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Winbond Electronics Corporation W25N02KVTCIR
- Part No.:
- W25N02KVTCIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KVTCIR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,142
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Product details
Overview
W25N02KVTCIR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and 128KB uniform block erase. It delivers 50MB/s sequential read throughput and operates from 2.7V–3.6V for embedded code storage and data logging in space-constrained industrial controllers.
For engineers reviewing the W25N02KVTCIR datasheet, W25N02KVTCIR pinout, W25N02KVTCIR application, or W25N02KVTCIR equivalent, key selection criteria include its dual-mode read capability (Buffer vs. Sequential), hardware/software write protection flexibility, OTP page support, and TFBGA-24 (6x4 ball array) package compatibility with high-density PCB layouts.
Technical Context
The W25N02KVTCIR implements a QspiNAND architecture combining SPI command compatibility with NAND-style density and page/block organization: 131,072 × 2,048-byte pages, 2,048 erasable 128KB blocks, and internal 2,048-byte buffer for full-page programming. It supports standard, dual, and quad I/O SPI protocols using shared IO0–IO3 pins with mode-dependent function mapping.
Its register system includes three status registers (SR-1 volatile/OTP-lockable, SR-2 volatile, SR-3 read-only) and extended ECC registers (BFD/BFS/BFR/MBF) enabling real-time bit-flip monitoring and configurable error correction. The /WP and /HOLD pins serve dual roles-dedicated control inputs in Standard/Dual SPI, and IO2/IO3 in Quad SPI-requiring host firmware awareness of mode-dependent pin behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256M-byte) SLC NAND array organized as 131,072 pages × 2,048 bytes |
| Interface Speed | 104MHz SPI clock; 208MHz dual-I/O and 416MHz quad-I/O equivalent data rates |
| Read Throughput | 50MB/s sequential read in Buffer Read mode (BUF=1), enabled by single-command full-array access |
| Erase/Program Endurance | 60,000 program/erase cycles per block, with 10-year data retention at +85°C |
| ECC Capability | On-chip 8-bit ECC with real-time status reporting (ECC-1/ECC-0) and bit-flip count tracking (BFR/MBF) |
| Power Supply | Single 2.7V–3.6V supply; 25mA active current, 10µA standby, 1µA deep power-down |
| Operating Temperature | -40°C to +85°C industrial grade, validated across full voltage and timing margins |
Pinout & Package
W25N02KVTCIR uses the 24-ball TFBGA 8x6-mm package with 6x4 ball array (package code TC), compliant with JEDEC MO-270CA. Pin functions are defined per SPI mode: /CS, CLK, DI/IO0, DO/IO1, /WP/IO2, and /HOLD/IO3 share dual-role assignments depending on instruction type.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before accepting instructions |
| CLK | Serial Clock Input | Timing reference for all SPI operations; supports up to 104MHz with defined setup/hold margins |
| DI / IO0 | Data Input / Quad I/O 0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI for address/data transfer |
| DO / IO1 | Data Output / Quad I/O 1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; high-Z when /HOLD asserted |
| /WP / IO2 | Write Protect Input / Quad I/O 2 | Hardware lock for SR-1 when WP-E=1; otherwise serves as IO2 in Quad mode and enables software protection |
| /HOLD / IO3 | Hold Input / Quad I/O 3 | Pauses Standard/Dual SPI transfers; becomes IO3 in Quad mode-requires external pull-up to prevent float |
Key Features
| Feature | Design Value |
|---|---|
| Sequential Read Mode | Enables full-memory access with one Read command (BUF=0), eliminating address increment overhead for streaming applications |
| Configurable ECC | ECC-E bit enables/disables on-chip 8-bit correction; BFD/BFS registers allow firmware to monitor and respond to bit-flip trends |
| Dual Protection Scheme | Combines hardware (/WP pin + WP-E bit) and software (BP[3:0], SRP[1:0]) write protection for granular 512KB–full-array locking |
| OTP Storage | Ten 2KB One-Time-Programmable pages for secure calibration data, device IDs, or firmware signatures-irreversible after programming |
| Deep Power-Down | B9h instruction reduces current to 1µA; ABh releases device while preserving internal state-critical for battery-powered edge nodes |
Applications
| Industrial PLC Firmware Storage | Medical Device Data Logging |
|---|---|
|
Use Scenario: Storing boot firmware and configuration tables in DIN-rail mounted programmable logic controllers with limited board area. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Dual/Quad SPI interface enabling fast startup and deterministic execution latency. Use Value: 128KB uniform block erase simplifies firmware update partitioning; on-chip ECC ensures integrity of safety-critical control code over 10+ years. |
Use Scenario: Capturing time-stamped sensor waveforms (ECG, SpO₂) in portable diagnostic equipment between cloud sync intervals. IC Role / Device Role / Timing Role: High-throughput sequential data recorder leveraging 50MB/s read speed and 2,048-byte page buffer for burst capture. Use Value: Deep power-down (1µA) extends battery life; OTP pages securely store device-specific calibration coefficients resistant to field reprogramming. |
| Smart Meter Firmware & Logs | Automotive Telematics Black Box |
|
Use Scenario: Retaining firmware images, tariff tables, and hourly consumption logs in ANSI C12.22-compliant electricity meters deployed outdoors. IC Role / Device Role / Timing Role: Industrial-grade flash memory handling frequent partial writes and long-term archival under thermal cycling (-40°C to +85°C). Use Value: 60,000 P/E cycles and 10-year retention meet ANSI C12.20 lifetime requirements; hardware /WP lock prevents accidental corruption during field updates. |
