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Winbond Electronics Corporation W25N02KWTCIU TR
- Part No.:
- W25N02KWTCIU TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N02KWTCIU TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,553
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Product details
Overview
W25N02KWTCIU TR from Winbond is a 2Gb (256MB) serial NAND flash memory IC with SPI interface, 1.8V core voltage, 4KB page size, and 128KB block size. It supports single/dual/quad I/O modes, ECC correction, and hardware write protection - deployed in industrial IoT gateways for firmware storage and log buffering.
For engineers reviewing the W25N02KWTCIU TR datasheet, W25N02KWTCIU TR pinout, W25N02KWTCIU TR application, or W25N02KWTCIU TR equivalent, key selection considerations include quad-SPI throughput, on-die ECC capability, 1.8V Vcc compatibility, and JEDEC-standard 8-pin WSON package footprint.
Technical Context
This device implements a standard SPI-compatible command set (including Read/Write/Erase with address latching), supports multi-plane operation for concurrent page programming, and integrates a 24-bit on-die ECC engine compliant with BCH-24 algorithm. It uses a floating-gate NAND cell structure with 3.3V or 1.8V I/O voltage options.
The W25N02KWTCIU TR operates across industrial temperature range (−40°C to +85°C), features configurable write protection via status register bits (SRWD, BP0–BP3), and supports deep power-down mode with 2µA typical current draw. Its command protocol aligns with JEDEC JESD218B for serial NAND reliability reporting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) usable capacity after bad-block management and ECC overhead |
| Interface | SPI-compatible quad I/O (QPI) supporting up to 104 MHz clock, enabling ~416 MB/s peak throughput |
| Page Size | 4,096 bytes + 128-byte spare area - defines minimum read/write granularity and ECC sector boundary |
| Block Size | 128 KB (32 pages) - unit of erase operation; impacts wear leveling granularity and update latency |
| Vcc Supply | 1.7V–1.95V core voltage - enables low-power operation in battery-backed or energy-constrained edge nodes |
| ECC Engine | On-die BCH-24 corrects up to 24 bit errors per 1,024-byte sector - eliminates need for host-side ECC logic |
| Operating Temp | −40°C to +85°C - qualified for industrial control, automotive telematics, and outdoor infrastructure |
Pinout & Package
W25N02KWTCIU TR is housed in an 8-pin 6 × 5 mm WSON (Wettable Flank) package with exposed thermal pad, optimized for automated optical inspection (AOI) and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Drives internal state machine; supports up to 104 MHz; requires clean edge timing for QPI mode stability |
| IO0–IO3 | Quad I/O bidirectional data lines | Shared for command/address/data in QPI mode; support pull-up/pull-down configuration per JEDEC spec |
| CS# | Chip select (active-low) | Enables device communication; must be asserted before CLK starts and held stable during transaction |
| WP# | Write protect (active-low) | Hardware lock for status register and block protection bits; overrides software write-enable commands |
| HOLD# | Hold input (active-low) | Suspends ongoing serial transfer without resetting internal address counter; used for bus arbitration |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI (QPI) Mode | Reduces instruction overhead and doubles effective bandwidth vs standard SPI, critical for OTA firmware updates |
| On-Die ECC (BCH-24) | Eliminates host CPU load for error correction and avoids external ECC IC, simplifying BOM and layout |
| Program/Erase Suspend | Allows read access during background program/erase - enables real-time logging while updating firmware partitions |
| Deep Power-Down Mode | 2 µA max standby current extends battery life in always-on edge sensors and remote monitoring units |
| JEDEC JESD218B Compliance | Standardized bad-block reporting and endurance metrics enable predictable field-life modeling for industrial deployments |
Applications
| Industrial PLC Firmware Storage | Smart Meter Data Logging |
|---|---|
Use Scenario: Storing boot code, application firmware, and configuration tables in programmable logic controllers operating in factory-floor environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with fast random read and sequential write; supports secure firmware rollback via dual-image partitioning. Use Value: On-die ECC ensures firmware integrity over 100K program/erase cycles; 1.8V operation reduces system-level power conversion complexity. |
Use Scenario: Capturing time-stamped consumption data, event logs, and tamper alerts in utility smart meters with 10+ year field life requirements. IC Role / Device Role / Timing Role: High-reliability data logger with wear leveling and bad-block remapping; handles burst writes during meter reading cycles. Use Value: JEDEC JESD218B compliance provides standardized endurance reporting; deep power-down mode cuts quiescent current below 5 µA. |
| Medical Edge Gateway Boot Memory | Automotive ADAS Camera Buffer |
Use Scenario: Hosting bootloader and secure boot keys in HIPAA-compliant medical edge gateways that aggregate patient sensor data before cloud upload. IC Role / Device Role / Timing Role: Trusted boot storage with hardware write protection (WP# pin + SRWD bit) preventing unauthorized firmware modification. Use Value: Hardware-based write protection meets IEC 62304 safety requirements; quad-SPI enables <500 ms boot time from cold start. |
Use Scenario: Temporary frame buffering in automotive surround-view camera ECUs where high-speed video capture must survive brief power interruptions. IC Role / Device Role / Timing Role: High-throughput sequential write buffer supporting 60 MB/s sustained write for 1080p60 video streams. Use Value: Program/erase suspend allows concurrent video capture and metadata logging; 128KB block erase minimizes write amplification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | 2Gb density, 3.3V-only Vcc, no on-die ECC - requires host-side BCH-12 implementation | Limited to cost-sensitive consumer designs where ECC can be handled by application processor | Select only if existing 3.3V rail eliminates need for level-shifting and host has ECC acceleration |
| Micron MT29F2G01ABAGDWB | 2Gb density, 1.8V/3.3V dual-Vcc, on-die BCH-24, but uses 16-pin TSOP package - larger footprint and no wettable flank | Suitable for legacy industrial boards with TSOP sockets or manual rework constraints | Prefer only when board redesign for WSON is not feasible; higher thermal resistance limits sustained write duty cycle |
Compared with W25N02KWTCIU TR, the MX35LF2GE4AB lacks integrated ECC and requires additional host resources, while the MT29F2G01ABAGDWB offers identical ECC capability but sacrifices space efficiency and AOI compatibility due to its TSOP packaging.
