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Winbond Electronics Corporation W25N04KVZEIU

Part No.:
W25N04KVZEIU
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25N04KVZEIU.pdf
Description:
IC FLASH 4GBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,945

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Product details

Overview

W25N04KVZEIU from Winbond is a 4G-bit (512MB) SLC QspiNAND Flash memory with Dual/Quad SPI interface, organized as 262,144 × 2,048-byte pages and 2,048 × 128KB erasable blocks. It supports 104MHz SPI clocking, on-chip 8-bit ECC, and dual read modes (Buffer Read and Sequential Read), enabling efficient code shadowing and XIP in space-constrained embedded systems.

For engineers reviewing the W25N04KVZEIU datasheet, W25N04KVZEIU pinout, W25N04KVZEIU application, or W25N04KVZEIU equivalent, key selection considerations include its 8-pin WSON 8×6-mm package (ZE), 2.7–3.6V single-supply operation, JEDEC-compliant ID support, OTP page programmability, and hardware/software write protection flexibility.

Technical Context

The W25N04KVZEIU implements a QspiNAND architecture that merges NAND density with SPI simplicity: it uses standard SPI command sets extended for Dual/Quad I/O, supports both Buffer Read (default) and user-configurable Sequential Read mode via BUF bit in SR-2, and integrates internal ECC logic that reports bit-flip status via ECC-1/ECC-0 and BFD/BFS/BFR registers.

Its pin multiplexing enables mode-dependent functionality: IO0–IO3 serve as DI/DO in Standard/Dual SPI but become full bidirectional data lines in Quad SPI; /WP and /HOLD revert to IO2/IO3 during Quad operations, while their hardware protection roles are controlled by volatile WP-E and OTP-lockable SRP bits in Status Register-1.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 G-bit (512 MByte), organized as 262,144 pages × 2,048 bytes
Interface Support Standard/Dual/Quad SPI with up to 104 MHz CLK; 208/416 MHz effective throughput
Erase/Program Endurance 60,000 cycles per block, with 10-year data retention at +85°C
ECC Capability On-chip 8-bit ECC with real-time status reporting (ECC-1/ECC-0) and bit-flip counters (BFD/BFS/BFR)
Power Supply Single 2.7–3.6 V supply; 25 mA active, 20 µA standby, 2 µA deep power-down current
Operating Temperature –40°C to +85°C (Industrial Grade); +105°C supported in Industrial Plus Grade
Read Throughput Up to 50 MB/s sequential transfer rate using Fast Read Quad I/O instructions

Pinout & Package

W25N04KVZEIU is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252, package code ZE), with exposed thermal pad (non-electrical). Pin functions are fully defined in Winbond's datasheet Figure 1a and Section 3.2.

Pin Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; high-impedance DO and standby current when high
2 DO (IO1) Data Output / I/O1 Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI
3 /WP (IO2) Write Protect Input / I/O2 Hardware lock for SR-1 when WP-E=1; otherwise IO2 in Quad mode
4 GND Ground Reference Primary return path for VCC and I/O signals; requires low-impedance PCB connection
5 DI (IO0) Data Input / I/O0 Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI
6 CLK Serial Clock Input Edge-triggered timing source for all SPI transfers; max 104 MHz
7 /HOLD (IO3) Hold Input / I/O3 Pauses Standard/Dual SPI transfers when low; becomes IO3 in Quad mode
8 VCC Power Supply 2.7–3.6 V single supply; decoupling capacitor required per datasheet layout guidelines

Key Features

Feature Design Value
Sequential Read Mode User-selectable via BUF bit (SR-2); enables full-array access with single Read command, eliminating address overhead
Configurable ECC ECC-E bit enables/disables on-chip 8-bit correction; status registers report real-time bit-flip counts and failure flags
Dual Protection Scheme Combines software (BP[3:0], SRP[1:0]) and hardware (/WP pin + WP-E bit) write protection for granular or full-device lockdown
OTP Programmability Ten 2,048-byte OTP pages; one parameter page; Unique ID page - all permanently programmable, no erase capability
Low-Power Flexibility Deep Power-Down (1 µA typical) with ABh release command; HOLD and WP pins support host-controlled power gating

Applications

Industrial HMI Display Medical Diagnostic Edge Device

Use Scenario: Local storage of firmware images, GUI assets, and calibration tables in panel-mounted HMIs with limited PCB area and no NAND controller.

