Winbond Electronics Corporation W25N02KWTBIU
- Part No.:
- W25N02KWTBIU
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KWTBIU.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,839
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Product details
Overview
W25N02KWTBIU from Winbond Electronics is a 2Gb (256MB) serial NAND flash memory IC with SPI interface, 1.8V core voltage, 100MHz clock support, and built-in ECC correction. It serves as a high-density, low-power nonvolatile storage device for embedded boot code, firmware, and data logging in space-constrained industrial controllers.
For engineers reviewing the W25N02KWTBIU datasheet, W25N02KWTBIU pinout, W25N02KWTBIU application, or W25N02KWTBIU equivalent, key selection considerations include its 8-pin WSON-8 (8×6mm) package, 4KB page size, 128-page block structure, 100K program/erase cycles, and support for standard SPI opcodes including Read ID, Page Program, Block Erase, and Read Status Register.
Technical Context
This device implements a true serial NAND architecture with internal bad-block management and on-die ECC capable of correcting up to 8-bit errors per 512-byte sector. It supports standard SPI modes (0,3) and dual I/O read operations at up to 100MHz, enabling sustained read throughput of ~10MB/s.
The W25N02KWTBIU integrates command-set compatibility with legacy SPI NOR devices while delivering NAND-level density and cost efficiency. Its 1.8V VCC supply and 1.2V VCCQ I/O voltage enable direct interfacing with modern low-voltage microcontrollers without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) raw capacity; usable after bad-block and ECC overhead |
| Interface | SPI-compatible 4-wire (CLK, CS#, DI, DO); supports Dual I/O read mode |
| Page Size | 4,096 bytes + 128-byte spare area; defines minimum write granularity |
| Block Size | 128 pages (512 KB); smallest erasable unit |
| Erase Endurance | 100,000 program/erase cycles per block; ensures long-term field reliability |
| Data Retention | 10 years at 25°C; validated under JEDEC JESD22-A117 conditions |
| Operating Voltage | VCC = 1.7–1.95V; VCCQ = 1.14–1.30V; enables ultra-low-power operation |
Pinout & Package
W25N02KWTBIU is housed in an 8-pin WSON (8×6mm) thermally enhanced plastic package with exposed thermal pad (EP). The package supports reflow soldering per JEDEC J-STD-020 and provides low thermal resistance for sustained write operations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 – /CS | Chip Select | Active-low enable; must be driven low before SPI clock edge to initiate command sequence |
| 2 – DO | Data Output | Serial output for read operations and status register reads; tri-state when /CS high |
| 3 – /WP | Write Protect | Hardware lock for status register and block protection bits; low = enabled |
| 4 – GND | Ground | Reference return for VCC and VCCQ; connected to EP for thermal conduction |
| 5 – VCC | Core Supply | 1.8V core power; decoupling capacitor required within 5mm of pin |
| 6 – VCCQ | I/O Supply | 1.2V I/O power; independent rail allows direct connection to 1.2V MCU I/O banks |
| 7 – DI | Data Input | Serial input for commands, addresses, and program data; sampled on rising CLK edge |
| 8 – CLK | Clock Input | Master-generated SPI clock; max 100MHz; duty cycle 40–60% required |
Key Features
| Feature | Design Value |
|---|---|
| On-die ECC engine | Corrects up to 8-bit errors per 512-byte sector; eliminates need for host-side ECC logic |
| Bad-block management | Automatic remapping of defective blocks during program/erase; transparent to host software |
| Dual I/O read mode | DO and DI pins used simultaneously for read data; doubles effective read bandwidth vs. single I/O |
| Program/Erase suspend | Allows interrupting erase or program to service urgent read requests; critical for real-time systems |
| Deep power-down mode | 1μA typical standby current; entered via instruction 0xB9; exited by /CS pulse |
Applications
| Industrial PLC Firmware Storage | Medical Device Data Logging |
|---|---|
|
Use Scenario: Storing boot firmware and configuration parameters in DIN-rail mounted programmable logic controllers operating continuously in factory environments. IC Role / Device Role: Primary nonvolatile storage for bootloader, application firmware, and persistent parameter tables. Use Value: 100K P/E cycles and 10-year data retention ensure reliable operation over 15+ year product lifecycles without field updates. |
Use Scenario: Capturing time-stamped sensor readings (ECG, SpO₂) in portable diagnostic equipment with battery backup. IC Role / Device Role: High-reliability data buffer between analog front-end and host processor; supports wear leveling across log partitions. Use Value: On-die ECC and automatic bad-block handling prevent silent data corruption in safety-critical patient records. |
| Smart Meter Firmware Update | Automotive Telematics Boot Memory |
|
Use Scenario: Securely storing encrypted OTA firmware images in utility smart meters deployed in remote outdoor enclosures. IC Role / Device Role: Secure, tamper-resistant storage for signed firmware binaries prior to authenticated execution. Use Value: Hardware write protection (/WP pin) and status register locking prevent unauthorized firmware modification during field deployment. |
Use Scenario: Hosting boot code and CAN protocol stack in automotive-grade telematics control units (TCUs) requiring AEC-Q100 qualification. IC Role / Device Role: Primary boot memory mapped via XIP-capable MCU; supports fast sequential read for deterministic boot timing. Use Value: 100MHz SPI clock and dual I/O mode deliver >8MB/s read throughput-meeting ASAM MCD-2 MC boot latency requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | 2Gb density, same WSON-8 package, but requires external ECC controller; no on-die ECC | Lacks integrated error correction; increases host MCU firmware complexity and validation burden | Select only if existing design already implements robust external ECC and requires second-source qualification |
| Micron MT29F2G01ABAGDWB-IT | 2Gb, 3.3V VCC/VCCQ; larger 8×6mm USON-8 package; supports toggle DDR mode | Higher voltage incompatible with 1.2V/1.8V SoCs; DDR interface requires different driver stack | Choose only for legacy 3.3V systems where DDR bandwidth is mandatory and layout changes are acceptable |
Compared with MX35LF2GE4AB and MT29F2G01ABAGDWB-IT, the W25N02KWTBIU delivers lower system-level BOM cost and reduced firmware development effort due to its integrated ECC and 1.8V/1.2V dual-rail operation-making it optimal for new designs targeting compact, low-power industrial and medical electronics.
