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Winbond Electronics Corporation W25N02JWSFIF

Part No.:
W25N02JWSFIF
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25N02JWSFIF.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,741

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Product details

Overview

W25N02JWSFIF from Winbond is a 1.8V 2G-bit Serial SLC NAND Flash Memory with Dual/Quad SPI interface, supporting up to 166MHz STR and 80MHz DTR operation. It features 128KB uniform block erase, on-chip 1-bit ECC, programmable write protection, and dual read modes (Buffer Read and Continuous Read). It is used in embedded boot code storage, firmware update partitions, and industrial HMI data logging.

For engineers reviewing the W25N02JWSFIF datasheet, W25N02JWSFIF pinout, W25N02JWSFIF application, or W25N02JWSFIF equivalent, key selection criteria include 2G-bit density, WSON-8 package compatibility, 1.7–1.95V supply range, DTR timing support, and integrated bad block management with LUT access.

Technical Context

The W25N02JWSFIF implements a standard SPI-compatible command set extended for Dual/Quad I/O and DTR operation, with separate instruction tables for Buffer Read (default power-up mode for G-suffix) and Continuous Read (T-suffix). Its architecture organizes 2G-bit memory into 131,072 × 2,048-byte pages across 2,048 erasable 128KB blocks.

It supports volatile and OTP-configurable registers including Status Register-1 (BP bits, WP-E, SRP), Configuration Register (ECC-E, BUF, QE, DLP-E), and Status Register-4 (ODS, HS). ECC status bits (ECC-1/ECC-0) and failure flags (P-FAIL, E-FAIL, BUSY) are exposed via dedicated status registers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2G-bit (256M-byte), organized as 131,072 pages × 2,048 bytes
Interface Speed 166MHz STR clock; 80MHz DTR clock enabling 160MB/s peak read throughput
Erase Unit 128KB uniform block erase (64 pages per block); 2,048 total blocks
ECC Capability On-chip 1-bit error correction per 528-byte sector; ECC status reported in Status Register-3
Operating Voltage 1.70V to 1.95V single supply; 25mA active current, 10µA standby current
Data Retention 10 years at +85°C; endurance rated at 100,000 program/erase cycles with on-chip ECC
Read Modes Buffer Read (default for G-suffix parts) and Continuous Read (single-command full-array access)

Pinout & Package

W25N02JWSFIF is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-241AC, package code ZE), surface-mount, lead-free, RoHS-compliant package with wettable flanks. Pin 1 is marked by a dot; pinout follows standard SPI signal mapping with shared I/O pins.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Active-low enable for SPI command execution; must be low during all serial transfers
CLK Serial Clock Input clock driving STR/DTR timing; max 166MHz frequency; edge-triggered sampling
IO0 Serial Data I/O (DI/DO) Primary bidirectional data line for standard SPI; also serves as DI in Dual/Quad modes
IO1 Serial Data I/O (DO) Output-only in standard SPI; DO in Dual SPI; IO1 in Quad SPI; supports DTR toggling
IO2 Serial Data I/O (/WP) Functions as /WP in standard mode; IO2 in Quad SPI; configurable via Status Register-1
IO3 Serial Data I/O (/HOLD) Functions as /HOLD in standard mode; IO3 in Quad SPI; suspends ongoing read transfer

Key Features

Feature Design Value
Continuous Read Mode Enables full-array sequential access with one Read command-eliminates need for repeated Page Data Read instructions in boot code shadowing
Dual Transfer Rate (DTR) Transfers address and data on both clock edges, doubling effective bandwidth without increasing clock frequency-critical for high-throughput firmware loading
Configurable ECC Enable ECC-E bit in Status Register-2 allows runtime enable/disable of on-chip 1-bit ECC-supports legacy systems requiring raw NAND access
OTP Protection Registers SRP0/SRP1 and BP bits in Status Register-1 can be permanently locked via OTP-prevents accidental or malicious reconfiguration of write protection
Bad Block Management (BBM) Hardware-accelerated BBM with Look-Up Table (LUT) accessible via A5h instruction-reduces host-side overhead in NAND controller firmware

Applications

Industrial PLC Firmware Storage Medical Device Boot Image

Use Scenario: Storing immutable bootloader and FPGA configuration bitstreams in DIN-rail mounted PLCs operating continuously at 60°C ambient.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 166MHz STR read access during cold start; supports DTR for fast field-upgrade downloads.

Use Value: 10-year data retention and 100K P/E cycles ensure reliability over 15+ year product lifecycle without refresh; WSON-8 footprint minimizes PCB area in space-constrained enclosures.

Use Scenario: Holding certified, signed boot images and diagnostic firmware in Class II medical imaging equipment requiring IEC 62304 compliance.

IC Role / Device Role / Timing Role: Secure firmware repository with OTP-lockable protection registers; ECC-E enables verification before execution; Unique ID supports device traceability.

Use Value: On-chip 1-bit ECC and programmable BP bits prevent corruption-induced boot failures; -40°C to +105°C rating covers sterilization and clinical environment extremes.

