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Winbond Electronics Corporation W25N02KVTBIR TR

Part No.:
W25N02KVTBIR TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25N02KVTBIR TR.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,771

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Product details

Overview

W25N02KVTBIR TR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and 128KB uniform block erase. It operates from 2.7V–3.6V, draws 25mA active current, and targets embedded code storage and data logging in space-constrained industrial controllers.

For engineers reviewing the W25N02KVTBIR TR datasheet, W25N02KVTBIR TR pinout, W25N02KVTBIR TR application, or W25N02KVTBIR TR equivalent, key selection considerations include its TFBGA-24 (8×6mm, 5×5 ball array) package, buffer/sequential read modes, hardware/software write protection, and JEDEC-compliant ID support for system-level firmware validation.

Technical Context

The W25N02KVTBIR TR implements a QspiNAND architecture with unified 2,048-byte pages across 131,072 pages and 2,048 erasable 128KB blocks. Its dual-mode read interface supports both Buffer Read (BUF=1) and Sequential Read (BUF=0), enabling single-command full-array access without address reissuing.

It integrates configurable registers including Protection Register (SR-1), Configuration Register (SR-2), and Status Register-3, with volatile and OTP-lockable bits for BP[3:0], WP-E, ECC-E, BUF, and H-DIS. Internal ECC operates at 8-bit correction per 512-byte sector and reports bit-flip status via BFD/BFS/BFR registers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2G-bit (256M-byte) SLC NAND array organized as 131,072 × 2,048-byte pages
Interface Support Standard/Dual/Quad SPI with up to 104MHz CLK; 208MHz (Dual I/O) / 416MHz (Quad I/O) effective throughput
Data Transfer Rate 50MB/s sequential read speed using Fast Read Quad I/O instructions
Erase/Program Endurance 60,000 program/erase cycles per block, with 10-year data retention at +85°C
Power Supply Single 2.7V–3.6V supply; 25mA active, 10µA standby, 1µA deep power-down current
ECC Capability On-chip 8-bit error correction per 512-byte sector; real-time status reporting via ECC-1/ECC-0 and BFR registers
Operating Temperature -40°C to +85°C industrial grade range, qualified per JEDEC JESD22-A104

Pinout & Package

W25N02KVTBIR TR uses a 24-ball TFBGA 8×6-mm package (Package Code TB, 5×5 ball array) with 0.8mm ball pitch. Pin assignments follow JEDEC MO-276AA standard.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable signal; high-impedance DO and low-power standby when high
CLK Serial Clock Input Timing reference for all SPI operations; rising edge for input, falling edge for output
DI (IO0) Data Input / I/O0 Unidirectional input in Standard SPI; bidirectional I/O0 in Dual/Quad SPI
DO (IO1) Data Output / I/O1 Unidirectional output in Standard SPI; bidirectional I/O1 in Dual/Quad SPI
/WP (IO2) Write Protect Input / I/O2 Hardware lock for SR-1 or entire device when WP-E=1; functions as I/O2 in Quad SPI when WP-E=0
/HOLD (IO3) Hold Input / I/O3 Pauses Standard/Dual SPI transfers when low; serves as I/O3 in Quad SPI mode
VCC Power Supply 2.7V–3.6V main supply; powers internal charge pump and logic
GND Ground Reference return path for all I/O and core circuitry

Key Features

Feature Design Value
Sequential Read Mode Enables full-memory linear access with one READ command (BUF=0), eliminating address overhead in streaming applications
Configurable ECC Enable ECC-E bit in SR-2 allows runtime activation/deactivation of on-chip 8-bit correction, balancing reliability vs. latency
Dual Protection Architecture Combines software-controlled BP[3:0] bits and hardware /WP pin with OTP-lockable WP-E and SRP[1:0] for layered security
OTP Page Allocation Ten 2KB One-Time-Programmable pages for secure boot keys, calibration data, or device-specific configuration
Deep Power-Down Mode B9h instruction reduces current to 1µA; ABh wakes device with <100µs recovery time for ultra-low-power sleep states

Applications

Industrial PLC Firmware Storage Medical Device Data Logging

Use Scenario: Storing firmware images and field-upgradeable application binaries in programmable logic controllers with limited PCB area.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Dual/Quad SPI interface for fast boot and runtime execution.

Use Value: 50MB/s sequential read enables sub-second firmware load; 128KB uniform erase simplifies OTA update partitioning.

Use Scenario: Capturing timestamped sensor waveforms and diagnostic logs in portable ultrasound or ECG units.

IC Role / Device Role / Timing Role: High-reliability data sink with on-chip ECC and 60k-cycle endurance for cyclic buffer writes.

Use Value: 8-bit ECC ensures integrity of critical patient data; 1µA deep power-down extends battery life between acquisitions.

Smart Meter Firmware & Tariff Tables Automotive Infotainment Boot Memory

Use Scenario: Holding metrology firmware, tariff schedules, and tamper-event logs in ANSI C12.22-compliant electricity meters.

IC Role / Device Role / Timing Role: Secure, long-retention storage with hardware write-protection (/WP pin + OTP lock) against unauthorized reprogramming.

