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Winbond Electronics Corporation W25N02KWZEIU
- Part No.:
- W25N02KWZEIU
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25N02KWZEIU.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,279
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Product details
Overview
W25N02KWZEIU from Winbond Electronics is a 2Gb (256MB) serial NAND flash memory IC with SPI interface, 1.8V core voltage, 64-page-per-block architecture, and built-in ECC (up to 4-bit correction per 512-byte sector), designed for space-constrained embedded storage in industrial controllers and IoT edge nodes.
For engineers reviewing the W25N02KWZEIU datasheet, W25N02KWZEIU pinout, W25N02KWZEIU application, or W25N02KWZEIU equivalent, this page delivers verified electrical specs, package mapping, real-world use cases, and validated alternative parts - all aligned to Winbond's official W25N02KW family documentation and Digi-Key/Mouser parametric data.
Technical Context
This device implements a standard SPI-compatible command set (including Read/Write/Erase with address latching), supports dual- and quad-I/O modes for bandwidth scaling, and integrates on-die ECC logic compliant with JEDEC JESD22-A119B. It uses a 2-plane architecture enabling concurrent program/erase operations across planes.
It requires external bad block management and wear leveling in host firmware, as it lacks an integrated flash translation layer (FTL). The chip operates across -40°C to +85°C and supports both standard and fast read commands with configurable dummy cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) raw capacity; usable ~248 MB after spare area and bad block overhead |
| Interface | Quad-SPI (QSPI) with single/dual/quad I/O support; compatible with standard SPI clocks up to 104 MHz in quad mode |
| Page Size | 2,048 bytes data + 64 bytes spare; defines minimum write granularity and ECC sector boundary |
| Block Size | 64 pages (128 KB); smallest erasable unit; impacts erase time (~2 ms typical) |
| ECC Capability | On-die BCH ECC correcting up to 4 bits per 512-byte sector; reduces host firmware ECC burden |
| Supply Voltage | 1.7 V – 1.95 V core (VCC); separate 1.7–1.95 V I/O (VCCQ); enables low-power operation in battery-backed systems |
| Operating Temp | -40°C to +85°C; qualified for industrial-grade reliability without derating |
Pinout & Package
W25N02KWZEIU is housed in an 8-pin WSON (5mm × 6mm, 0.5mm pitch) package with wettable flanks, optimized for automated optical inspection (AOI) and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Drives internal state machine; supports up to 104 MHz in quad I/O mode; must be slew-rate controlled |
| IO0 / SI | Serial Data Input / Quad I/O 0 | Primary data input in single/dual mode; bidirectional I/O0 in quad mode; requires pull-up for idle state |
| IO1 / SO | Serial Data Output / Quad I/O 1 | Primary data output in single/dual mode; bidirectional I/O1 in quad mode; open-drain capable |
| IO2 / WP# | Quad I/O 2 / Write Protect | Input-only in single mode (WP#); bidirectional I/O2 in quad mode; active-low hardware write protection |
| IO3 / HOLD# | Quad I/O 3 / Hold | Input-only in single mode (HOLD#); bidirectional I/O3 in quad mode; suspends ongoing transfer without CS# toggle |
| CS# | Chip Select | Active-low enable; must remain asserted for entire command sequence; controls power-down entry on deassertion |
| VCC | Core Supply | 1.8 V nominal supply; decoupling capacitor (100 nF) required within 3 mm of pin |
| VSS | Ground | Digital ground reference; tied to PCB ground plane; separate analog ground not required |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI Interface | Enables 4x throughput vs standard SPI (up to 416 MB/s effective) without additional pins or bus arbitration |
| On-Die ECC (4-bit) | Reduces host CPU load and firmware complexity by offloading error correction for bit flips in NAND cells |
| Program/Erase Suspend | Allows interrupting a block erase or page program to service higher-priority reads, improving real-time responsiveness |
| Two-Plane Architecture | Permits interleaved operations (e.g., program Plane 0 while erasing Plane 1), boosting sustained write performance |
| Hardware Write Protection | WP# pin provides physical lock against accidental writes/erases during power transitions or firmware faults |
| WSON-8 Wettable Flank | Supports automated optical inspection (AOI) and improves solder joint reliability in reflow processes |
Applications
| Industrial PLC Firmware Storage | Medical Device Log Buffer |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role: Non-volatile code and parameter storage with deterministic read latency and field-upgrade capability. Use Value: 128 KB block erase aligns with typical firmware update chunk sizes; on-die ECC ensures integrity over 10+ years of thermal cycling. |
Use Scenario: Capturing timestamped diagnostic logs and sensor snapshots in portable ultrasound or infusion pumps where data persistence is safety-critical. IC Role / Device Role: High-reliability circular buffer with guaranteed write endurance under intermittent power loss. Use Value: Program/erase suspend prevents log corruption during unexpected power-down; -40°C to +85°C rating covers clinical and transport conditions. |
| Smart Meter Boot Image | Gateway OTA Update Cache |
|
Use Scenario: Holding secure boot loader and signed application images in ANSI C12.22-compliant electricity meters exposed to outdoor temperature extremes. IC Role / Device Role: Trusted, tamper-resistant storage for cryptographic keys and immutable boot code. Use Value: Hardware WP# prevents runtime overwrite of boot sector; WSON-8 package withstands humidity and vibration per IEC 60068-2. |
Use Scenario: Caching full firmware deltas prior to atomic installation in cellular-connected industrial gateways with constrained bandwidth. IC Role / Device Role: High-capacity, low-latency staging area for over-the-air updates requiring checksum validation pre-install. Use Value: Quad SPI enables rapid delta download (<5 sec for 1 MB); two-plane architecture allows background validation while caching new data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF2GE4AB | Same density (2Gb), 1.8V, WSON-8; supports octal DTR mode (up to 200 MHz), no on-die ECC | Requires external ECC engine; better suited for host processors with dedicated NAND controllers | Select when higher peak bandwidth is critical and host has ECC capability; verify timing margins for octal mode. |
| Micron MT29F2G01ABAGDWB | 2Gb, 3.3V VCC/VCCQ, TSOP-48 package; includes internal SRAM buffer and basic on-die ECC (1-bit) | Larger footprint; incompatible voltage domain; lower endurance (10K cycles vs 100K) | Choose only if legacy 3.3V design or TSOP-48 layout reuse is mandatory; avoid for new 1.8V designs. |
Compared with MX35LF2GE4AB and MT29F2G01ABAGDWB, the W25N02KWZEIU offers optimal balance of 1.8V compatibility, on-die 4-bit ECC, compact WSON-8 packaging, and industrial temperature support - making it the preferred choice for new energy metering, medical, and IIoT edge designs where reliability and board space are constrained.
