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Winbond Electronics Corporation W25N01JWTBIG TR
- Part No.:
- W25N01JWTBIG TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N01JWTBIG TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,030
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Product details
Overview
W25N01JWTBIG TR from Winbond is a 1.8V serial SLC NAND flash memory IC with 1G-bit (128MB) capacity, organized as 65,536 × 2,048-byte pages and 1,024 × 128KB erasable blocks. It supports Dual/Quad SPI up to 166MHz STR and 80MHz DTR, delivers 80MB/s continuous read throughput, and features on-chip 1-bit ECC, Bad Block Management, and configurable Buffer/Continuous Read modes. It serves as non-volatile storage for boot code, firmware, and configuration data in space-constrained embedded systems.
For engineers reviewing the W25N01JWTBIG TR datasheet, W25N01JWTBIG TR pinout, W25N01JWTBIG TR application, or W25N01JWTBIG TR equivalent, key selection considerations include its 1.7–1.95V supply range, dual-mode read architecture (BUF=0 vs BUF=1 default), DTR timing compliance, OTP page programmability, and TFBGA-24 / WSON-8 package compatibility with high-density PCB layouts.
Technical Context
The W25N01JWTBIG TR implements a true NAND flash architecture with page-based programming (2,048B/page), block-level erasure (128KB/block), and integrated Bad Block Management via LUT access. Its command set includes standard SPI, Dual/Quad I/O, and DTR variants - all sharing identical instruction opcodes but differing in clock-edge sampling and data lane usage.
It uses volatile and OTP-lockable status/configuration registers (SR1–SR4) to control ECC enablement (ECC-E), read mode (BUF), Quad Enable (QE), DLP activation, and write protection granularity. The device distinguishes itself from legacy SPI NOR by supporting larger density at lower cost per bit while retaining SPI bus simplicity and adding NAND-specific reliability features like cumulative ECC status reporting and deep power-down (10µA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | SLC NAND Flash - enables higher density than SPI NOR at comparable cost, with page/block erase architecture requiring wear leveling in host firmware. |
| Capacity | 1 G-bit (128 MB) - organized as 65,536 pages × 2,048 bytes, supporting firmware image storage or large parameter sets in resource-limited hosts. |
| Interface Speed | 166 MHz STR / 80 MHz DTR - achieves 664 Mbps quad-I/O throughput (166×4) or 160 MB/s DTR read bandwidth with double-edge sampling. |
| Read Mode | Buffer Read (default on G-suffix) or Continuous Read (default on T-suffix) - W25N01JWTBIG TR powers up in Continuous Read mode (BUF=0), enabling single-command linear array access without repeated Page Data Read instructions. |
| ECC & Reliability | On-chip 1-bit ECC per 528-byte sector - corrects single-bit errors transparently; ECC-1/ECC-0 status bits report correction count per read, informing host of marginal block health. |
| Endurance & Retention | 100,000 program/erase cycles, 10-year data retention - validated under JEDEC JESD22-A117 conditions, suitable for industrial firmware update cycles. |
| Supply Voltage | 1.70 V to 1.95 V - tightly regulated 1.8V domain operation reduces noise coupling and simplifies PMIC design versus wider-range alternatives. |
Pinout & Package
W25N01JWTBIG TR is packaged in a 24-ball TFBGA 8×6 mm (package code TB) with 5×5-1 ball array, optimized for high-density routing and thermal dissipation in compact modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select | Active-low enable for SPI command/data transactions; must be deasserted between commands to reset internal state machine. |
| CLK | Serial Clock | Master-generated clock up to 166 MHz; DTR mode samples address/data on both rising and falling edges for doubled effective rate. |
| IO0 | Serial Data I/O (DI/DO) | Primary bidirectional data line for standard SPI; functions as DI in write, DO in read, and shared lane in Dual/Quad modes. |
| IO1 | Serial Data I/O (DO only in Dual) | In Dual SPI, outputs data concurrently with IO0; in Quad mode, carries second data lane for 4-bit-wide transfers. |
| IO2 | Serial Data I/O (/WP function in standard mode) | Default /WP pin in standard SPI; reconfigured as IO2 in Dual/Quad modes - requires SR2.QE=1 and hardware pull-up/down per mode. |
| IO3 | Serial Data I/O (/HOLD function in standard mode) | Default /HOLD pin in standard SPI; reconfigured as IO3 in Quad mode - enables full 4-lane I/O when QE=1 and BUF=0/1 configured. |
| /WP | Write Protect | Hardware lock for status register writes and block protection bits; active-low, requires external pull-up unless used as IO2 in Quad mode. |
