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Winbond Electronics Corporation W25N04KVTCIR TR
- Part No.:
- W25N04KVTCIR TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N04KVTCIR TR.pdf
- Description:
- IC FLASH 4GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,290
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Product details
Overview
W25N04KVTCIR TR from Winbond is a 4G-bit (512MB) SLC QspiNAND Flash memory IC designed for embedded storage in space-constrained systems. It supports Standard/Dual/Quad SPI interfaces, delivers up to 50 MB/s sequential read throughput, operates from 2.7–3.6 V, and features on-chip 8-bit ECC, 128KB uniform block erase, and 60,000 program/erase cycles - deployed in code shadowing, XIP execution, and firmware/data logging applications.
For engineers reviewing the W25N04KVTCIR TR datasheet, W25N04KVTCIR TR pinout, W25N04KVTCIR TR application, or W25N04KVTCIR TR equivalent, key selection considerations include SPI mode compatibility (BUF/SEQ read modes), ECC enablement and reporting, /WP and /HOLD functional behavior under WP-E bit configuration, and package-specific I/O mapping between WSON-8 and TFBGA-24 variants.
Technical Context
The W25N04KVTCIR TR implements a QspiNAND architecture combining NAND flash density with SPI protocol simplicity. Its memory array comprises 262,144 pages × 2,048 bytes, organized into 2,048 erasable 128KB blocks. Dual/Quad I/O operation enables 208 MHz (Dual) and 416 MHz (Quad) effective data rates using Fast Read instructions.
It integrates three volatile status registers (SR-1/SR-2/SR-3) and extended ECC registers (BFD/BFS/BFR/MBF) for real-time bit-flip monitoring and correction control. Configuration is managed via SPI commands including Write Status Register (1Fh/01h), with OTP-lockable protection bits (BP3–BP0, SRP1/SRP0) and programmable features like ECC-E, BUF, H-DIS, and ODS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 G-bit (512 MByte) SLC NAND array, enabling compact firmware/image storage without external controller |
| Interface Support | Standard/Dual/Quad SPI with CLK up to 104 MHz; supports Fast Read Quad I/O (6Bh/6Ch) for 416 MHz effective rate |
| Data Transfer Rate | 50 MB/s sequential read in Buffer Read mode (BUF=1), critical for boot-time code loading and streaming |
| Erase/Program Endurance | 60,000 program/erase cycles per block, ensuring long-term reliability in field-updatable embedded systems |
| Data Retention | 10 years at +85°C, validated for industrial temperature-grade operation without refresh |
| On-Chip ECC | Configurable 8-bit internal ECC with status reporting (ECC-1/ECC-0, BFS, BFR), reducing host-side error-handling overhead |
| Power Consumption | 25 mA active, 20 µA standby, 2 µA deep power-down - suitable for battery-backed or low-quiescent IoT nodes |
Pinout & Package
W25N04KVTCIR TR is supplied in an 8-pad WSON 8×6-mm package (JEDEC MO-255, package code ZE), with exposed thermal pad. Pin functions are fully defined for Standard/Dual/Quad SPI operation, with /WP and /HOLD repurposed as IO2/IO3 in Quad mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; device enters standby when high; required high-to-low transition after power-up to accept instructions |
| DI (IO0) | Serial Data Input / Quad I/O 0 | Input for Standard/Dual SPI; bidirectional I/O0 in Quad mode; used for instruction/address/data load |
| DO (IO1) | Serial Data Output / Quad I/O 1 | Output for Standard/Dual SPI; bidirectional I/O1 in Quad mode; carries read data/status during falling CLK edge |
| /WP (IO2) | Write Protect Input / Quad I/O 2 | Hardware write-protection control when WP-E=1; becomes IO2 in Quad mode when WP-E=0 |
| /HOLD (IO3) | Hold Input / Quad I/O 3 | Pauses Standard/Dual SPI transfers when low; becomes IO3 in Quad mode; requires external pull-up to avoid float |
| CLK | Serial Clock Input | Drives all SPI timing; rising edge for input, falling edge for output; supports up to 104 MHz frequency |
