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Winbond Electronics Corporation W25N02KVTBIU TR
- Part No.:
- W25N02KVTBIU TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KVTBIU TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,554
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Product details
Overview
W25N02KVTBIU TR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and 128KB uniform block erase. It operates from 2.7V to 3.6V, consumes 25mA active / 10µA standby / 1µA deep power-down current, and targets embedded code storage and data logging in space-constrained industrial controllers.
For engineers reviewing the W25N02KVTBIU TR datasheet, W25N02KVTBIU TR pinout, W25N02KVTBIU TR application, or W25N02KVTBIU TR equivalent, key selection considerations include Quad I/O throughput (416MHz equivalent), buffer vs. sequential read mode configuration, hardware/software write protection flexibility, and TFBGA-24 (6x4 ball array) package compatibility with high-density PCB layouts.
Technical Context
The W25N02KVTBIU TR implements a QspiNAND architecture combining SPI command compatibility with NAND-style density and page/block organization: 131,072 × 2,048-byte pages, 2,048 erasable 128KB blocks, and internal 2,048-byte buffer for full-page programming. It supports standard, dual, and quad I/O SPI protocols using shared IO0–IO3 pins with mode-dependent function mapping.
Its register system includes three status registers (SR-1 volatile/OTP-lockable, SR-2 volatile, SR-3 read-only) and extended ECC registers (BFD/BFS/BFR/MBF) enabling real-time bit-flip monitoring and configurable error correction. The BUF bit selects between buffer-read (default) and sequential-read modes, while ECC-E enables/disables on-chip ECC during program/erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256M-byte) SLC NAND array organized as 131,072 pages × 2,048 bytes; enables compact firmware storage without external memory controllers. |
| SPI Interface Modes | Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3) SPI; supports 104MHz clock → 208MHz (Dual) / 416MHz (Quad) effective throughput for high-speed data streaming. |
| ECC Capability | On-chip 8-bit ECC with configurable enable (ECC-E bit); reports cumulative bit flips (ECC-1/ECC-0), program/erase failure (P-FAIL/E-FAIL), and max flip count (MBF/MFS) for reliability monitoring. |
| Read Modes | Buffer Read (BUF=1, default) and Sequential Read (BUF=0); latter allows single-command access across entire memory array, reducing host CPU overhead in logging applications. |
| Write Protection | Dual-layer: software (BP3–BP0 + WP-E in SR-1) and hardware (/WP pin active-low when WP-E=1); protects up to full array or as small as 512KB (4 blocks) with OTP-lockable SRP bits. |
| Endurance & Retention | 60,000 program/erase cycles and 10-year data retention at -40°C to +85°C; validated for industrial-grade deployment in unattended edge devices. |
| Power Profile | Single 2.7–3.6V supply; 25mA active read/write, 10µA standby, 1µA deep power-down (B9h/ABh instructions); suitable for battery-backed or energy-harvesting systems. |
Pinout & Package
W25N02KVTBIU TR uses a 24-ball TFBGA 8x6-mm package (Package Code TC, 6x4 ball array), optimized for high-density PCB layouts with thermal and electrical performance matching legacy SPI flash footprints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: drives device into high-impedance output and standby current (10µA) when high; must transition high→low after power-up before instruction acceptance. |
| CLK | Serial Clock Input | Provides timing for all SPI operations; supports up to 104MHz; rising edge latches input (DI/IO0–IO3), falling edge samples output (DO/IO0–IO3). |
| DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and program data. |
| DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; returns status, JEDEC ID, and read data. |
| /WP (IO2) | Write Protect Input / I/O2 | Hardware write protect when WP-E=1 (active-low disables all writes); functions as I/O2 in Quad SPI when WP-E=0. |
| /HOLD (IO3) | Hold Input / I/O3 | Pauses Standard/Dual SPI transfers when low; becomes I/O3 in Quad SPI; requires external pull-up to avoid floating during Quad operation. |
| VCC | Power Supply | 2.7–3.6V single supply; decoupling capacitor required per datasheet layout guidelines to maintain stable core voltage during fast transitions. |
| GND | Ground | Reference for all I/O and internal circuitry; must be connected to low-impedance system ground plane to minimize noise coupling into SPI signals. |