Use Scenario: Recording CAN bus event streams and GPS coordinates during vehicle crash events for post-incident forensic analysis. IC Role / Device Role / Timing Role: Crash-triggered non-volatile buffer with guaranteed write completion via BUSY status flag and ECC error detection. Use Value: Sequential Read Mode enables rapid dump of pre-crash buffers; unique ID page provides tamper-evident device traceability in regulatory submissions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QspiNAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | 2G-bit QspiNAND, same 104MHz clock, but lacks configurable ECC registers and OTP pages; uses different status register layout | Supports basic firmware storage but cannot implement ECC-aware wear leveling or secure calibration storage | Select when cost sensitivity outweighs need for field-monitorable ECC health or immutable device identity |
| Micron MT29F2G01ABAGDWB | 2G-bit SLC NAND with x8 parallel interface-not SPI-compatible; requires dedicated NAND controller and bad-block management firmware | Demands host-level ECC implementation and complex driver stack; unsuitable for SPI-only microcontrollers | Choose only if existing platform already supports parallel NAND and requires maximum sequential bandwidth beyond SPI limits |
Compared with MX35LF2GE4AB and MT29F2G01ABAGDWB, W25N02KVTCIR uniquely integrates SPI-native QspiNAND density with production-ready ECC telemetry, OTP security, and dual-read mode flexibility-enabling drop-in replacement of legacy SPI NOR while retaining NAND economics and scalability.
Availability
W25N02KVTCIR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device data logging, smart meter archival, automotive telematics black boxes, and edge AI inference model caching requiring stable component supply and long-lifecycle assurance.
Supply support for W25N02KVTCIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including serial flash, mobile DRAM, and code storage devices since 1987.
The W25N QspiNAND product line was designed to bridge the density gap between SPI NOR and parallel NAND, delivering NAND economics with SPI simplicity for resource-constrained microcontroller-based systems.
FAQ
What is the package type and footprint compatibility of W25N02KVTCIR?
W25N02KVTCIR uses a 24-ball TFBGA 8x6-mm package with 6x4 ball array (JEDEC MO-270CA, package code TC). Its pad layout matches standard 0.5mm pitch TFBGA footprints used for serial flash; no PCB redesign is needed when migrating from compatible Winbond W25Q or competing QspiNAND devices with identical mechanical dimensions.
Does W25N02KVTCIR support execute-in-place (XIP) operation?
Yes, W25N02KVTCIR supports XIP via Dual/Quad SPI interfaces, allowing microcontrollers to execute code directly from flash without copying to RAM. This is enabled by Fast Read Dual/Quad I/O instructions (3Bh/6Bh) and requires proper cache coherency handling in the host MCU-but no external glue logic or address translation is needed.
How does the ECC functionality work in W25N02KVTCIR?
W25N02KVTCIR includes on-chip 8-bit ECC that automatically corrects up to 8 bit errors per 512-byte sector. ECC-E bit in SR-2 enables/disables correction; ECC-1/ECC-0 bits in SR-3 report correction status; BFR and MBF registers provide cumulative and peak bit-flip counts for predictive failure analysis-no host-side ECC calculation required.
Can W25N02KVTCIR be used as a direct replacement for standard SPI NOR flash?
W25N02KVTCIR is not a pin-compatible or command-compatible drop-in replacement for SPI NOR due to NAND architecture differences (page/block erase, ECC requirements, invalid block management). However, it can replace NOR in new designs where higher density, lower cost-per-bit, and managed NAND features justify minor firmware adaptation for erase handling and status polling.
What is the purpose of the Unique ID and Parameter pages in W25N02KVTCIR?
W25N02KVTCIR includes one factory-programmed Unique ID page (128 bytes) for device serialization and anti-counterfeiting, plus one Parameter page defining device-specific geometry and timing parameters. Both are accessed via OTP-E=1 mode and provide immutable, traceable identifiers critical for regulatory compliance in medical and industrial deployments.
W25N02KVTCIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KVTCIR FAQ
1.How can I place an order for W25N02KVTCIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KVTCIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KVTCIR reliable?
The price and inventory of W25N02KVTCIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVTCIR is usually 5 days.
3.What payment methods are accepted for W25N02KVTCIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVTCIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KVTCIR?
W25N02KVTCIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KVTCIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KVTCIR?
For technical support, including W25N02KVTCIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVTCIR requirements.
6.How does Aetrix verify that W25N02KVTCIR is sourced from the original manufacturer or authorized distributors?
All W25N02KVTCIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVTCIR meets industry standards.
7.What is the process for return or replacement of W25N02KVTCIR?
All W25N02KVTCIR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVTCIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KVTCIR part is unused and in its original packaging.
Return procedure for W25N02KVTCIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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