Winbond Electronics Corporation W25N02JWTBIF
- Part No.:
- W25N02JWTBIF
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02JWTBIF.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,784
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25N02JWTBIF from Winbond is a 1.8V 2G-bit Serial SLC NAND Flash Memory with Dual/Quad SPI interface, supporting up to 166MHz STR and 80MHz DTR read modes, 128KB uniform block erase, on-chip 1-bit ECC, and Continuous Read Mode for code shadowing in embedded boot applications.
For engineers reviewing the W25N02JWTBIF datasheet, W25N02JWTBIF pinout, W25N02JWTBIF application, or W25N02JWTBIF equivalent, this device delivers high-density non-volatile storage with SPI-compatible command set, configurable BUF mode (default G/T variant), JEDEC ID support, and OTP page programming capability for firmware integrity and parameter storage.
Technical Context
The W25N02JWTBIF implements a true NAND architecture organized into 131,072 pages of 2,048 bytes each across 2,048 erasable 128KB blocks. It uses standard SPI signaling with optional Dual/Quad I/O and DTR timing to achieve up to 80MB/s continuous data transfer - enabled by internal 2KB buffer and optimized read command flow.
Its functional layer includes volatile and OTP-configurable status registers (SR1–SR4), dedicated Bad Block Management via LUT access (A5h), programmable ECC enable (ECC-E bit), and dual power-up default modes: Buffer Read (xxxG) or Continuous Read (xxxT). The /RESET pin supports hardware reset, while /WP and /HOLD provide hardware write protection and suspend control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256M-byte) SLC NAND array, enabling compact firmware/image storage without external controller |
| Interface Speed | 166MHz STR clock → 332MHz (Dual I/O) or 664MHz (Quad I/O) effective throughput; 80MHz DTR for double-edge address/data transfer |
| Read Mode | Configurable BUF bit selects Buffer Read (default G) or Continuous Read (default T); eliminates page boundary re-issuing in linear access |
| Erase Granularity | Uniform 128KB block erase (64 pages), simplifying wear leveling and file system alignment |
| ECC & Reliability | On-chip 1-bit ECC per 528-byte sector; ECC-1/ECC-0 status bits report correction events; 100,000 P/E cycles, 10-year data retention |
| Power Supply | Single 1.70V–1.95V supply; 25mA active current, 10µA standby - suitable for battery-backed and low-power IoT nodes |
| OTP Capacity | Ten 2,048-byte One-Time-Programmable pages for secure key storage, calibration data, or device-specific configuration |
Pinout & Package
W25N02JWTBIF is packaged in a 24-ball TFBGA 8x6-mm (Package Code TB, 5×5-1 ball array) with 0.5mm pitch, optimized for high-density PCB layouts and thermal performance in space-constrained modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select | Active-low enable for SPI command/address/data transactions; enables multi-device bus sharing |
| CLK | Serial Clock | Master-generated clock up to 166MHz STR or 80MHz DTR; controls all I/O timing edges |
| IO0 | Serial Data I/O (DI/DO) | Primary bidirectional data line for Standard SPI; also used as DI in Dual/Quad modes |
| IO1 | Serial Data I/O (DO) | Secondary bidirectional line for Dual/Quad SPI; functions as DO in Dual Output mode |
| IO2 | Serial Data I/O (/WP) | Third I/O line in Quad mode; doubles as Write Protect input when not used for data |
| IO3 | Serial Data I/O (/HOLD) | Fourth I/O line in Quad mode; doubles as Hold input to pause ongoing read operations |
| /RESET | Hardware Reset | Asynchronous active-low reset that clears internal state and returns to power-on default mode |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode (BUF=0) | Enables single-command linear access across full memory array - critical for XIP-capable boot loaders |
| Dual Transfer Rate (DTR) | Transfers addresses and read data on both clock edges at up to 80MHz, doubling bandwidth vs. STR |
| On-chip 1-bit ECC | Automatically corrects single-bit errors per 528-byte sector; reduces host-side error handling overhead |
| Bad Block Management (BBM) | Hardware-accelerated invalid block tracking via A1h/A5h instructions and LUT access - no host firmware logic required |
| 10 × 2KB OTP Pages | Immutable storage for cryptographic keys, serial numbers, or factory calibration data - immune to field reprogramming |
Applications
| Industrial HMI Boot Storage | Edge AI Sensor Firmware |
|---|---|
|
Use Scenario: Storing boot firmware and UI assets for ARM Cortex-A/M-based HMIs with limited PCB area. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed via SPI during cold boot and firmware updates. Use Value: Continuous Read Mode enables fast sequential load of 2MB+ kernel images without page boundary stalls; 2G-bit density replaces multiple smaller SPI flash devices. |
Use Scenario: Hosting inference model weights and sensor calibration tables in battery-powered edge nodes. IC Role / Device Role / Timing Role: Persistent storage for immutable firmware and runtime-configurable parameters using OTP and SR2 register control. Use Value: On-chip ECC ensures data integrity over 10+ years of field operation; DTR read mode sustains >60MB/s throughput for real-time model streaming. |
| Medical Diagnostic Module | Automotive Telematics Log |
|
Use Scenario: Secure storage of FDA-compliant diagnostic logs and calibration history in portable ultrasound units. IC Role / Device Role / Timing Role: Trusted storage with hardware write protection (/WP pin + SRP bits) and tamper-evident OTP pages. Use Value: Ten 2KB OTP pages store unique device IDs and audit trails; 100K P/E cycles support daily log rotation over 27 years. |