| /HOLD | Hold Function | Suspends ongoing SPI transfer without deselecting device; active-low, retains CLK edge count and internal address pointer during pause. |
| /RESET | Hardware Reset | Asynchronous active-low reset that clears internal registers and forces default mode (BUF=0 for T-suffix parts); required after power-up sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode (BUF=0) | Enables single Read (03h) command to stream across multiple pages without reissuing Page Data Read - reduces CPU overhead in code shadowing and sequential firmware load. |
| DTR Command Support | Allows address and data transfer on both clock edges (up to 80 MHz), doubling effective bandwidth over STR-only interfaces without increasing clock frequency or EMI. |
| Configurable ECC Engine | Volatile ECC-E bit enables/disables on-chip correction; status bits (ECC-1/ECC-0) report 0/1/2+ bit corrections per sector, enabling host-driven block retirement decisions. |
| Bad Block Management (BBM) | Host-accessible Look-Up Table (LUT) stores invalid block addresses; A1h/A5h instructions allow dynamic BBM initialization and runtime LUT read - eliminating need for external mapping tables. |
| Ten 2KB OTP Pages | One-time-programmable memory space for secure keys, calibration data, or device-unique identifiers; write-once only, no erase capability - ensures tamper-resistant storage. |
Applications
| Industrial HMI Firmware Storage | Medical Device Configuration Archive |
|---|---|
|
Use Scenario: Storing boot loader, GUI assets, and localized language packs in panel-mounted HMIs with limited PCB area and strict EOL requirements. IC Role / Device Role / Timing Role: Primary non-volatile firmware repository accessed via SPI during cold boot and OTA updates; operates in Continuous Read mode for fast image loading. Use Value: 128MB capacity accommodates multi-language UI bundles; 100K P/E cycles support field firmware upgrades over 10+ years; TFBGA-24 footprint fits tight 4-layer board constraints. |
Use Scenario: Archiving device-specific calibration coefficients, sensor offset tables, and regulatory audit logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure parameter store with OTP pages holding factory-calibrated values; ECC and BBM ensure data integrity across battery-powered operation cycles. Use Value: On-chip 1-bit ECC prevents silent corruption of calibration data; ten 2KB OTP pages provide dedicated, write-once storage for traceable manufacturing records. |
| Automotive ADAS Boot Image | Smart Meter Firmware Vault |
|
Use Scenario: Hosting boot code and safety-critical firmware images for camera-based driver assistance modules operating across -40°C to +105°C. IC Role / Device Role / Timing Role: High-reliability boot memory interfaced to MCU via Quad SPI at 166MHz; uses DTR mode for deterministic 80MB/s read during cold start. Use Value: 10-year data retention and extended temperature rating (-40°C to +105°C) meet AEC-Q100 stress requirements; Continuous Read mode minimizes boot latency. |
Use Scenario: Storing encrypted firmware, tariff tables, and cryptographic keys in utility-grade smart meters deployed in uncontrolled environments. IC Role / Device Role / Timing Role: Tamper-resistant firmware vault leveraging OTP pages for root keys and SRP0/SRP1 OTP lock bits to prevent unauthorized status register modification. Use Value: Power supply lock-down and OTP-configurable write protection prevent malicious firmware overwrite; 1.7–1.95V operation matches low-power meter PMIC rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25N01JWSFIG TR | G-suffix variant: powers up in Buffer Read mode (BUF=1); otherwise identical pinout, timing, and feature set. | Preferred where host firmware expects immediate page-aligned reads without mode switching; requires explicit BUF=0 write to enter Continuous Read. | Select W25N01JWTBIG TR when Continuous Read mode is required at power-up without register initialization; choose W25N01JWSFIG TR if buffer-centric access patterns dominate. |
| MT29F1G08ABAEAH4-IT:E TR | Parallel NAND interface (x8 bus), not SPI; requires NAND controller, external ECC, and more PCB real estate. | Used in high-throughput applications where MCU lacks SPI NAND support but includes dedicated NAND controller (e.g., i.MX6, AM335x). | W25N01JWTBIG TR eliminates NAND controller dependency and reduces BOM count; MT29F1G08ABAEAH4-IT:E suits designs already committed to parallel NAND infrastructure. |
Compared with W25N01JWSFIG TR, W25N01JWTBIG TR offers out-of-reset Continuous Read readiness - reducing boot-time register writes and simplifying initialization. Against MT29F1G08ABAEAH4-IT:E, it trades raw bandwidth for SPI simplicity, integrated ECC, and smaller footprint - ideal for microcontroller-based systems without NAND controllers.
