Winbond Electronics Corporation W25N02KVTBIR TR
- Part No.:
- W25N02KVTBIR TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KVTBIR TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,771
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25N02KVTBIR TR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and 128KB uniform block erase. It operates from 2.7V–3.6V, draws 25mA active current, and targets embedded code storage and data logging in space-constrained industrial controllers.
For engineers reviewing the W25N02KVTBIR TR datasheet, W25N02KVTBIR TR pinout, W25N02KVTBIR TR application, or W25N02KVTBIR TR equivalent, key selection considerations include its TFBGA-24 (8×6mm, 5×5 ball array) package, buffer/sequential read modes, hardware/software write protection, and JEDEC-compliant ID support for system-level firmware validation.
Technical Context
The W25N02KVTBIR TR implements a QspiNAND architecture with unified 2,048-byte pages across 131,072 pages and 2,048 erasable 128KB blocks. Its dual-mode read interface supports both Buffer Read (BUF=1) and Sequential Read (BUF=0), enabling single-command full-array access without address reissuing.
It integrates configurable registers including Protection Register (SR-1), Configuration Register (SR-2), and Status Register-3, with volatile and OTP-lockable bits for BP[3:0], WP-E, ECC-E, BUF, and H-DIS. Internal ECC operates at 8-bit correction per 512-byte sector and reports bit-flip status via BFD/BFS/BFR registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256M-byte) SLC NAND array organized as 131,072 × 2,048-byte pages |
| Interface Support | Standard/Dual/Quad SPI with up to 104MHz CLK; 208MHz (Dual I/O) / 416MHz (Quad I/O) effective throughput |
| Data Transfer Rate | 50MB/s sequential read speed using Fast Read Quad I/O instructions |
| Erase/Program Endurance | 60,000 program/erase cycles per block, with 10-year data retention at +85°C |
| Power Supply | Single 2.7V–3.6V supply; 25mA active, 10µA standby, 1µA deep power-down current |
| ECC Capability | On-chip 8-bit error correction per 512-byte sector; real-time status reporting via ECC-1/ECC-0 and BFR registers |
| Operating Temperature | -40°C to +85°C industrial grade range, qualified per JEDEC JESD22-A104 |
Pinout & Package
W25N02KVTBIR TR uses a 24-ball TFBGA 8×6-mm package (Package Code TB, 5×5 ball array) with 0.8mm ball pitch. Pin assignments follow JEDEC MO-276AA standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable signal; high-impedance DO and low-power standby when high |
| CLK | Serial Clock Input | Timing reference for all SPI operations; rising edge for input, falling edge for output |
| DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O0 in Dual/Quad SPI |
| DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O1 in Dual/Quad SPI |
| /WP (IO2) | Write Protect Input / I/O2 | Hardware lock for SR-1 or entire device when WP-E=1; functions as I/O2 in Quad SPI when WP-E=0 |
| /HOLD (IO3) | Hold Input / I/O3 | Pauses Standard/Dual SPI transfers when low; serves as I/O3 in Quad SPI mode |
| VCC | Power Supply | 2.7V–3.6V main supply; powers internal charge pump and logic |
| GND | Ground | Reference return path for all I/O and core circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Sequential Read Mode | Enables full-memory linear access with one READ command (BUF=0), eliminating address overhead in streaming applications |
| Configurable ECC Enable | ECC-E bit in SR-2 allows runtime activation/deactivation of on-chip 8-bit correction, balancing reliability vs. latency |
| Dual Protection Architecture | Combines software-controlled BP[3:0] bits and hardware /WP pin with OTP-lockable WP-E and SRP[1:0] for layered security |
| OTP Page Allocation | Ten 2KB One-Time-Programmable pages for secure boot keys, calibration data, or device-specific configuration |
| Deep Power-Down Mode | B9h instruction reduces current to 1µA; ABh wakes device with <100µs recovery time for ultra-low-power sleep states |
Applications
| Industrial PLC Firmware Storage | Medical Device Data Logging |
|---|---|
|
Use Scenario: Storing firmware images and field-upgradeable application binaries in programmable logic controllers with limited PCB area. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Dual/Quad SPI interface for fast boot and runtime execution. Use Value: 50MB/s sequential read enables sub-second firmware load; 128KB uniform erase simplifies OTA update partitioning. |
Use Scenario: Capturing timestamped sensor waveforms and diagnostic logs in portable ultrasound or ECG units. IC Role / Device Role / Timing Role: High-reliability data sink with on-chip ECC and 60k-cycle endurance for cyclic buffer writes. Use Value: 8-bit ECC ensures integrity of critical patient data; 1µA deep power-down extends battery life between acquisitions. |
| Smart Meter Firmware & Tariff Tables | Automotive Infotainment Boot Memory |
|
Use Scenario: Holding metrology firmware, tariff schedules, and tamper-event logs in ANSI C12.22-compliant electricity meters. IC Role / Device Role / Timing Role: Secure, long-retention storage with hardware write-protection (/WP pin + OTP lock) against unauthorized reprogramming. Use Value: WP-E=1 disables all writes permanently after provisioning; 10-year retention meets utility-grade certification requirements. |
Use Scenario: Booting Linux kernel and root filesystem in automotive head units requiring AEC-Q100 Grade 3 compliance. IC Role / Device Role / Timing Role: Primary boot memory interfaced via Quad SPI to SoC's memory-mapped controller for fast cold start. Use Value: 104MHz Quad SPI clock delivers >400MB/s effective bandwidth; -40°C to +85°C operation satisfies under-hood thermal specs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QspiNAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25N02KVTCIR TR | Same die, identical specs, but in 24-ball TFBGA 8×6-mm with 6×4 ball array (Package Code TC) | No functional difference; differs only in PCB layout compatibility due to ball grid orientation | Select W25N02KVTCIR TR only if board stack-up or routing constraints favor 6×4 footprint over 5×5. |
| MT29F2G08ABAEAH4-IT:E TR | 2G-bit SLC NAND with ONFI 3.2 interface, parallel x8 bus, no integrated SPI controller or on-die ECC | Requires external SPI-to-NAND bridge IC and external ECC engine; higher pin count and board area | Choose MT29F2G08ABAEAH4-IT:E TR only when legacy NAND controller IP exists and SPI simplicity is not required. |
Compared with W25N02KVTBIR TR, W25N02KVTCIR TR offers identical functionality in an alternate TFBGA layout, while MT29F2G08ABAEAH4-IT:E TR demands additional controller logic and external ECC management-making W25N02KVTBIR TR the optimal choice for SPI-native, space-constrained designs needing integrated reliability features.