Key Features
| Feature | Design Value |
|---|---|
| Sequential Read Mode (BUF=0) | Enables single-instruction access to entire memory array, eliminating address incrementing overhead and improving host CPU efficiency in continuous data logging. |
| Configurable On-Chip ECC | ECC-E bit enables/disables 8-bit correction; BFD/BFS/BFR registers allow runtime monitoring of bit-flip accumulation to trigger proactive block retirement before failure. |
| Flexible Write Protection | Combines volatile BP bits (software-controlled granularity down to 512KB) with OTP-lockable SRP bits and hardware /WP pin for tamper-resistant firmware partitioning. |
| Dual/Quad SPI Compatibility | Maintains pin compatibility with legacy SPI flash while delivering 2×/4× bandwidth via same physical interface-reducing BOM count and simplifying migration paths. |
| OTP Memory Space | Ten 2KB one-time-programmable pages store calibration data, security keys, or unique identifiers; programmed once and permanently locked via OTP-L bit. |
Applications
| Industrial PLC Firmware Storage | Medical Device Data Logging |
|---|---|
|
Use Scenario: Storing boot firmware and control logic for programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Dual/Quad SPI interface; executes directly from flash or shadows to RAM with minimal latency. Use Value: 10-year data retention and 60,000 P/E cycles ensure firmware integrity over multi-year deployments without field updates; ECC prevents silent corruption in mission-critical sequences. |
Use Scenario: Capturing time-stamped sensor readings (ECG, SpO₂) in portable diagnostic equipment where power budget limits DRAM usage and data persistence is mandatory. IC Role / Device Role / Timing Role: High-throughput sequential data sink using Sequential Read Mode; buffers incoming streams via internal 2KB page buffer before background erase. Use Value: 50MB/s sequential transfer rate enables real-time capture of multi-channel physiological data; deep power-down (1µA) extends battery life between clinical sessions. |
| Smart Meter Firmware & Tariff Tables | Automotive Telematics Event Recording |
|
Use Scenario: Hosting encrypted firmware images and utility-specific tariff tables in electricity/gas meters deployed in outdoor enclosures subject to thermal cycling and long service life. IC Role / Device Role / Timing Role: Secure, field-upgradable storage with hardware write protection (/WP pin + OTP lock) preventing unauthorized firmware modification during OTA updates. Use Value: SRP1/SRP0 OTP locking ensures critical protection registers remain immutable after commissioning; 2.7–3.6V operation tolerates brown-out conditions common in grid-edge installations. |
Use Scenario: Recording crash-triggered CAN bus snapshots and GPS coordinates in automotive black-box modules requiring guaranteed write completion under voltage transients. IC Role / Device Role / Timing Role: Robust non-volatile buffer for post-event data capture; uses BUSY status flag and P-FAIL/E-FAIL bits to validate write integrity after power loss. Use Value: On-chip ECC detects and corrects bit errors induced by automotive ESD events; 128KB block erase enables deterministic wear leveling across 2,048 blocks for >10-year service life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QspiNAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | 2G-bit QspiNAND, identical 24-ball TFBGA (6x4), 104MHz max clock, but lacks sequential read mode and has fixed 4-bit ECC (non-configurable). | Requires host-side address management for large reads; no BUF-mode optimization for streaming workloads. | Select when strict pin-to-pin replacement is needed and sequential read is not used; verify ECC reporting compatibility with existing firmware. |
| Micron MT29F2G01ABAGDWB | 2G-bit SLC NAND with x8 parallel interface (not SPI); requires dedicated NAND controller, external ECC engine, and more PCB area. | Not SPI-compatible; mandates redesign of memory controller logic and layout; higher system-level BOM cost. | Choose only if migrating from legacy parallel NAND and controller resources exist; not a drop-in alternative for SPI-based designs. |
Compared with W25N02KVTBIU TR, MX35LF2GE4AB offers mechanical compatibility but omits sequential read and configurable ECC-limiting efficiency in streaming applications-while MT29F2G01ABAGDWB demands full interface redesign and external ECC, increasing validation effort and board area.
