Winbond Electronics Corporation W25N02KVZEIR
- Part No.:
- W25N02KVZEIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25N02KVZEIR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25N02KVZEIR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It supports standard, dual, and quad SPI interfaces with up to 104MHz clock frequency, delivers 50MB/s sequential read throughput, operates from 2.7–3.6V, and features on-chip 8-bit ECC, 128KB uniform block erase, and 60,000 program/erase cycles - deployed in industrial HMI, IoT edge nodes, and firmware update storage.
For engineers reviewing the W25N02KVZEIR datasheet, W25N02KVZEIR pinout, W25N02KVZEIR application, or W25N02KVZEIR equivalent, key selection considerations include its dual/quad SPI compatibility, buffer vs. sequential read mode configuration (BUF bit), hardware/software write protection flexibility, ECC status reporting (ECC-1/ECC-0), and WSON 8x6-mm (ZE) package footprint constraints.
Technical Context
The W25N02KVZEIR implements a QspiNAND architecture combining SPI command simplicity with NAND density efficiency. Its memory array is organized into 2,048 erasable 128KB blocks (131,072 pages × 2,048 bytes), supporting both Buffer Read (default, BUF=1) and Sequential Read (BUF=0) modes - the latter enabling single-command linear access across full memory. Internal ECC uses an 8-bit Hamming-based correction engine with real-time status reporting via Status Register-3.
It supports JEDEC-standard instruction set extensions including Fast Read Quad I/O (6Bh/6Ch), Deep Power-Down (B9h), and OTP page access (OTP-E=1). Write protection is configurable via volatile BP[3:0] bits and OTP-lockable SRP[1:0], with /WP pin behavior dynamically controlled by WP-E bit - switching between dedicated hardware lock (WP-E=1) and quad I/O function (WP-E=0).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256M-byte) SLC NAND array - enables compact firmware storage without external controller logic. |
| Interface Speed | 104MHz SPI clock; 208MHz dual I/O, 416MHz quad I/O equivalent - supports high-throughput boot code loading. |
| Read Throughput | 50MB/s sequential transfer rate - reduces firmware load latency in real-time embedded applications. |
| Erase/Program Endurance | 60,000 cycles per block - suitable for field-updatable firmware with frequent OTA patching. |
| Data Retention | 10 years at +85°C - meets industrial temperature lifecycle requirements for unattended deployments. |
| Voltage Range | 2.7V to 3.6V single supply - compatible with 3.3V system rails and brown-out tolerant designs. |
| Power Consumption | 25mA active, 10µA standby, 1µA deep power-down - extends battery life in portable or energy-harvested devices. |
Pinout & Package
W25N02KVZEIR is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252, package code ZE), with exposed thermal pad. Pin functions are electrically defined per SPI mode: standard/dual SPI uses /CS, CLK, DI, DO, /WP, /HOLD; quad SPI repurposes /WP and /HOLD as IO2 and IO3.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable controlling device selection and high-impedance output state - must transition high→low after power-up to accept instructions. |
| 2 DO (IO1) | Data Output / I/O1 | Unidirectional output in standard SPI; bidirectional I/O in dual/quad SPI - carries read data, status, or instruction responses. |
| 3 /WP (IO2) | Write Protect Input / I/O2 | Hardware lock for registers when WP-E=1; otherwise serves as quad I/O pin - requires pull-up if unused in quad mode. |
| 4 GND | Ground Reference | Primary return path for VCC and all I/O signals - must be low-inductance connection for stable timing and ECC reliability. |
| 5 DI (IO0) | Data Input / I/O0 | Unidirectional input in standard SPI; bidirectional I/O in dual/quad SPI - accepts commands, addresses, and program data. |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference for all SPI operations - supports up to 104MHz with controlled slew rate for signal integrity. |
| 7 /HOLD (IO3) | Hold Input / I/O3 | Pauses ongoing standard/dual SPI transfers when low; becomes quad I/O pin during quad operations - must be pulled high externally if unused. |
| 8 VCC | Power Supply | 2.7–3.6V main supply - powers internal charge pump, ECC engine, and I/O buffers; decoupling capacitor required near pin. |
Key Features
| Feature | Design Value |
|---|---|
| Buffer Read & Sequential Read Mode | Configurable via BUF bit in Config Register (SR-2); enables either page-aligned burst reads or continuous linear access - simplifies driver design for streaming vs. random access. |
| On-Chip 8-Bit ECC | Corrects up to 8-bit errors per 512-byte sector; reports correction status via ECC-1/ECC-0 bits - eliminates need for external ECC controller in cost-sensitive designs. |
| Flexible Write Protection | Combines software (BP[3:0]) and hardware (/WP + WP-E) locking with OTP-lockable SRP[1:0] - allows secure boot partitioning and field-programmable region lockdown. |
| 10 × 2KB OTP Pages | Dedicated one-time-programmable storage for keys, calibration data, or device-specific parameters - accessible only when OTP-E=1, immune to accidental overwrite. |
| Deep Power-Down Mode | 1µA quiescent current with B9h instruction; retains all register and memory states - ideal for battery-backed firmware storage with multi-year shelf life. |
Applications
| Firmware Storage in Industrial PLCs | Secure Boot Code in Medical Devices |
|---|---|
|
Use Scenario: Storing and executing firmware images for programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Non-volatile code storage and XIP-capable execution source - accessed via Quad SPI at 104MHz for deterministic boot timing. Use Value: 10-year data retention at +85°C and 60,000 P/E cycles ensure reliable firmware updates over 15+ year product lifecycles without field replacement. |
Use Scenario: Holding cryptographically signed bootloader and root-of-trust keys in Class II medical instruments requiring FDA-compliant data integrity and tamper resistance. IC Role / Device Role / Timing Role: Secure, OTP-backed storage for immutable boot assets - protected by hardware /WP lock and OTP-L bit to prevent runtime modification. Use Value: On-chip 8-bit ECC and ECC status reporting (ECC-0/ECC-1) provide real-time error detection during boot verification, satisfying IEC 62304 traceability requirements. |