Use Scenario: Recording CAN bus diagnostics and GPS telemetry in automotive telematics gateways operating at -40°C to +105°C. IC Role / Device Role / Timing Role: High-reliability logging medium with temperature-rated endurance and ECC-protected writes. Use Value: 1.8V operation and -40°C to +105°C rating ensure stable performance under engine bay thermal stress; BBM prevents corrupted log entries from bad blocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Serial NAND Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25N01JWTBIF | 1G-bit density (half capacity); identical package, pinout, and command set; same 166MHz/80MHz speed grades | Suitable where firmware image size ≤128MB; lower cost and power in resource-constrained designs | Select W25N01JWTBIF when 1G-bit suffices and BOM cost optimization is prioritized over future-proofing |
| MT29F2G01ABAGDWB-IT | 2G-bit SLC NAND with ONFI 2.3 interface (not SPI); requires NAND controller; no built-in ECC or BBM | Used in systems with dedicated NAND controllers (e.g., i.MX6/8, AM335x); higher raw bandwidth but greater host complexity | Choose MT29F2G01ABAGDWB-IT only if existing platform already supports ONFI NAND and host handles ECC/BBM |
Compared with W25N01JWTBIF, W25N02JWTBIF doubles storage for larger firmware or dual-image redundancy; versus MT29F2G01ABAGDWB-IT, it eliminates NAND controller dependency and integrates ECC/BBM - reducing BOM count and qualification effort.
Availability
W25N02JWTBIF is available at Aetrix Electronics and suitable for industrial HMI boot storage, edge AI sensor firmware, medical diagnostic logging, and automotive telematics requiring stable component supply across long-lifecycle programs.
Supply support for W25N02JWTBIF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs since 1987.
The W25N SpiFlash family was designed to bring enterprise-grade NAND reliability and density to SPI-based microcontroller platforms - eliminating external NAND controllers while retaining SLC endurance and ECC robustness.
FAQ
What is the default read mode for W25N02JWTBIF after power-up?
W25N02JWTBIF defaults to Buffer Read Mode (BUF = 1) after power-up, matching the 'G' suffix designation. This mode requires explicit Page Data Read (13h) commands between sequential reads. To enable Continuous Read Mode, the BUF bit in Status Register-2 must be cleared to 0 using the Write Status Register instruction (1Fh).
Does W25N02JWTBIF support Quad SPI and DTR simultaneously?
Yes, W25N02JWTBIF supports Quad I/O with DTR timing - specifically Fast Read Quad I/O with DTR (EDh/EEh instructions). This combination achieves up to 80MHz clock frequency with data transferred on both rising and falling edges, delivering up to 80MB/s sustained read throughput in Continuous Read Mode.
How is bad block management handled in W25N02JWTBIF?
W25N02JWTBIF implements hardware-assisted Bad Block Management using an internal Look-Up Table (LUT). The A1h instruction marks blocks as invalid, and A5h reads the LUT contents. No host software algorithm is required - the device automatically skips invalid blocks during read/write/erase operations.
Can the ten OTP pages in W25N02JWTBIF be erased or rewritten?
No, the ten 2,048-byte OTP pages in W25N02JWTBIF are one-time programmable and cannot be erased or rewritten after initial programming. Once written, their contents are permanent and protected by OTP lock bits (OTP-L and SR1-L), making them suitable for secure keys, calibration data, or device identifiers.
What is the significance of the 'TB' in W25N02JWTBIF?
The 'TB' in W25N02JWTBIF denotes the 24-ball TFBGA 8x6-mm package (Package Code TB) with 5×5-1 ball array and 0.5mm pitch. This package provides superior thermal dissipation and board-level reliability compared to SOIC or WSON variants, especially in high-temperature or vibration-prone environments.
W25N02JWTBIF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O, DTR
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02JWTBIF FAQ
1.How can I place an order for W25N02JWTBIF through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02JWTBIF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02JWTBIF reliable?
The price and inventory of W25N02JWTBIF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02JWTBIF is usually 5 days.
3.What payment methods are accepted for W25N02JWTBIF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02JWTBIF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02JWTBIF?
W25N02JWTBIF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02JWTBIF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02JWTBIF?
For technical support, including W25N02JWTBIF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02JWTBIF requirements.
6.How does Aetrix verify that W25N02JWTBIF is sourced from the original manufacturer or authorized distributors?
All W25N02JWTBIF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02JWTBIF meets industry standards.
7.What is the process for return or replacement of W25N02JWTBIF?
All W25N02JWTBIF units undergo pre-shipment inspection (PSI). If there is an issue with W25N02JWTBIF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02JWTBIF part is unused and in its original packaging.
Return procedure for W25N02JWTBIF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25N02JWTBIF Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

