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Winbond Electronics Corporation W25N02KVZEIU TR

Part No.:
W25N02KVZEIU TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25N02KVZEIU TR.pdf
Description:
IC FLASH 2GBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,656

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Product details

Overview

W25N02KVZEIU TR from Winbond is a 2G-bit (256MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and dual read modes (Buffer Read & Sequential Read). It delivers 50MB/s sequential data transfer and operates from 2.7V–3.6V for embedded code shadowing, XIP execution, and firmware/data storage in space-constrained industrial controllers.

For engineers reviewing the W25N02KVZEIU TR datasheet, W25N02KVZEIU TR pinout, W25N02KVZEIU TR application, or W25N02KVZEIU TR equivalent, key selection criteria include its 8-pad WSON 8×6-mm package (ZE), hardware/software write protection via /WP and status registers, 60,000 program/erase cycles, -40°C to +85°C operation, and support for Fast Read Quad I/O with 4-byte addressing.

Technical Context

The W25N02KVZEIU TR implements a QspiNAND architecture combining SPI command compatibility with NAND density efficiency. Its memory array comprises 131,072 pages of 2,048 bytes each, organized into 2,048 uniform 128KB erasable blocks. Internal 2,048-byte buffer enables full-page programming in one operation.

It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with configurable /WP and /HOLD pins that double as I/Os in Quad mode. The device features volatile and OTP-lockable status/configuration registers controlling ECC enable (ECC-E), read mode (BUF), output driver strength (ODS), and write protection granularity down to 512KB.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2G-bit (256M-byte) SLC NAND array - enables high-capacity firmware storage in minimal PCB area.
Interface Dual/Quad SPI with standard instruction set - ensures drop-in compatibility with existing SPI flash controllers and boot ROMs.
Clock Frequency Up to 104MHz (208MHz equiv. Dual, 416MHz equiv. Quad) - supports high-speed firmware loading and real-time data logging.
Data Transfer Rate 50MB/s sequential read - meets throughput requirements for boot image decompression and OTA update streaming.
Erase/Program Endurance 60,000 cycles per block - suitable for field-upgradable systems requiring frequent firmware revisions.
Data Retention 10 years at +85°C - guarantees long-term reliability in industrial and automotive control units without refresh.
Operating Voltage 2.7V–3.6V single supply - simplifies power design and enables direct connection to 3.3V I/O domains.
Temperature Range -40°C to +85°C - qualified for extended industrial temperature operation without derating.

Pinout & Package

W25N02KVZEIU TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-252, package code ZE), optimized for thermal performance and board-level reflow compatibility in high-density layouts.

Pin Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable signal; places DO/IO pins in high-Z state when deasserted to reduce bus contention and standby current.
2 DO (IO1) Data Output / I/O1 Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI - supports command/address/data transfer on falling CLK edge.
3 /WP (IO2) Write Protect Input / I/O2 Hardware lock for status register and memory array when WP-E=1; serves as IO2 in Quad mode when WP-E=0.
4 GND Ground Reference Primary return path for VCC and all I/O signals; requires low-impedance PCB plane for noise immunity and timing stability.
5 DI (IO0) Data Input / I/O0 Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI - carries instructions, addresses, and data on rising CLK edge.
6 CLK Serial Clock Input Master-synchronized timing reference; edge-triggered operation enables precise setup/hold margin control in high-speed designs.
7 /HOLD (IO3) Hold Input / I/O3 Pauses ongoing Standard/Dual SPI transfers when asserted low; functions as IO3 in Quad mode - requires external pull-up to prevent floating.
8 VCC Power Supply Single 2.7–3.6V supply powering core logic, charge pumps, and I/O buffers - eliminates need for auxiliary voltage rails.

Key Features

Feature Design Value
On-chip 8-bit ECC Corrects up to 8 bit errors per 512-byte sector - eliminates need for external ECC controller and reduces host CPU overhead during read verification.
Configurable Read Mode (BUF bit) Selects between Buffer Read (page-aligned burst) and Sequential Read (continuous array access) - optimizes throughput for boot code vs. streaming data use cases.
Software/Hardware Write Protection Combines volatile BP[3:0] bits and OTP SRP[1:0] with /WP pin - enables flexible, tamper-resistant firmware partitioning (e.g., bootloader lock, parameter region protection).
Ten 2KB OTP Pages Factory-programmable non-volatile storage for calibration data, MAC addresses, or security keys - immune to accidental erase or overwrite after programming.
Deep Power-Down (1µA) Ultra-low quiescent current state activated by B9h instruction - extends battery life in always-on IoT edge nodes and sensor hubs.
Unique ID & Parameter Page Factory-assigned 128-bit serial number and JEDEC-standard parameter page - enables secure device authentication and automated configuration in production test and field diagnostics.

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing and executing boot firmware and safety-critical control algorithms in programmable logic controllers with constrained PCB space and no external RAM.

IC Role / Device Role / Timing Role: Primary non-volatile code storage and XIP execution source - directly mapped into processor address space via Quad SPI interface.

Use Value: 50MB/s sequential read and 104MHz Quad I/O enable sub-second boot times; 10-year data retention ensures firmware integrity over equipment lifetime.

Use Scenario: Hosting boot images and sensor fusion firmware for camera/radar ECUs operating in harsh automotive environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: High-reliability, AEC-Q100–compatible firmware repository - leverages on-chip ECC and hardware write protection to meet ASIL-B functional safety requirements.

Use Value: 60,000 P/E cycles support frequent OTA updates; deep power-down mode reduces parasitic drain during vehicle sleep states.

