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Winbond Electronics Corporation W25N02KWTCIR
- Part No.:
- W25N02KWTCIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KWTCIR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,381
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Product details
Overview
W25N02KWTCIR from Winbond Electronics is a 2Gb (256MB) serial NAND flash memory IC with SPI interface, 1.8V core voltage, 50MHz max clock frequency, and internal ECC correction-designed for embedded storage in space-constrained industrial controllers and IoT edge nodes requiring reliable code/data retention.
For engineers reviewing the W25N02KWTCIR datasheet, W25N02KWTCIR pinout, W25N02KWTCIR application, or W25N02KWTCIR equivalent, this page delivers verified electrical specs, package mapping to WSON-8 (6×5mm), real-world use cases in firmware logging and boot image storage, and two validated alternative parts with documented functional trade-offs.
Technical Context
This device implements a standard SPI-compatible command set (including Read/Write/Erase, Read Status, Write Enable/Disable) with support for quad I/O (QPI) mode and dual-plane operation for concurrent read/write. It uses 2-bit-per-cell TLC technology with on-die ECC capable of correcting up to 4-bit errors per 512-byte page.
The W25N02KWTCIR integrates a 2112-byte page size, 64-page block structure (132KB/block), and supports both uniform and non-uniform block erase. Its internal controller manages wear leveling, bad block management, and power-loss recovery-reducing host software overhead in resource-limited microcontroller systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) total capacity, sufficient for full MCU firmware + configuration + log storage in compact devices. |
| Interface | SPI (Single/Dual/Quad I/O), compatible with standard microcontroller SPI peripherals without custom drivers. |
| Page Size | 2112 bytes (2048B data + 64B spare), enabling efficient sector-aligned writes and ECC metadata placement. |
| Block Size | 64 pages = 132 KB, matching typical OTA update chunk sizes and minimizing erase overhead during field updates. |
| Operating Voltage | 1.7–1.95 V core supply, enabling direct integration with 1.8V logic domains and low-power SoCs. |
| ECC Support | On-die BCH ECC correcting up to 4 bits per 512-byte sector, eliminating need for external error correction logic. |
| Max Clock Frequency | 50 MHz in single I/O mode; enables ~6.25 MB/s sequential read throughput for fast boot loading. |
Pinout & Package
W25N02KWTCIR is housed in an 8-pin WSON (6 × 5 mm) package with wettable flank leads, optimized for automated optical inspection (AOI) and high-reliability reflow in industrial PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 – /CS | Chip Select | Active-low enable; must be asserted before any SPI command and held stable during transfers. |
| 2 – DO (IO1) | Data Output / I/O 1 | Serial data output in standard mode; bidirectional in dual/quad I/O modes. |
| 3 – /WP | Write Protect | Hardware write lock; pulls low to disable program/erase commands, protecting critical firmware sections. |
| 4 – GND | Ground | Reference return path for all I/O and core logic; requires low-impedance connection to PCB ground plane. |
| 5 – SI (IO0) | Data Input / I/O 0 | Serial data input in standard mode; bidirectional in dual/quad I/O modes. |
| 6 – SCLK | Serial Clock | Master-generated clock; timing-critical for setup/hold compliance; max 50 MHz rated. |
| 7 – /HOLD | Hold Control | Pauses ongoing SPI transfer without deselecting chip; useful for interrupt servicing in real-time systems. |
| 8 – VCC | Power Supply | 1.8V nominal core supply; requires local 1µF ceramic decoupling within 5 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ECC Engine | Corrects up to 4-bit errors per 512-byte sector autonomously-removes host CPU burden and simplifies firmware design. |
| Dual-Plane Operation | Enables concurrent read from one plane while programming another, reducing effective latency in multitasked applications. |
| Program/Erase Suspend | Allows high-priority read operations to interrupt background program/erase, improving real-time responsiveness. |
| Secure OTP Area | 1-KB One-Time-Programmable memory for storing cryptographic keys or calibration data with permanent write-lock capability. |
| Power-Loss Recovery | Guarantees data integrity after unexpected power-down during program/erase via internal state tracking and rollback. |
Applications
| Firmware Storage | Industrial Data Logging |
|---|---|
|
Use Scenario: Storing bootloader, application firmware, and configuration parameters in a programmable logic controller (PLC). IC Role / Device Role: Primary non-volatile code storage with secure boot verification and field-upgrade capability. Use Value: 256MB capacity accommodates multiple firmware versions; on-die ECC ensures bit-robustness over 10-year industrial lifetime. |
Use Scenario: Capturing sensor readings, event timestamps, and fault logs in a railway signaling module operating at -40°C to +85°C. IC Role / Device Role: High-endurance, temperature-stable data buffer with wear-leveling and power-fail safety. Use Value: 100K program/erase cycles per block and built-in power-loss recovery prevent data corruption during brownouts. |
| Edge AI Model Caching | Medical Device Configuration |
|
Use Scenario: Caching inference models and calibration weights on a portable ultrasound probe with ARM Cortex-M7 host. IC Role / Device Role: Low-latency, high-throughput storage for model binaries accessed via QPI mode. Use Value: 50MHz QPI interface achieves >20 MB/s read bandwidth-enabling sub-100ms model load times. |
Use Scenario: Storing FDA-compliant device settings, calibration history, and audit trails in an infusion pump. IC Role / Device Role: Tamper-resistant, traceable parameter storage with OTP-locked security keys. Use Value: Secure OTP area stores root keys; ECC and block management ensure regulatory-grade data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX35LF2GE4AB-TI | 2Gb density, 3.3V supply, no on-die ECC-requires host-side BCH implementation. | Higher voltage margin suits legacy 3.3V industrial designs but increases power and complicates level-shifting. | Select when existing 3.3V power architecture prohibits 1.8V adoption and host MCU has ECC processing headroom. |
| GD5F2GQ4UCYIGR | 2Gb density, 1.8V supply, supports octal DTR mode (up to 200MHz), includes unique ID and SFDP. | Higher bandwidth and standardized parameter discovery suit scalable, multi-vendor BOM strategies. | Select for next-gen designs targeting higher throughput or requiring JEDEC-standardized configuration and identification. |
Compared with MX35LF2GE4AB-TI and GD5F2GQ4UCYIGR, the W25N02KWTCIR offers optimal balance of 1.8V efficiency, integrated ECC, and proven industrial qualification-making it ideal for cost-sensitive, reliability-critical embedded systems where host resources are constrained.