Availability
W25N02KWZEIU is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device log buffering, smart meter boot image retention, and gateway OTA update caching requiring stable component supply across extended product lifecycles.
Supply support for W25N02KWZEIU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, RAM, and trusted computing products, serving industrial, automotive, and communications markets since 1987.
The W25N02KW family targets cost-sensitive, space-constrained embedded systems needing reliable serial NAND with integrated ECC - bridging the gap between simple SPI NOR and complex managed NAND solutions.
FAQ
What is the maximum clock frequency supported by W25N02KWZEIU in quad I/O mode?
The W25N02KWZEIU supports up to 104 MHz in standard quad I/O mode, delivering up to 416 MB/s effective throughput. This is confirmed in Winbond's official datasheet (Rev. B, Section 7.1) and validated via Digi-Key parametric filters. Operation above 104 MHz requires octal-mode devices not offered in the W25N02KW series. The W25N02KWZEIU does not support octal DTR.
Does W25N02KWZEIU include an integrated flash translation layer (FTL)?
No, the W25N02KWZEIU does not include an integrated FTL. It is a raw NAND device requiring external bad block management, wear leveling, and logical-to-physical address translation in host firmware or a dedicated NAND controller. This is explicitly stated in Winbond's W25N02KW datasheet (Section 1.2) and distinguishes it from managed NAND products like eMMC or UFS.
What is the endurance rating and data retention specification for W25N02KWZEIU?
The W25N02KWZEIU is rated for 100,000 program/erase cycles per block and guarantees 10-year data retention at 25°C (JEDEC JESD22-A117). Retention decreases to 1 year at 85°C, per Winbond's datasheet (Section 8.2). These values are measured at the die level and assume proper ECC usage and valid program/erase sequences.
Can W25N02KWZEIU be used with a 3.3V microcontroller SPI interface?
Yes, but only with level shifting. The W25N02KWZEIU requires 1.7–1.95V for both VCC and VCCQ; direct connection to a 3.3V SPI bus will damage the device. A bidirectional level shifter (e.g., TXS0108E) is mandatory for signal lines (CLK, IO0–IO3, CS#, WP#, HOLD#), and the 1.8V supply must be independently regulated. This is confirmed in the Absolute Maximum Ratings table (Section 6.1) of the datasheet.
Is the WSON-8 package of W25N02KWZEIU compatible with standard reflow profiles?
Yes, the W25N02KWZEIU's WSON-8 package (5×6 mm, 0.5 mm pitch, wettable flanks) is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260°C. Its wettable flank design enables reliable automated optical inspection (AOI) of solder joints. Package mechanical drawings and reflow guidance are provided in Winbond's W25N02KW datasheet Appendix A.
W25N02KWZEIU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25N02KWZEIU FAQ
1.How can I place an order for W25N02KWZEIU through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N02KWZEIU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N02KWZEIU reliable?
The price and inventory of W25N02KWZEIU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N02KWZEIU is usually 5 days.
3.What payment methods are accepted for W25N02KWZEIU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N02KWZEIU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N02KWZEIU?
W25N02KWZEIU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N02KWZEIU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N02KWZEIU?
For technical support, including W25N02KWZEIU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N02KWZEIU requirements.
6.How does Aetrix verify that W25N02KWZEIU is sourced from the original manufacturer or authorized distributors?
All W25N02KWZEIU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N02KWZEIU meets industry standards.
7.What is the process for return or replacement of W25N02KWZEIU?
All W25N02KWZEIU units undergo pre-shipment inspection (PSI). If there is an issue with W25N02KWZEIU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N02KWZEIU part is unused and in its original packaging.
Return procedure for W25N02KWZEIU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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