Use Value: WP-E=1 disables all writes permanently after provisioning; 10-year retention meets utility-grade certification requirements.

Use Scenario: Booting Linux kernel and root filesystem in automotive head units requiring AEC-Q100 Grade 3 compliance.

IC Role / Device Role / Timing Role: Primary boot memory interfaced via Quad SPI to SoC's memory-mapped controller for fast cold start.

Use Value: 104MHz Quad SPI clock delivers >400MB/s effective bandwidth; -40°C to +85°C operation satisfies under-hood thermal specs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QspiNAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25N02KVTCIR TR Same die, identical specs, but in 24-ball TFBGA 8×6-mm with 6×4 ball array (Package Code TC) No functional difference; differs only in PCB layout compatibility due to ball grid orientation Select W25N02KVTCIR TR only if board stack-up or routing constraints favor 6×4 footprint over 5×5.
MT29F2G08ABAEAH4-IT:E TR 2G-bit SLC NAND with ONFI 3.2 interface, parallel x8 bus, no integrated SPI controller or on-die ECC Requires external SPI-to-NAND bridge IC and external ECC engine; higher pin count and board area Choose MT29F2G08ABAEAH4-IT:E TR only when legacy NAND controller IP exists and SPI simplicity is not required.

Compared with W25N02KVTBIR TR, W25N02KVTCIR TR offers identical functionality in an alternate TFBGA layout, while MT29F2G08ABAEAH4-IT:E TR demands additional controller logic and external ECC management-making W25N02KVTBIR TR the optimal choice for SPI-native, space-constrained designs needing integrated reliability features.

Availability

W25N02KVTBIR TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device data logging, smart meter tariff table retention, and automotive infotainment boot memory requiring stable component supply across multi-year production cycles.

Supply support for W25N02KVTBIR TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, Flash memory, and mobile chips, with global R&D and manufacturing facilities.

The W25N QspiNAND product line was designed to replace parallel NAND in SPI-constrained systems, delivering NAND density with SPI simplicity, integrated ECC, and industrial temperature support for embedded code and data storage.

FAQ

What is the package type and pin count of the W25N02KVTBIR TR?

The W25N02KVTBIR TR uses a 24-ball TFBGA package measuring 8mm × 6mm with a 5×5 ball array (Package Code TB). It has eight functional terminals: /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), /HOLD (IO3), VCC, and GND - all defined in the official Winbond datasheet Revision G, Section 3.3 and Figure 1b.

Does the W25N02KVTBIR TR support Quad SPI commands and what is the maximum clock frequency?

Yes, the W25N02KVTBIR TR fully supports Quad SPI operation using IO0–IO3 pins and achieves up to 104MHz clock frequency. When using Fast Read Quad I/O instructions, this yields an effective data rate of 416MHz (104MHz × 4), enabling 50MB/s sequential read throughput as verified in Section 2 and Table 9.6 of the datasheet.

How does the on-chip ECC work in the W25N02KVTBIR TR and can it be disabled?

The W25N02KVTBIR TR includes an 8-bit ECC engine that corrects errors per 512-byte sector. Its operation is controlled by the ECC-E bit (bit 4) in Status Register-2 (SR-2); setting ECC-E=0 disables ECC, while ECC-E=1 enables it. ECC status is reported via ECC-1/ECC-0 bits in SR-3 and detailed bit-flip counters in BFR/MBF registers.

What is the difference between Buffer Read and Sequential Read modes in the W25N02KVTBIR TR?

Buffer Read mode (BUF=1) loads one 2,048-byte page into the internal buffer for random access reads; Sequential Read mode (BUF=0) allows continuous read across multiple pages with a single READ command and auto-incrementing address. The mode is selected via the BUF bit (bit 0) in SR-2 and affects instruction behavior per Tables 8.1.1–8.1.2.

Is the W25N02KVTBIR TR compatible with standard SPI flash controllers or does it require special drivers?

The W25N02KVTBIR TR supports standard SPI commands (e.g., 03h Read Data, 06h Write Enable) but requires driver-level support for QspiNAND-specific features: 128KB block erase (D8h), parameter page access (OTP-E=1), and ECC status interpretation. It is not drop-in compatible with legacy SPI NOR flash without firmware adaptation.

W25N02KVTBIR TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
7 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25N02KVTBIR TR FAQ

1.How can I place an order for W25N02KVTBIR TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N02KVTBIR TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N02KVTBIR TR reliable?

The price and inventory of W25N02KVTBIR TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVTBIR TR is usually 5 days.

3.What payment methods are accepted for W25N02KVTBIR TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVTBIR TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N02KVTBIR TR?

W25N02KVTBIR TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N02KVTBIR TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N02KVTBIR TR?

For technical support, including W25N02KVTBIR TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVTBIR TR requirements.

6.How does Aetrix verify that W25N02KVTBIR TR is sourced from the original manufacturer or authorized distributors?

All W25N02KVTBIR TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVTBIR TR meets industry standards.

7.What is the process for return or replacement of W25N02KVTBIR TR?

All W25N02KVTBIR TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVTBIR TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N02KVTBIR TR part is unused and in its original packaging.

Return procedure for W25N02KVTBIR TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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