Availability
W25N02KVTBIU TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device data logging, and smart meter tariff table hosting requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for W25N02KVTBIU TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage products for industrial, automotive, and consumer markets.
The W25N QspiNAND product line was designed to bridge the density gap between SPI NOR and parallel NAND, delivering NAND economics with SPI simplicity-targeting embedded systems needing >128MB non-volatile storage without complex controllers.
FAQ
What is the package type and footprint compatibility of W25N02KVTBIU TR?
W25N02KVTBIU TR uses a 24-ball TFBGA 8x6-mm package with a 6x4 ball array (Package Code TC). It shares the same pad layout and thermal profile as other Winbond QspiNAND devices in the TB/TC family, enabling direct PCB footprint reuse across density variants. No rework is needed when scaling from 1G-bit to 2G-bit within the same package series.
Does W25N02KVTBIU TR support execute-in-place (XIP) operation?
Yes, W25N02KVTBIU TR supports XIP via Dual/Quad SPI interfaces, allowing microcontrollers to execute code directly from flash without shadowing to RAM. Its 104MHz clock and 416MHz equivalent Quad I/O throughput deliver sufficient bandwidth for real-time interrupt handling and deterministic code execution in resource-constrained embedded systems.
How does the on-chip ECC in W25N02KVTBIU TR differ from external ECC implementations?
W25N02KVTBIU TR integrates configurable 8-bit ECC that operates transparently during program/erase cycles when enabled (ECC-E=1). Unlike external ECC engines, it eliminates host CPU overhead for syndrome calculation and provides real-time status via ECC-1/ECC-0 bits and extended registers (BFR/MBF), enabling predictive block retirement before uncorrectable errors occur.
Can W25N02KVTBIU TR's /WP and /HOLD pins be repurposed in Quad SPI mode?
Yes-when WP-E=0, the /WP pin functions as IO2 and /HOLD as IO3 in Quad SPI operations. However, hardware write protection and hold functionality are disabled in this mode. To retain /WP protection, set WP-E=1 (locking SR-1), but note that Quad SPI read commands are then disabled per datasheet Section 4.3.
What is the minimum erase granularity supported by W25N02KVTBIU TR?
W25N02KVTBIU TR supports only 128KB block erase (D8h instruction); it does not offer smaller erase units like sector or page erase. Each block contains 64 pages (128KB), and the device contains 2,048 such blocks. This uniform granularity simplifies wear leveling algorithms but requires careful data layout to avoid excessive write amplification in small-update applications.
W25N02KVTBIU TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KVTBIU TR FAQ
1.How can I place an order for W25N02KVTBIU TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KVTBIU TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KVTBIU TR reliable?
The price and inventory of W25N02KVTBIU TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVTBIU TR is usually 5 days.
3.What payment methods are accepted for W25N02KVTBIU TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVTBIU TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KVTBIU TR?
W25N02KVTBIU TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KVTBIU TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KVTBIU TR?
For technical support, including W25N02KVTBIU TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVTBIU TR requirements.
6.How does Aetrix verify that W25N02KVTBIU TR is sourced from the original manufacturer or authorized distributors?
All W25N02KVTBIU TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVTBIU TR meets industry standards.
7.What is the process for return or replacement of W25N02KVTBIU TR?
All W25N02KVTBIU TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVTBIU TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KVTBIU TR part is unused and in its original packaging.
Return procedure for W25N02KVTBIU TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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