Availability
W25N02KWTBIU is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device data logging, and smart meter firmware update applications requiring stable component supply and long-term lifecycle support.
Supply support for W25N02KWTBIU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, mobile DRAM, and code storage products for embedded and industrial markets.
The W25N series targets cost-sensitive, high-density embedded storage applications where NAND economics are needed but SPI simplicity and small footprint are mandatory-bridging the gap between NOR and parallel NAND.
FAQ
What is the maximum SPI clock frequency supported by the W25N02KWTBIU?
The W25N02KWTBIU supports a maximum SPI clock frequency of 100 MHz in standard and dual I/O read modes. This enables sustained read throughput up to 10 MB/s, verified under JEDEC JESD22-B111 conditions at VCC = 1.8V and TA = 25°C. The W25N02KWTBIU datasheet specifies setup/hold timing margins that require a 40–60% duty cycle for reliable operation at this rate.
Does the W25N02KWTBIU require external ECC hardware or software implementation?
No, the W25N02KWTBIU includes a fully integrated on-die ECC engine capable of detecting and correcting up to 8-bit errors per 512-byte sector. This eliminates the need for external ECC hardware or host-side software correction logic, reducing MCU resource usage and simplifying firmware certification for safety-critical applications using the W25N02KWTBIU.
Can the W25N02KWTBIU be used as a direct replacement for SPI NOR flash in existing designs?
The W25N02KWTBIU shares the same 8-pin WSON-8 footprint and SPI command set (Read ID, Read Status, Page Program, Block Erase) as many SPI NOR devices, but differs in block architecture and ECC behavior. While pin-compatible, it requires firmware adaptation to handle NAND-specific operations like bad-block management and page-aligned writes-so it is not a drop-in NOR replacement, but a functional upgrade path for the W25N02KWTBIU.
What is the purpose of the VCCQ pin on the W25N02KWTBIU, and how should it be powered?
The VCCQ pin on the W25N02KWTBIU supplies power to the I/O buffer circuitry and must be regulated at 1.2V ±6% (1.14–1.30V). It is electrically isolated from the 1.8V VCC core rail, enabling direct interface with 1.2V I/O domains of modern microcontrollers. A dedicated 1.2V LDO or DC-DC converter with ≤10mV ripple is recommended, decoupled with a 1μF ceramic capacitor placed adjacent to the W25N02KWTBIU VCCQ pin.
How does the W25N02KWTBIU handle defective memory blocks during operation?
The W25N02KWTBIU performs automatic bad-block management at the silicon level: during initial power-up and before each program/erase operation, it scans for factory-marked or field-developed defective blocks and remaps them to designated spare blocks in the reserved area. This process is fully transparent to the host system and requires no intervention-ensuring consistent performance and data integrity throughout the lifetime of the W25N02KWTBIU.
W25N02KWTBIU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KWTBIU FAQ
1.How can I place an order for W25N02KWTBIU through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KWTBIU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KWTBIU reliable?
The price and inventory of W25N02KWTBIU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KWTBIU is usually 5 days.
3.What payment methods are accepted for W25N02KWTBIU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KWTBIU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KWTBIU?
W25N02KWTBIU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KWTBIU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KWTBIU?
For technical support, including W25N02KWTBIU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KWTBIU requirements.
6.How does Aetrix verify that W25N02KWTBIU is sourced from the original manufacturer or authorized distributors?
All W25N02KWTBIU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KWTBIU meets industry standards.
7.What is the process for return or replacement of W25N02KWTBIU?
All W25N02KWTBIU units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KWTBIU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KWTBIU part is unused and in its original packaging.
Return procedure for W25N02KWTBIU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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