Availability
W25N01JWTBIG TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device configuration archive, automotive ADAS boot image, smart meter firmware vault, and embedded IoT edge node logging requiring stable component supply and long-term manufacturability.
Supply support for W25N01JWTBIG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing devices, serving industrial, automotive, and consumer markets since 1987.
The W25N SpiFlash family was designed to bridge the density gap between SPI NOR and parallel NAND - delivering 1G-bit+ serial NAND with SPI bus simplicity, integrated ECC, and robust firmware storage capabilities for microcontroller-based systems.
FAQ
What is the default read mode for W25N01JWTBIG TR at power-up?
W25N01JWTBIG TR powers up in Continuous Read mode (BUF=0), meaning a single Read (03h) command accesses consecutive pages without requiring intermediate Page Data Read (13h) instructions. This behavior is defined by the 'T' suffix and differs from the 'G' suffix (e.g., W25N01JWSFIG TR), which defaults to Buffer Read mode. The BUF bit is stored in Status Register-2 and can be modified via Write Status Register (1Fh) instruction.
Does W25N01JWTBIG TR support Quad SPI operation, and how is it enabled?
Yes, W25N01JWTBIG TR supports Quad SPI via IO0–IO3 lanes when Quad Enable (QE) bit in Status Register-2 is set to '1'. QE is volatile and must be written after each power cycle or reset. The device also supports Quad I/O Fast Read (6Bh/6Ch) and DTR Quad I/O (6Dh/6Eh) instructions. Hardware pin reconfiguration (IO2/IO3 repurposed from /WP and /HOLD) is required, and pull-up resistors must match mode selection per datasheet Section 4.2.
How does the on-chip ECC work in W25N01JWTBIG TR, and how is its status reported?
W25N01JWTBIG TR includes a hardware 1-bit ECC engine correcting single-bit errors per 528-byte sector. ECC is enabled via the ECC-E bit in Status Register-2. After each read, Status Register-3 reports cumulative correction status in ECC-1/ECC-0 bits: '00' = no correction, '01' = one correction, '10' = two or more corrections (indicating potential block degradation). Host firmware uses this to trigger background refresh or block retirement.
What package type is used for W25N01JWTBIG TR, and what are its key mechanical features?
W25N01JWTBIG TR uses a 24-ball TFBGA 8×6 mm package (package code TB) with a 5×5-1 ball array (missing center ball). It features 0.5 mm ball pitch, 0.35 mm ball diameter, and a 0.85 mm package height - optimized for fine-pitch routing and thermal performance in high-density layouts. This package is distinct from the 8-pad WSON (ZE) and 16-pin SOIC (SF) variants offered in the same family.
Can W25N01JWTBIG TR be used as a direct replacement for SPI NOR flash in existing designs?
W25N01JWTBIG TR is not a drop-in replacement for SPI NOR due to fundamental architectural differences: it requires page-by-page programming, block-level erasure, and host-managed bad block handling. While command opcodes overlap (e.g., 03h Read), NOR-like random access is only approximated via Continuous Read mode. Migration requires firmware updates to implement NAND-specific wear leveling, ECC handling, and BBM - but offers 128MB density in the same TFBGA-24 footprint.
W25N01JWTBIG TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI, DTR
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 6 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N01JWTBIG TR FAQ
1.How can I place an order for W25N01JWTBIG TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N01JWTBIG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N01JWTBIG TR reliable?
The price and inventory of W25N01JWTBIG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N01JWTBIG TR is usually 5 days.
3.What payment methods are accepted for W25N01JWTBIG TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N01JWTBIG TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N01JWTBIG TR?
W25N01JWTBIG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N01JWTBIG TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N01JWTBIG TR?
For technical support, including W25N01JWTBIG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N01JWTBIG TR requirements.
6.How does Aetrix verify that W25N01JWTBIG TR is sourced from the original manufacturer or authorized distributors?
All W25N01JWTBIG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N01JWTBIG TR meets industry standards.
7.What is the process for return or replacement of W25N01JWTBIG TR?
All W25N01JWTBIG TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N01JWTBIG TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N01JWTBIG TR part is unused and in its original packaging.
Return procedure for W25N01JWTBIG TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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