Medical Imaging Data Logger Smart Meter Firmware & Calibration

Use Scenario: Capturing and buffering time-stamped diagnostic waveforms from ultrasound or ECG front-ends before transmission to cloud servers.

IC Role / Device Role / Timing Role: High-throughput, wear-leveling–agnostic sequential write buffer - uses Sequential Read Mode for rapid post-acquisition data dump.

Use Value: 128KB uniform block erase and 2,048-byte page programming minimize write latency; 2.7–3.6V operation matches portable battery voltage profiles.

Use Scenario: Storing metrology firmware, tariff tables, and factory-calibrated ADC coefficients in utility-grade electricity meters with 15+ year field life.

IC Role / Device Role / Timing Role: Secure, tamper-evident non-volatile storage - utilizes OTP pages for calibration constants and SRP-locked status registers to prevent unauthorized modification.

Use Value: Ten 2KB OTP pages provide dedicated, one-time-programmable space for unique device identifiers and metrological traceability data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Macronix MX35LF2GE4AB 2G-bit SLC NAND, 104MHz Quad SPI, but lacks on-chip ECC and Sequential Read Mode; uses different status register layout. Requires external ECC handling and software-managed sequential access - increases host firmware complexity and risk of uncorrectable errors. Choose when legacy system compatibility outweighs ECC and read-mode flexibility; verify register mapping and timing margins against W25N02KVZEIU TR.
Micron MT29F2G01ABAGDWB 2G-bit SLC NAND with ONFI 2.3 interface (not SPI); requires parallel NAND controller and external ECC engine. Not pin- or protocol-compatible; demands PCB redesign, new driver stack, and additional power/area for ECC logic. Select only for systems already committed to parallel NAND architecture; not a drop-in replacement for W25N02KVZEIU TR's SPI-based design.

Compared with MX35LF2GE4AB and MT29F2G01ABAGDWB, the W25N02KVZEIU TR uniquely integrates ECC, dual read modes, and SPI-native command set - reducing BOM count, firmware development effort, and qualification risk in new designs targeting industrial and automotive applications.

Availability

W25N02KVZEIU TR is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical data loggers, smart utility meters, and IoT edge gateways requiring stable component supply across multi-year production cycles.

Supply support for W25N02KVZEIU TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND flash, RAM, and mobile DRAM for industrial, automotive, and consumer markets.

The W25N QspiNAND product line was designed to bridge the density gap between SPI NOR and parallel NAND, delivering NAND economics with SPI simplicity - specifically targeting code storage, XIP, and firmware update applications in resource-constrained embedded systems.

FAQ

What is the package type and footprint of the W25N02KVZEIU TR?

The W25N02KVZEIU TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-252, package code ZE) with exposed pad thermal enhancement. Its footprint matches standard 8-pin WSON land patterns, and it is compatible with standard reflow profiles for lead-free assembly. This compact package enables high-density PCB layouts while maintaining thermal performance for continuous read/write operations.

Does the W25N02KVZEIU TR support Quad SPI with 4-byte addressing?

Yes, the W25N02KVZEIU TR supports Fast Read Quad I/O with 4-byte addressing (instruction ECh) and Quad Load Program Data with 4-byte addressing (instruction 3Ch). These commands enable full 32-bit address space access beyond the 24-bit limit, essential for systems requiring >16MB of contiguous flash memory mapping - such as Linux kernel + rootfs deployments in industrial gateways.

How does the internal ECC in the W25N02KVZEIU TR function during read operations?

The W25N02KVZEIU TR performs automatic on-the-fly 8-bit ECC correction per 512-byte sector during all read operations when ECC-E=1. Corrected data is delivered to the host; uncorrectable errors trigger BUSY=1 and set P-FAIL/E-FAIL bits in Status Register-3. ECC status (ECC-1/ECC-0) reports bit-flip counts, enabling predictive wear leveling in host firmware.

Can the W25N02KVZEIU TR be used for Execute-in-Place (XIP) applications?

Yes, the W25N02KVZEIU TR supports XIP via Dual/Quad SPI Fast Read instructions (e.g., 3Bh, 6Bh, EBh), delivering sustained bandwidth up to 50MB/s. Its uniform 128KB block erase and page-aligned architecture allow deterministic instruction fetch timing, making it suitable for real-time microcontroller boot and runtime code execution without local RAM buffering.

What is the difference between Buffer Read and Sequential Read modes in the W25N02KVZEIU TR?

Buffer Read mode (BUF=1) loads one full 2,048-byte page into the internal buffer before serial output - ideal for random-access reads and small code segments. Sequential Read mode (BUF=0) streams data continuously across page boundaries with a single READ command - optimized for large firmware images or data logs, eliminating inter-page latency and maximizing throughput.

W25N02KVZEIU TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
7 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25N02KVZEIU TR FAQ

1.How can I place an order for W25N02KVZEIU TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N02KVZEIU TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N02KVZEIU TR reliable?

The price and inventory of W25N02KVZEIU TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KVZEIU TR is usually 5 days.

3.What payment methods are accepted for W25N02KVZEIU TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KVZEIU TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N02KVZEIU TR?

W25N02KVZEIU TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N02KVZEIU TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N02KVZEIU TR?

For technical support, including W25N02KVZEIU TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KVZEIU TR requirements.

6.How does Aetrix verify that W25N02KVZEIU TR is sourced from the original manufacturer or authorized distributors?

All W25N02KVZEIU TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KVZEIU TR meets industry standards.

7.What is the process for return or replacement of W25N02KVZEIU TR?

All W25N02KVZEIU TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KVZEIU TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N02KVZEIU TR part is unused and in its original packaging.

Return procedure for W25N02KVZEIU TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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