| VCC | Power Supply | 2.7–3.6 V single supply; powers core logic, charge pump, and I/O buffers |
| GND | Ground | Reference for all signals and internal voltage regulation; must be low-impedance connection |
Key Features
| Feature | Design Value |
|---|---|
| Sequential Read Mode (BUF=0) | Enables full-array access with single Read command - eliminates address incrementing overhead in streaming use cases |
| Configurable ECC Enable (ECC-E) | Volatile bit controlling on-chip 8-bit correction; ECC status (ECC-1/ECC-0) and bit-flip counters (BFR/MBF) support runtime health monitoring |
| OTP Protection Lock (SR1-L, OTP-L) | One-time-programmable lock bits prevent reconfiguration of status register protection and OTP page programming |
| Dual/Quad I/O Flexibility | Same physical pins serve multiple roles: /WP and /HOLD become IO2/IO3 in Quad mode, simplifying PCB routing vs. parallel NAND |
| Hardware Write Protection (WP-E=1) | When /WP tied low, entire device (array, registers, OTP) becomes read-only - no software bypass possible |
Applications
| Industrial HMI Firmware Storage | Automotive Telematics Log Buffer |
|---|---|
|
Use Scenario: Storing boot firmware, UI assets, and configuration profiles in panel-mounted HMIs operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable Dual/Quad SPI interface for fast GUI rendering and OTA update staging. Use Value: 50 MB/s sequential read and 60K P/E cycles ensure responsive UI boot and multi-year field reliability without external ECC controller. |
Use Scenario: Capturing CAN bus diagnostics, GPS traces, and sensor logs in automotive telematics gateways with limited board area. IC Role / Device Role / Timing Role: High-density, low-pin-count NAND replacement supporting buffered writes and ECC-managed endurance for cyclic logging. Use Value: On-chip 8-bit ECC and 128KB uniform erase simplify host firmware while meeting AEC-Q100-relevant data integrity requirements. |
| IoT Edge Gateway Boot Memory | Medical Device Parameter Archive |
|
Use Scenario: Hosting Linux kernel, rootfs, and secure bootloader in compact cellular/Wi-Fi edge gateways with strict power budgets. IC Role / Device Role / Timing Role: Primary boot medium accessed via Quad SPI XIP; leverages Deep Power-Down (1µA) during idle periods. Use Value: 2.7–3.6 V operation and 2 µA standby current extend battery life; BUF/SEQ mode selection optimizes read latency vs. throughput. |
Use Scenario: Archiving calibration coefficients, usage logs, and regulatory audit trails in portable diagnostic equipment requiring 10-year data retention. IC Role / Device Role / Timing Role: Tamper-resistant, long-life storage with OTP pages for immutable calibration data and parameter page for revision-controlled settings. Use Value: Ten 2KB OTP pages and SRP-locked protection registers prevent accidental or malicious overwrite of critical medical parameters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QspiNAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Macronix MX35LF4GEIM-12G | 4G-bit QspiNAND; identical 8x6-mm TFBGA-24 (6x4) and WSON-8 packages; supports 104 MHz CLK but lacks configurable BUF/SEQ mode | No dedicated Sequential Read instruction - requires manual address incrementing for full-array access | Preferred when pinout compatibility and JEDEC ID alignment are prioritized over sequential read optimization |
| Micron MT29F4G08ABAEAWP-AIT | 4G-bit SLC NAND with built-in controller; uses standard ONFI interface, not SPI - requires separate SPI-to-NAND bridge IC | Higher pin count (48-ball TSOP), larger footprint, and external controller dependency increase BOM cost and layout complexity | Only suitable where legacy NAND controller infrastructure exists; not a drop-in replacement for W25N04KVTCIR TR |
Compared with MX35LF4GEIM-12G, W25N04KVTCIR TR offers superior sequential access efficiency via its BUF/SEQ mode; versus MT29F4G08ABAEAWP-AIT, it eliminates controller overhead and reduces system-level component count - making it optimal for SPI-native, space-constrained designs.
