized distributors?

All W25N01GVZEIT TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N01GVZEIT TR meets industry standards.

7.What is the process for return or replacement of W25N01GVZEIT TR?

All W25N01GVZEIT TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N01GVZEIT TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N01GVZEIT TR part is unused and in its original packaging.

Return procedure for W25N01GVZEIT TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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