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Winbond Electronics Corporation W25N02JWSFIC

Part No.:
W25N02JWSFIC
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25N02JWSFIC.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,010

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Product details

Overview

W25N02JWSFIC from Winbond is a 1.8V 2G-bit Serial SLC NAND Flash Memory with Dual/Quad SPI interface, supporting up to 166MHz STR and 80MHz DTR operation. It features 128KB uniform block erase, on-chip 1-bit ECC, programmable Buffer/Continuous Read modes, and operates across -40°C to +85°C for embedded storage in space-constrained systems.

For engineers reviewing the W25N02JWSFIC datasheet, W25N02JWSFIC pinout, W25N02JWSFIC application, or W25N02JWSFIC equivalent, key selection criteria include its 2G-bit density, 8-pin WSON 8×6-mm (ZE) package, 100,000 program/erase cycles, JEDEC-compliant ID support, and configurable BUF mode for code shadowing or streaming data access.

Technical Context

The W25N02JWSFIC implements a standard SPI-compatible command set extended for Dual/Quad I/O and DTR operation, enabling high-throughput read transfers up to 80MB/s in Continuous Read Mode. Its internal architecture includes a 2,048-byte page buffer, 128KB erasable blocks (2,048 total), and dedicated status/configuration registers for ECC enable (ECC-E), BUF mode control, and Quad Enable (QE).

It supports hardware write protection via /WP and /HOLD pins, software-controlled block protection (BP3–BP0), OTP lockable registers, and Bad Block Management with LUT access. The device uses DLP (Data Learning Pattern) for DTR timing alignment and provides both volatile and OTP-configurable register bits for system-level reliability tuning.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2G-bit (256M-Byte), organized as 131,072 × 2,048-byte pages
Interface Speed 166MHz STR clock; 80MHz DTR clock - enables 664MB/s quad-I/O peak bandwidth
Erase Granularity Uniform 128KB block erase (2,048 blocks total)
Data Retention 10 years at +85°C - validated under JEDEC JESD22-A117 conditions
Endurance 100,000 program/erase cycles per block - specified with on-chip 1-bit ECC enabled
Supply Voltage 1.70V–1.95V single supply - compatible with low-voltage SoC I/O domains
Operating Temp -40°C to +85°C - qualified per JEDEC JESD22-A104 for industrial use

Pinout & Package

W25N02JWSFIC is packaged in an 8-pad WSON 8×6-mm (Package Code ZE), with wettable flank profile for automated optical inspection. Pin assignments match the W25N01JW family and are fully compatible with standard reflow profiles.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Active-low enable for SPI command latching; must be held low during instruction execution
CLK Serial Clock Input clock for all SPI operations; supports STR (single-edge) and DTR (dual-edge) timing modes
IO0 Serial Data I/O (DI/DO) Primary bidirectional data line; used for standard SPI and first lane of Dual/Quad I/O
IO1 Serial Data I/O (DO only in Dual) Second data lane in Dual/Quad mode; functions as DO in Dual SPI, IO1 in Quad SPI
IO2 Serial Data I/O (/WP in Standard) Third data lane in Quad mode; defaults to /WP input when QE=0
IO3 Serial Data I/O (/HOLD in Standard) Fourth data lane in Quad mode; defaults to /HOLD input when QE=0
/WP Write Protect Hardware pin to inhibit write/erase commands when asserted low (active-low)
/HOLD Hold Control Pauses ongoing serial transfer without deselecting device; maintains CLK sync state

Key Features

Feature Design Value
Continuous Read Mode (BUF=0) Enables seamless sequential access across page boundaries with single Read command - eliminates need for repeated Page Data Read instructions in firmware
Buffer Read Mode (BUF=1) Default power-up mode for W25N02JWSFIC; allows fast random-access reads using internal 2KB page buffer
On-chip 1-bit ECC Corrects single-bit errors per 528-byte sector without host intervention; status bits (ECC-1/ECC-0) report correction events
DTR Command Support Transfers addresses and read data on both clock edges - reduces effective clock period requirement by 2× for timing-critical systems
Bad Block Management (BBM) Hardware-assisted invalid block tracking via LUT; supports A1h/A5h instructions for BBM initialization and lookup
10 × 2KB OTP Pages One-time-programmable memory for secure keys, calibration data, or firmware signatures - accessible only after OTP-E bit is set

Applications

Firmware Storage Industrial HMI Logging

Use Scenario: Storing boot firmware and field-upgradable application binaries in microcontroller-based edge nodes.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read capability for XIP or shadow-load execution.

Use Value: Continuous Read Mode delivers 80MB/s throughput - reducing boot time by >35% vs. legacy SPI NAND requiring page-by-page reads.

Use Scenario: Recording sensor timestamps, alarm events, and operational logs in factory HMIs with limited DRAM.

IC Role / Device Role / Timing Role: High-endurance data logger with wear leveling managed via BBM and configurable ECC.

Use Value: 100,000 P/E cycles and 10-year retention ensure reliable 5+ year deployment in unattended equipment.

Medical Diagnostic Imaging Cache Smart Meter Firmware Vault

Use Scenario: Temporary buffering of compressed ultrasound image frames before transmission to cloud backend.