Availability
W25N04KVTCIR TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive telematics log buffering, and IoT edge gateway boot memory requiring stable component supply, long-lifecycle assurance, and consistent parametric performance across temperature grades.
Supply support for W25N04KVTCIR TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for consumer, industrial, and automotive markets.
The W25N QspiNAND product line was engineered to replace parallel NAND in resource-constrained systems by integrating NAND density with SPI simplicity - targeting embedded boot, firmware storage, and data logging where pin count, power, and PCB area are critical.
FAQ
What is the difference between Buffer Read and Sequential Read modes in W25N04KVTCIR TR?
Buffer Read mode (BUF=1, default) loads one page (2,048 bytes) into the internal buffer for random access; Sequential Read mode (BUF=0) allows continuous read across multiple pages with a single command and auto-incrementing address. This eliminates host-side address management overhead and improves throughput for large data streams - a key differentiator for firmware loading and media playback in W25N04KVTCIR TR.
Does W25N04KVTCIR TR require an external ECC controller?
No. W25N04KVTCIR TR includes configurable on-chip 8-bit ECC with status reporting (ECC-1/ECC-0) and bit-flip counters (BFR/MBF). When ECC-E=1, correction is automatic during read operations; the host can monitor cumulative errors via status registers. This eliminates the need for external ECC logic, reducing BOM cost and design complexity in W25N04KVTCIR TR implementations.
How does the /WP pin function in W25N04KVTCIR TR when WP-E is set to 1?
When WP-E=1 in W25N04KVTCIR TR, the /WP pin becomes a dedicated hardware write-protect input: tying /WP to GND disables all write/program/erase functions - including memory array, status registers, and OTP pages - making the entire device read-only. Quad SPI read operations are also disabled, enforcing strict hardware-level protection that cannot be overridden by software commands.
What package types are supported by W25N04KVTCIR TR?
W25N04KVTCIR TR is qualified in two space-saving packages: 8-pad WSON 8×6-mm (package code ZE) and 24-ball TFBGA 8×6-mm with either 5×5 (TB) or 6×4 (TC) ball arrays. The WSON variant offers lowest profile and thermal resistance; the TFBGA variants provide improved signal integrity for high-speed Quad SPI operation - both share identical pinout functionality and timing specifications.
Can W25N04KVTCIR TR execute code directly from flash (XIP)?
Yes. W25N04KVTCIR TR supports Execute-in-Place (XIP) via Dual and Quad SPI interfaces using Fast Read Dual/Quad I/O instructions (BBh/EBh). With up to 416 MHz effective clock rate and 50 MB/s sequential read bandwidth, it enables low-latency code execution without copying to RAM - ideal for resource-constrained microcontrollers in W25N04KVTCIR TR-based boot and application firmware architectures.
W25N04KVTCIR TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND
- Memory Size:
- 4Gbit
- Memory Organization:
- 512M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 250µs
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N04KVTCIR TR FAQ
1.How can I place an order for W25N04KVTCIR TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N04KVTCIR TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N04KVTCIR TR reliable?
The price and inventory of W25N04KVTCIR TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N04KVTCIR TR is usually 5 days.
3.What payment methods are accepted for W25N04KVTCIR TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N04KVTCIR TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N04KVTCIR TR?
W25N04KVTCIR TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N04KVTCIR TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N04KVTCIR TR?
For technical support, including W25N04KVTCIR TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N04KVTCIR TR requirements.
6.How does Aetrix verify that W25N04KVTCIR TR is sourced from the original manufacturer or authorized distributors?
All W25N04KVTCIR TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N04KVTCIR TR meets industry standards.
7.What is the process for return or replacement of W25N04KVTCIR TR?
All W25N04KVTCIR TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N04KVTCIR TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N04KVTCIR TR part is unused and in its original packaging.
Return procedure for W25N04KVTCIR TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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