Smart Energy Meter Data Log Automotive Infotainment OTA Partition

Use Scenario: Logging hourly energy consumption, tariff events, and tamper alerts in ANSI C12.22-compliant meters deployed outdoors for 20 years.

IC Role / Device Role / Timing Role: High-endurance data logger using Continuous Read Mode for rapid retrieval of time-series records; BBM LUT ensures consistent wear leveling across 2,048 blocks.

Use Value: 128KB uniform erase blocks simplify log rotation logic; 10µA standby current extends battery backup life during grid outages.

Use Scenario: Storing encrypted OTA update packages in automotive head units where ASIL-B functional safety requires verified flash integrity.

IC Role / Device Role / Timing Role: Dual-bank update partition supporting atomic swap; DTR Fast Read Quad I/O delivers >120MB/s read speed for sub-30s firmware installs.

Use Value: Hardware ECC and P-FAIL/E-FAIL status bits feed directly into UDS diagnostic routines; JEDEC ID and Unique ID support secure provisioning in production test.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Serial NAND Flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25N01JWSFIF 1G-bit density; identical WSON-8 package (ZE), pinout, and register map; same 166MHz/80MHz timing specs Lower capacity suits cost-sensitive boot loaders or smaller firmware images Select when 128M-byte capacity suffices and BOM cost optimization is prioritized
GD5F2GQ4UCYIGR 2G-bit, 1.8V Serial NAND; supports only STR (no DTR); different command set (GigaDevice-specific); no OTP lock for BP bits Lacks DTR and OTP-locked protection-requires host-side ECC and software write-protection enforcement Choose only if DTR and hardware-based security are not required; verify command compatibility in existing driver stack

Compared with W25N01JWSFIF, the W25N02JWSFIF doubles density while retaining identical package, timing, and feature set-enabling seamless upgrade paths. Against GD5F2GQ4UCYIGR, it provides superior timing performance, hardware ECC control, and OTP-hardened security-critical for safety- or security-critical deployments.

Availability

W25N02JWSFIF is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot image retention, and smart energy meter data logging requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for W25N02JWSFIF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND Flash, RAM, and TrustME® secure memory products.

The W25N SpiFlash family targets embedded systems needing high-density, low-pin-count non-volatile storage with industrial-grade reliability-designed specifically to replace parallel NAND and eMMC in resource-constrained microcontroller-based applications.

FAQ

What is the default read mode for W25N02JWSFIF at power-up?

W25N02JWSFIF powers up in Buffer Read mode (BUF=1), as indicated by its 'G' suffix in the part number. This mode requires explicit Page Data Read (13h) commands between sequential page accesses. The Continuous Read mode (BUF=0) is enabled by writing 0 to the BUF bit in Status Register-2 and is typically used for linear code shadowing.

Does W25N02JWSFIF support Quad SPI and DTR simultaneously?

Yes, W25N02JWSFIF supports Quad SPI I/O with DTR timing-specifically DTR Fast Read Quad I/O (EDh/EEh instructions). In this mode, addresses and read data are transferred on both clock edges across all four I/O lines, achieving up to 640MB/s theoretical bandwidth at 80MHz DTR clock.

How is bad block management implemented in W25N02JWSFIF?

W25N02JWSFIF implements hardware-assisted Bad Block Management (BBM) with a dedicated Look-Up Table (LUT) stored in reserved blocks. The LUT is accessed via the A5h instruction, and BBM operations-including initial invalid block detection and dynamic replacement-are handled internally without host intervention beyond issuing the A1h instruction.

Can the write protection settings on W25N02JWSFIF be permanently locked?

Yes, W25N02JWSFIF allows permanent locking of write protection configuration via OTP bits. The SRP0/SRP1 bits in Status Register-1 control lockability of Block Protect (BP) bits and Write Protection Enable (WP-E); once programmed, these settings cannot be altered-even after power cycles-ensuring tamper-resistant firmware protection.

What package type and dimensions does W25N02JWSFIF use?

W25N02JWSFIF uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC, package code ZE), with 0.5mm pitch, wettable flanks, and RoHS-compliant matte tin plating. Its compact footprint and thermal performance make it suitable for high-density industrial PCBs where space and reflow reliability are critical.

W25N02JWSFIF Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O, DTR
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
8 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25N02JWSFIF FAQ

1.How can I place an order for W25N02JWSFIF through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N02JWSFIF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N02JWSFIF reliable?

The price and inventory of W25N02JWSFIF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02JWSFIF is usually 5 days.

3.What payment methods are accepted for W25N02JWSFIF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02JWSFIF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N02JWSFIF?

W25N02JWSFIF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N02JWSFIF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N02JWSFIF?

For technical support, including W25N02JWSFIF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02JWSFIF requirements.

6.How does Aetrix verify that W25N02JWSFIF is sourced from the original manufacturer or authorized distributors?

All W25N02JWSFIF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02JWSFIF meets industry standards.

7.What is the process for return or replacement of W25N02JWSFIF?

All W25N02JWSFIF units undergo pre-shipment inspection (PSI). If there is an issue with W25N02JWSFIF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N02JWSFIF part is unused and in its original packaging.

Return procedure for W25N02JWSFIF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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