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Winbond Electronics Corporation W25N04KVTCIR

Part No.:
W25N04KVTCIR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25N04KVTCIR.pdf
Description:
IC FLASH 4GBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,231

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Product details

Overview

W25N04KVTCIR from Winbond is a 4G-bit (512MB) SLC QspiNAND Flash memory IC supporting Dual/Quad SPI interfaces, 104MHz clock rate, on-chip 8-bit ECC, and 128KB uniform block erase - deployed in embedded boot code storage, firmware update partitions, and industrial data logging systems.

For engineers reviewing the W25N04KVTCIR datasheet, W25N04KVTCIR pinout, W25N04KVTCIR application, or W25N04KVTCIR equivalent, key selection criteria include buffer vs. sequential read mode configuration, /WP and /HOLD functional mode dependency on SR-1 settings, OTP page programmability, and TFBGA-24 (6x4 ball array) mechanical compatibility with high-density PCB layouts.

Technical Context

The W25N04KVTCIR implements a QspiNAND architecture combining SPI command set compatibility with NAND-style page/block organization: 262,144 × 2,048-byte pages, 2,048 erasable 128KB blocks, and internal 2,048-byte buffer for single-page programming. It supports three operational modes - Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3) - with Fast Read Quad I/O achieving up to 416MHz equivalent throughput.

Its register system includes volatile and OTP-lockable Protection Register (SR-1), volatile Configuration Register (SR-2) with ECC-E, BUF, and ODS bits, and status-only SR-3 reporting ECC bit-flip counts and P-FAIL/E-FAIL flags. The /WP and /HOLD pins serve dual roles: dedicated control inputs in Standard/Dual mode, but repurposed as IO2/IO3 in Quad mode when WP-E = 0.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 G-bit (512 MByte), organized as 262,144 × 2,048-byte pages
Interface Support Standard/Dual/Quad SPI with 104 MHz max CLK; supports Fast Read Quad I/O (6Bh/6Ch) at 416 MHz equivalent
Erase/Program Endurance 60,000 cycles per block, enabling long-life firmware partitioning in field-deployed devices
Data Retention 10 years at +85°C, validated for industrial temperature-grade operation
ECC Capability On-chip 8-bit ECC with real-time status reporting (ECC-1/ECC-0, BFD/BFS/BFR registers)
Power Supply Single 2.7 V to 3.6 V supply; 25 mA active, 20 µA standby, 2 µA deep power-down current
Operating Temperature –40°C to +105°C (Industrial Plus Grade), suitable for extended thermal environments

Pinout & Package

W25N04KVTCIR uses the 24-ball TFBGA 8×6-mm package with 6×4 ball array (package code TC), compliant with JEDEC MO-270AB. Pin assignments follow standard SPI signal mapping with multiplexed I/O functionality dependent on instruction mode.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; must transition high→low after power-up before instruction acceptance
CLK Serial Clock Input Drives all SPI timing; supports up to 104 MHz; rising edge for input, falling edge for output
DI (IO0) Data Input / Quad I/O 0 Unidirectional input in Standard SPI; bidirectional in Dual/Quad mode; used for instruction/address/data load
DO (IO1) Data Output / Quad I/O 1 Unidirectional output in Standard SPI; bidirectional in Dual/Quad mode; carries read data/status
/WP (IO2) Write Protect Input / Quad I/O 2 Hardware write-protection enabler when WP-E=1; otherwise functions as IO2 in Quad mode
/HOLD (IO3) Hold Input / Quad I/O 3 Pauses Standard/Dual SPI transfers when low; repurposed as IO3 during Quad operations
VCC Power Supply 2.7–3.6 V supply; decoupling required per layout guidelines to maintain AC timing integrity
GND Ground Reference for all I/O and internal circuitry; requires low-impedance connection to minimize noise coupling

Key Features

Feature Design Value
Sequential Read Mode (BUF=0) Enables full-array access with single Read command, eliminating address increment overhead in streaming applications
Configurable ECC Enable (ECC-E) Volatile bit in SR-2 allowing runtime activation/deactivation of on-chip 8-bit ECC correction for memory reads
OTP Page Provisioning Ten 2,048-byte One-Time-Programmable pages for secure keys, calibration data, or device-specific parameters
Flexible Write Protection Combines software (BP[3:0], SRP[1:0]) and hardware (/WP pin) protection, with OTP-lockable SR-1 for permanent lockdown
Deep Power-Down (B9h) Reduces current to 2 µA while retaining memory state; exit via ABh with guaranteed 100 µs wake-up latency

Applications

Industrial PLC Firmware Storage Medical Device Boot Image

Use Scenario: Storing certified boot firmware and safety-critical application binaries in DIN-rail mounted controllers with no field reprogramming required.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable Dual/Quad SPI interface for deterministic cold-start execution.

Use Value: 10-year data retention at +105°C ensures firmware integrity across extended product lifecycles without refresh cycles.

Use Scenario: Hosting immutable bootloader and regulatory-compliant diagnostic firmware in portable ultrasound and infusion pumps.

IC Role / Device Role / Timing Role: Secure firmware vault using OTP pages for cryptographic keys and ECC-protected read paths for audit-trail logs.

Use Value: On-chip 8-bit ECC prevents silent corruption of life-critical firmware, meeting IEC 62304 Class C reliability requirements.

Smart Meter Data Logging Automotive Telematics OTA Partition

Use Scenario: Recording time-stamped energy consumption metrics in ANSI C12.19-compliant meters with 15+ year field deployment.