IC Role / Device Role / Timing Role: High-bandwidth streaming buffer using Quad I/O + DTR for sustained 64MB/s read/write bursts.

Use Value: 166MHz STR + 80MHz DTR interface meets real-time imaging latency requirements while minimizing host CPU overhead.

Use Scenario: Secure storage of meter firmware, cryptographic keys, and regulatory compliance certificates.

IC Role / Device Role / Timing Role: Tamper-resistant vault leveraging OTP pages, SRP-locked status registers, and hardware /WP protection.

Use Value: Ten 2KB OTP pages and OTP-L/SRP bits prevent unauthorized firmware modification or key extraction.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Serial SLC NAND Flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25N01JWSFIC 1G-bit density, identical pinout/package, same BUF/DTR/ECC feature set Lower capacity suits cost-sensitive designs with <128MB firmware footprint Select when 1G-bit capacity suffices and BOM consolidation with W25N02JWSFIC is desired
GD5F2GQ4UCYIGR 2G-bit, 1.8V, but uses ONFI-like command set; no DTR or Continuous Read Mode Lacks BUF/Continuous Read and DTR - requires host-side timing management and page-boundary handling Choose only if existing GD5F driver stack is already deployed and DTR/BUF features are unused

Compared with W25N01JWSFIC, the W25N02JWSFIC doubles density while retaining full pin, command, and feature compatibility; versus GD5F2GQ4UCYIGR, it delivers superior ease-of-use via integrated DTR timing, automatic ECC, and seamless array-wide reads - reducing host firmware complexity and validation effort.

Availability

W25N02JWSFIC is available at Aetrix Electronics and suitable for industrial HMI logging, medical imaging cache, smart meter firmware vault, and embedded boot storage requiring stable component supply and long-term lifecycle assurance.

Supply support for W25N02JWSFIC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global supplier of specialty memory solutions, including SPI NOR/NAND, PSRAM, and mobile DRAM, serving automotive, industrial, and consumer markets since 1987.

The W25N SpiFlash family was designed to bring NAND density and cost-efficiency to SPI-based embedded systems - eliminating external NAND controllers while maintaining pin-count and software compatibility with legacy SPI flash.

FAQ

What is the default BUF mode setting for W25N02JWSFIC at power-up?

The W25N02JWSFIC powers up in Buffer Read Mode (BUF=1) by default, matching the W25N01JWxxxG variant behavior. This mode enables fast random-access reads using the internal 2,048-byte page buffer. To switch to Continuous Read Mode, the host must issue a Write Status Register command (1Fh) to clear the BUF bit (bit 1 of Status Register-2) after power-on initialization.

Does W25N02JWSFIC support Quad SPI operation out of the box?

No - W25N02JWSFIC requires explicit enablement of Quad SPI mode via the Quad Enable (QE) bit (bit 6 of Status Register-2). At power-up, QE=0, so IO2 and IO3 function as /WP and /HOLD. The host must issue a Write Status Register command to set QE=1 before using Quad I/O instructions like 6Bh or EBh.

How does the on-chip ECC in W25N02JWSFIC operate during read operations?

The W25N02JWSFIC performs automatic 1-bit error correction per 528-byte sector during every read. If correction occurs, ECC-1/ECC-0 bits in Status Register-3 are updated; no host action is required. Uncorrectable multi-bit errors trigger E-FAIL or P-FAIL flags. ECC is always active when ECC-E=1 (default at power-up) and cannot be disabled.

Can W25N02JWSFIC be used in place of a standard SPI NOR flash?

W25N02JWSFIC is not a drop-in replacement for SPI NOR flash due to fundamental architectural differences: it requires block-erase before programming, lacks true byte-write capability, and uses different command sequences for erase/program. While pin-compatible with some NOR devices in WSON-8, firmware and driver layers must be redesigned to handle NAND-specific bad-block management and ECC workflows.

What package type does W25N02JWSFIC use, and is it RoHS compliant?

W25N02JWSFIC uses the 8-pad WSON 8×6-mm package (Package Code ZE) with wettable flanks, and is fully RoHS compliant and halogen-free per Winbond's Product Change Notice PCN-2021-001. The package supports standard lead-free reflow profiles and is qualified for industrial temperature operation (-40°C to +85°C).

W25N02JWSFIC Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O, DTR
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
8 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25N02JWSFIC FAQ

1.How can I place an order for W25N02JWSFIC through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N02JWSFIC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N02JWSFIC reliable?

The price and inventory of W25N02JWSFIC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02JWSFIC is usually 5 days.

3.What payment methods are accepted for W25N02JWSFIC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02JWSFIC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N02JWSFIC?

W25N02JWSFIC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N02JWSFIC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N02JWSFIC?

For technical support, including W25N02JWSFIC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02JWSFIC requirements.

6.How does Aetrix verify that W25N02JWSFIC is sourced from the original manufacturer or authorized distributors?

All W25N02JWSFIC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02JWSFIC meets industry standards.

7.What is the process for return or replacement of W25N02JWSFIC?

All W25N02JWSFIC units undergo pre-shipment inspection (PSI). If there is an issue with W25N02JWSFIC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N02JWSFIC part is unused and in its original packaging.

Return procedure for W25N02JWSFIC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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