Availability
W25N02KVTBIR TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device data logging, smart meter tariff table retention, and automotive infotainment boot memory requiring stable component supply across multi-year production cycles.
Supply support for W25N02KVTBIR TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, Flash memory, and mobile chips, with global R&D and manufacturing facilities.
The W25N QspiNAND product line was designed to replace parallel NAND in SPI-constrained systems, delivering NAND density with SPI simplicity, integrated ECC, and industrial temperature support for embedded code and data storage.
FAQ
What is the package type and pin count of the W25N02KVTBIR TR?
The W25N02KVTBIR TR uses a 24-ball TFBGA package measuring 8mm × 6mm with a 5×5 ball array (Package Code TB). It has eight functional terminals: /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), /HOLD (IO3), VCC, and GND - all defined in the official Winbond datasheet Revision G, Section 3.3 and Figure 1b.
Does the W25N02KVTBIR TR support Quad SPI commands and what is the maximum clock frequency?
Yes, the W25N02KVTBIR TR fully supports Quad SPI operation using IO0–IO3 pins and achieves up to 104MHz clock frequency. When using Fast Read Quad I/O instructions, this yields an effective data rate of 416MHz (104MHz × 4), enabling 50MB/s sequential read throughput as verified in Section 2 and Table 9.6 of the datasheet.
How does the on-chip ECC work in the W25N02KVTBIR TR and can it be disabled?
The W25N02KVTBIR TR includes an 8-bit ECC engine that corrects errors per 512-byte sector. Its operation is controlled by the ECC-E bit (bit 4) in Status Register-2 (SR-2); setting ECC-E=0 disables ECC, while ECC-E=1 enables it. ECC status is reported via ECC-1/ECC-0 bits in SR-3 and detailed bit-flip counters in BFR/MBF registers.
What is the difference between Buffer Read and Sequential Read modes in the W25N02KVTBIR TR?
Buffer Read mode (BUF=1) loads one 2,048-byte page into the internal buffer for random access reads; Sequential Read mode (BUF=0) allows continuous read across multiple pages with a single READ command and auto-incrementing address. The mode is selected via the BUF bit (bit 0) in SR-2 and affects instruction behavior per Tables 8.1.1–8.1.2.
Is the W25N02KVTBIR TR compatible with standard SPI flash controllers or does it require special drivers?
The W25N02KVTBIR TR supports standard SPI commands (e.g., 03h Read Data, 06h Write Enable) but requires driver-level support for QspiNAND-specific features: 128KB block erase (D8h), parameter page access (OTP-E=1), and ECC status interpretation. It is not drop-in compatible with legacy SPI NOR flash without firmware adaptation.
W25N02KVTBIR TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KVTBIR TR FAQ
1.How can I place an order for W25N02KVTBIR TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KVTBIR TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KVTBIR TR reliable?
The price and inventory of W25N02KVTBIR TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVTBIR TR is usually 5 days.
3.What payment methods are accepted for W25N02KVTBIR TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVTBIR TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KVTBIR TR?
W25N02KVTBIR TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KVTBIR TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KVTBIR TR?
For technical support, including W25N02KVTBIR TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVTBIR TR requirements.
6.How does Aetrix verify that W25N02KVTBIR TR is sourced from the original manufacturer or authorized distributors?
All W25N02KVTBIR TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVTBIR TR meets industry standards.
7.What is the process for return or replacement of W25N02KVTBIR TR?
All W25N02KVTBIR TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVTBIR TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KVTBIR TR part is unused and in its original packaging.
Return procedure for W25N02KVTBIR TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25N02KVTBIR TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