IC Role / Device Role / Timing Role: High-endurance NAND flash managing wear-leveling via host-controlled 128KB block erase and page-program sequencing.

Use Value: 60,000 program/erase cycles support daily logging over 16 years without block exhaustion.

Use Scenario: Isolating signed OTA update packages in automotive infotainment gateways requiring AEC-Q100 compliance.

IC Role / Device Role / Timing Role: Dedicated update partition accessed via Quad SPI at 416 MHz equivalent speed for sub-second firmware validation.

Use Value: Sequential Read Mode enables rapid checksum verification of full 512MB image without address management overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QspiNAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Macronix MX35LF4GEIM-12G Same 4G-bit density, 104MHz Quad SPI, but lacks configurable Sequential Read Mode and has fixed 4KB page size vs. W25N04KVTCIR's 2KB page + 128KB block structure Requires host-side address translation for legacy SPI NAND drivers; no native buffer/sequential mode toggle Select when migrating from existing Macronix-based designs with minimal firmware changes; verify ECC handling differs (external vs. on-chip)
Micron MT29F4G08ABBDAH4-IT 4G-bit SLC NAND with x8 parallel interface only; no SPI support - requires NAND controller and external ECC engine Not pin-compatible or protocol-compatible; demands full hardware redesign including controller, timing, and error management logic Choose only if migrating from legacy parallel NAND platforms where SPI interface is not required and board space allows larger footprint

Compared with MX35LF4GEIM-12G, W25N04KVTCIR offers superior flexibility via user-configurable BUF bit and integrated ECC registers; versus MT29F4G08ABBDAH4-IT, it eliminates external controller dependency and reduces BOM count by embedding SPI protocol logic and ECC correction.

Availability

W25N04KVTCIR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot image hosting, and smart meter data logging requiring stable component supply across extended product lifecycles.

Supply support for W25N04KVTCIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND, mobile DRAM, and code storage flash products.

The W25N QspiNAND product line targets space-constrained embedded systems needing NAND density with SPI simplicity - designed specifically for code shadowing, XIP execution, and firmware update partitioning without external controllers.

FAQ

What is the package type and footprint of W25N04KVTCIR?

W25N04KVTCIR uses the 24-ball TFBGA 8×6-mm package with 6×4 ball array (JEDEC MO-270AB, package code TC). Its footprint matches standard 0.5-mm pitch TFBGA layouts and is compatible with automated SMT assembly. The pinout supports SPI signal routing with /WP and /HOLD repurposed as IO2/IO3 in Quad mode - requiring careful PCB signal assignment per the datasheet's Figure 1b and Section 3.4.

Does W25N04KVTCIR support execute-in-place (XIP) operation?

Yes, W25N04KVTCIR supports XIP via Dual/Quad SPI interfaces, enabling direct code execution from flash without copying to RAM. This is confirmed in Section 1 of the datasheet, which states it is "ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)." Performance is optimized using Fast Read Quad I/O instructions (6Bh/6Ch) at up to 416 MHz equivalent throughput.

How does the /WP pin function in W25N04KVTCIR, and can it be disabled?

The /WP pin in W25N04KVTCIR operates in two modes controlled by the WP-E bit in Status Register-1: when WP-E = 0, it serves as IO2 in Quad SPI and provides software-based SR-1 protection; when WP-E = 1, it becomes a dedicated active-low hardware write-protect input disabling all program/erase functions. It cannot be fully disabled but its role is configurable - no external pull-up/down is required unless holding a specific logic state during power-up.

What is the purpose of the BUF bit in W25N04KVTCIR's Configuration Register?

The BUF bit (bit 7 of Status Register-2) selects between Buffer Read Mode (BUF = 1, default) and Sequential Read Mode (BUF = 0). In Sequential Read Mode, a single Read command accesses the entire memory array contiguously, eliminating per-page address overhead - critical for high-throughput streaming applications like firmware validation or log retrieval. This mode is explicitly documented in Sections 1 and 7.2.7.

Can W25N04KVTCIR's OTP pages be erased or rewritten after programming?

No, W25N04KVTCIR's ten 2,048-byte OTP pages are one-time programmable: once written, they cannot be erased or modified. Programming is performed using standard SPI commands (e.g., Load Program Data + Program Execute) under OTP-E = 1 mode, as defined in Section 8.2.23. The OTP-L bit (SR-2, bit 7) permanently locks the OTP region after initial programming, preventing accidental overwrite.

W25N04KVTCIR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
250µs
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25N04KVTCIR FAQ

1.How can I place an order for W25N04KVTCIR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N04KVTCIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N04KVTCIR reliable?

The price and inventory of W25N04KVTCIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N04KVTCIR is usually 5 days.

3.What payment methods are accepted for W25N04KVTCIR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N04KVTCIR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N04KVTCIR?

W25N04KVTCIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N04KVTCIR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N04KVTCIR?

For technical support, including W25N04KVTCIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N04KVTCIR requirements.

6.How does Aetrix verify that W25N04KVTCIR is sourced from the original manufacturer or authorized distributors?

All W25N04KVTCIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N04KVTCIR meets industry standards.

7.What is the process for return or replacement of W25N04KVTCIR?

All W25N04KVTCIR units undergo pre-shipment inspection (PSI). If there is an issue with W25N04KVTCIR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N04KVTCIR part is unused and in its original packaging.

Return procedure for W25N04KVTCIR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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