| OTA Update Storage in Smart Meters | Log Data Buffer in Environmental Sensors |
|
Use Scenario: Temporary staging of encrypted firmware patches received over LPWAN before atomic installation - requiring wear-leveling-aware endurance and fast sequential writes. IC Role / Device Role / Timing Role: High-endurance NAND buffer with 128KB uniform block erase - managed via host-side FTL using standard SPI commands. Use Value: 50MB/s sequential read throughput accelerates patch validation; 60,000 P/E cycles support >10 years of monthly updates under typical utility deployment models. |
Use Scenario: Local buffering of time-stamped sensor readings (temperature, humidity, air quality) in battery-powered environmental monitoring nodes. IC Role / Device Role / Timing Role: Low-power non-volatile scratchpad - operated in Deep Power-Down (1µA) between sampling intervals to maximize battery life. Use Value: 10µA standby and 1µA DPD current extend CR2032 battery life beyond 5 years while retaining full 256MB capacity for extended offline logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | 2G-bit SLC NAND, 104MHz Quad SPI, but lacks on-chip ECC and sequential read mode - requires external ECC handling and custom read sequencing. | Requires host-side ECC implementation and more complex driver stack - less suitable for resource-constrained MCUs without dedicated NAND controllers. | Choose when absolute lowest BOM cost is prioritized and host has ECC capability; avoid if minimizing firmware complexity is critical. |
| Micron MT29F2G01ABAGDWB | 2G-bit SLC NAND with built-in BCH ECC, but uses parallel interface (x8/x16) and requires dedicated NAND controller - no native SPI compatibility. | Demands PCB layout with 8–16 data lines, address bus, and control signals - incompatible with SPI-only microcontrollers and increases routing complexity. | Choose only for high-bandwidth applications with existing parallel NAND infrastructure; not a drop-in replacement for W25N02KVZEIR's SPI footprint. |
Compared with MX35LF2GE4AB, W25N02KVZEIR integrates ECC and simplifies firmware development; versus MT29F2G01ABAGDWB, it eliminates parallel bus routing and controller dependency - making it optimal for SPI-native, size- and power-constrained designs.
Availability
W25N02KVZEIR is available at Aetrix Electronics and suitable for industrial HMI, IoT edge node firmware storage, and medical device boot code applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for W25N02KVZEIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global supplier of specialty DRAM, mobile DRAM, Code Storage Flash, and TrustME® secure flash memory - serving automotive, industrial, and communications markets since 1987.
The W25N QspiNAND product line was developed to bridge the density gap between serial NOR and traditional NAND, delivering NAND economics with SPI simplicity - targeting cost-sensitive, space-constrained embedded systems needing >128MB non-volatile storage.
FAQ
What is the package type and dimensions of W25N02KVZEIR?
W25N02KVZEIR uses an 8-pad WSON package measuring 8mm × 6mm with exposed thermal pad (JEDEC MO-252, package code ZE). This compact footprint supports high-density PCB layouts and provides adequate thermal dissipation for sustained read/write operations without heatsinking.
Does W25N02KVZEIR support Quad SPI operation, and how is it enabled?
Yes, W25N02KVZEIR supports Quad SPI using IO0–IO3 pins (DI, DO, /WP, /HOLD). It is enabled by issuing Fast Read Quad I/O (6Bh/6Ch) or Quad Load Program Data (32h/34h) instructions - with /WP and /HOLD automatically repurposed as IO2 and IO3 when quad mode is active.
How does the on-chip ECC work in W25N02KVZEIR, and where are status flags reported?
W25N02KVZEIR implements an 8-bit Hamming-based ECC engine correcting up to 8-bit errors per 512-byte sector. ECC status is reported in Status Register-3 (Cxh) via ECC-1 and ECC-0 bits - indicating "No Error", "1–3 Bit Correction", "4–8 Bit Correction", or "Uncorrectable Error" - enabling host-level error response without external logic.
Can W25N02KVZEIR be used for Execute-in-Place (XIP) applications?
Yes, W25N02KVZEIR supports XIP via Dual/Quad SPI Fast Read instructions (e.g., 3Bh, 6Bh) at up to 104MHz clock rate, delivering effective bandwidths of 208Mbps or 416Mbps. Its uniform 128KB block structure and low-latency sequential read mode make it suitable for direct code execution in resource-constrained microcontrollers.
What is the difference between Buffer Read and Sequential Read modes in W25N02KVZEIR?
Buffer Read (BUF=1, default) loads one 2,048-byte page into internal buffer for burst reads; Sequential Read (BUF=0) enables continuous linear access across multiple pages with a single command - reducing instruction overhead and improving throughput for large data transfers like firmware images or log files.
W25N02KVZEIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25N02KVZEIR FAQ
1.How can I place an order for W25N02KVZEIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KVZEIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KVZEIR reliable?
The price and inventory of W25N02KVZEIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVZEIR is usually 5 days.
3.What payment methods are accepted for W25N02KVZEIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVZEIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KVZEIR?
W25N02KVZEIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KVZEIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KVZEIR?
For technical support, including W25N02KVZEIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVZEIR requirements.
6.How does Aetrix verify that W25N02KVZEIR is sourced from the original manufacturer or authorized distributors?
All W25N02KVZEIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVZEIR meets industry standards.
7.What is the process for return or replacement of W25N02KVZEIR?
All W25N02KVZEIR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVZEIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KVZEIR part is unused and in its original packaging.
Return procedure for W25N02KVZEIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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