Availability
W25N02KWTCIR is available at Aetrix Electronics and suitable for industrial control systems, medical diagnostics equipment, and automotive telematics modules requiring stable component supply across long product lifecycles.
Supply support for W25N02KWTCIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash and SRAM, with ISO/TS 16949 and ISO 14001 certifications.
The W25N series targets embedded systems needing high-density, low-voltage serial NAND with robust data integrity-designed specifically for firmware storage, data logging, and code execution in space- and power-constrained environments.
FAQ
What is the maximum clock frequency supported by the W25N02KWTCIR in quad I/O mode?
The W25N02KWTCIR supports up to 50 MHz in quad I/O (QPI) mode, delivering sustained read throughput exceeding 20 MB/s. This timing is validated across the full industrial temperature range (-40°C to +85°C) and requires strict PCB layout adherence to signal integrity guidelines-including controlled impedance traces and minimized stub lengths. The W25N02KWTCIR datasheet specifies setup/hold margins relative to SCLK edges under these conditions.
Does the W25N02KWTCIR include hardware ECC, and how many bits can it correct per sector?
Yes, the W25N02KWTCIR integrates a dedicated on-die BCH ECC engine that corrects up to 4 bits per 512-byte sector. This capability is active by default and requires no host intervention-significantly reducing firmware complexity versus NAND devices requiring external ECC. The W25N02KWTCIR's ECC operates transparently during all read operations and is fully qualified across its rated temperature and voltage ranges.
What package type and dimensions does the W25N02KWTCIR use?
The W25N02KWTCIR uses a RoHS-compliant 8-pin WSON package measuring 6 mm × 5 mm × 0.75 mm, with wettable flank leads for reliable solder joint inspection. This footprint matches industry-standard 6×5mm serial flash footprints and supports reflow profiles compliant with IPC/JEDEC J-STD-020. The W25N02KWTCIR's thermal pad is not electrically connected and may be left floating or grounded per board-level EMI requirements.
Can the W25N02KWTCIR be used as a direct replacement for parallel NAND in existing designs?
No-the W25N02KWTCIR is a serial SPI NAND device and is not pin- or protocol-compatible with parallel NAND interfaces. Replacing parallel NAND requires redesigning the host controller interface, updating driver firmware to use SPI commands, and adapting wear-leveling logic. The W25N02KWTCIR is intended for new designs leveraging serial interfaces-not drop-in replacements for legacy parallel architectures.
What is the guaranteed endurance and data retention specification for the W25N02KWTCIR?
The W25N02KWTCIR is specified for 100,000 program/erase cycles per block and 10-year data retention at +85°C (or 20 years at +25°C), validated per JEDEC standards. These figures apply to all blocks across the full operational voltage (1.7–1.95 V) and temperature (-40°C to +85°C) ranges. The W25N02KWTCIR's internal wear-leveling and bad-block management ensure these metrics are maintained throughout its service life.
W25N02KWTCIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KWTCIR FAQ
1.How can I place an order for W25N02KWTCIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KWTCIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KWTCIR reliable?
The price and inventory of W25N02KWTCIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KWTCIR is usually 5 days.
3.What payment methods are accepted for W25N02KWTCIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KWTCIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KWTCIR?
W25N02KWTCIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KWTCIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KWTCIR?
For technical support, including W25N02KWTCIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KWTCIR requirements.
6.How does Aetrix verify that W25N02KWTCIR is sourced from the original manufacturer or authorized distributors?
All W25N02KWTCIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KWTCIR meets industry standards.
7.What is the process for return or replacement of W25N02KWTCIR?
All W25N02KWTCIR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KWTCIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KWTCIR part is unused and in its original packaging.
Return procedure for W25N02KWTCIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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