Availability
W25N02KWTCIU TR is available at Aetrix Electronics and suitable for industrial IoT gateways, smart metering systems, and medical edge devices requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for W25N02KWTCIU TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash and SRAM, with ISO/TS 16949 and ISO 14001 certifications.
The W25N series targets embedded systems needing high-density, low-voltage serial NAND with robust data integrity - designed specifically for industrial, automotive, and medical applications demanding extended temperature operation and JEDEC reliability compliance.
FAQ
What is the maximum clock frequency supported by W25N02KWTCIU TR in quad SPI mode?
The W25N02KWTCIU TR supports up to 104 MHz in quad SPI (QPI) mode, delivering a theoretical peak throughput of 416 MB/s. This frequency is validated across the full industrial temperature range (−40°C to +85°C) and requires controlled impedance routing and proper termination per Winbond's AN-201-01 layout guidelines. The W25N02KWTCIU TR datasheet specifies tCH and tCL minimum pulse widths to ensure reliable sampling.
Does W25N02KWTCIU TR include built-in error correction, and how is it implemented?
Yes, W25N02KWTCIU TR integrates a hardware BCH-24 ECC engine that corrects up to 24 bit errors per 1,024-byte sector within the 4KB page. It operates transparently during read operations and requires no host intervention. The W25N02KWTCIU TR automatically manages ECC syndrome generation and correction, eliminating the need for external ECC ICs or software-based correction routines - a key differentiator versus legacy serial NAND devices.
Can W25N02KWTCIU TR be used in systems with only a 3.3V supply rail?
No - W25N02KWTCIU TR requires a 1.7V–1.95V core supply (Vcc) and is not 3.3V-tolerant. While its I/O pins support 1.8V operation, interfacing with a 3.3V microcontroller requires level-shifting circuitry on all signal lines (CLK, CS#, IO0–IO3, WP#, HOLD#). Using W25N02KWTCIU TR directly with a 3.3V host violates absolute maximum ratings and risks permanent damage. Always verify Vcc compliance before integration.
How does W25N02KWTCIU TR handle bad blocks, and is remapping automatic?
W25N02KWTCIU TR performs factory bad-block marking during test and supports dynamic bad-block detection during program/erase cycles. Bad-block information is stored in the first two pages of each block, and the device automatically skips marked blocks during read/write/erase commands. Host firmware must implement logical-to-physical address translation using Winbond's recommended bad-block management algorithm - the W25N02KWTCIU TR does not perform transparent remapping like managed NAND.
Is W25N02KWTCIU TR compatible with standard SPI controllers, or does it require a dedicated NAND controller?
W25N02KWTCIU TR is SPI-command-compatible and works with standard SPI peripherals - no dedicated NAND controller is required. However, host firmware must implement NAND-specific functions: page-aligned addressing, block erase sequencing, status polling, and bad-block management. Unlike eMMC or UFS, the W25N02KWTCIU TR exposes raw NAND geometry and relies on host-level FTL logic for wear leveling and logical block addressing.
W25N02KWTCIU TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N02KWTCIU TR FAQ
1.How can I place an order for W25N02KWTCIU TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KWTCIU TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KWTCIU TR reliable?
The price and inventory of W25N02KWTCIU TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KWTCIU TR is usually 5 days.
3.What payment methods are accepted for W25N02KWTCIU TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KWTCIU TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KWTCIU TR?
W25N02KWTCIU TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KWTCIU TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KWTCIU TR?
For technical support, including W25N02KWTCIU TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KWTCIU TR requirements.
6.How does Aetrix verify that W25N02KWTCIU TR is sourced from the original manufacturer or authorized distributors?
All W25N02KWTCIU TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KWTCIU TR meets industry standards.
7.What is the process for return or replacement of W25N02KWTCIU TR?
All W25N02KWTCIU TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KWTCIU TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KWTCIU TR part is unused and in its original packaging.
Return procedure for W25N02KWTCIU TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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