IC Role / Device Role / Timing Role: Primary non-volatile code/data storage with XIP-capable Dual/Quad SPI interface and on-chip ECC for field reliability.

Use Value: Eliminates external NAND controller and reduces BOM count; 50 MB/s sequential read sustains rapid GUI asset loading without DRAM buffering.

Use Scenario: Secure logging of sensor-acquired patient waveforms and diagnostic metadata in portable ultrasound or ECG units.

IC Role / Device Role / Timing Role: High-integrity data recorder leveraging OTP pages for device-specific calibration keys and ECC for error-resilient long-term storage.

Use Value: On-chip 8-bit ECC ensures waveform integrity over 10+ years; OTP pages prevent unauthorized calibration tampering.

Smart Energy Meter Firmware Automotive Telematics Bootloader

Use Scenario: Storing certified firmware updates and tariff tables in ANSI C12.22-compliant smart meters operating across wide temperature ranges.

IC Role / Device Role / Timing Role: Field-upgradable secure boot storage with hardware write-protection (WP-E=1) and -40°C to +85°C operation.

Use Value: Hardware lockdown prevents accidental or malicious firmware overwrite; 60K-cycle endurance supports lifetime field updates.

Use Scenario: Storing bootloader and secure boot configuration in automotive-grade telematics control units requiring AEC-Q100 compliance.

IC Role / Device Role / Timing Role: Trusted boot source with JEDEC ID verification, unique ID binding, and ECC-protected integrity checks.

Use Value: Unique ID enables cryptographic binding to vehicle VIN; ECC status bits feed into boot-time health validation routines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QspiNAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Macronix MX35LF4GEIM-12G Same 4G-bit SLC QspiNAND density, 104MHz SPI, 8-pin WSON; lacks Sequential Read mode and configurable ECC reporting registers No native sequential access mode; relies on host-managed address incrementing; ECC status less granular (pass/fail only) Choose when Sequential Read mode and detailed ECC diagnostics are not required; verify OTP and parameter page compatibility
Micron MT29F4G08ABAEAWP-AIT 4G-bit SLC NAND with x8 parallel interface; requires external controller; no SPI interface or on-chip ECC engine Needs dedicated NAND controller IC and additional PCB routing; higher pin count and power; no integrated ECC logic Choose only if legacy parallel NAND infrastructure exists; avoid for new SPI-based designs due to complexity and footprint penalty

Compared with MX35LF4GEIM-12G, W25N04KVZEIU adds Sequential Read mode and richer ECC telemetry; versus MT29F4G08ABAEAWP-AIT, it eliminates controller dependency and reduces system-level BOM cost and layout effort.

Availability

W25N04KVZEIU is available at Aetrix Electronics and suitable for industrial HMI displays, medical edge devices, smart energy meters, automotive telematics, and portable instrumentation requiring stable component supply, long-life qualification, and guaranteed traceability.

Supply support for W25N04KVZEIU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for industrial, automotive, and consumer applications.

The W25N QspiNAND product line was designed to replace parallel NAND in resource-constrained embedded systems by delivering NAND density with SPI simplicity, integrated ECC, and flexible protection - targeting code storage, firmware update, and secure data logging.

FAQ

What is the package type and footprint of W25N04KVZEIU?

W25N04KVZEIU uses an 8-pad WSON 8×6-mm package (JEDEC MO-252, package code ZE) with exposed thermal pad. Its footprint matches standard WSON-8 layouts; pin assignments follow Figure 1a in the datasheet, with /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC in clockwise order from top-left. No ball-grid variants apply to this specific part number.

Does W25N04KVZEIU support Quad SPI commands and what is the maximum clock frequency?

Yes, W25N04KVZEIU supports full Quad SPI operation using IO0–IO3 for bidirectional data transfer. It accepts Fast Read Quad I/O (EBh/ECh) and Quad Load Program Data (32h/34h) instructions, with maximum SPI clock frequency of 104 MHz - yielding up to 416 MHz effective throughput (104 MHz × 4) under optimal signal integrity conditions.

How does the Sequential Read Mode work in W25N04KVZEIU and how is it enabled?

W25N04KVZEIU's Sequential Read Mode allows continuous reading across multiple pages with a single Read instruction, bypassing per-page address retransmission. It is enabled by clearing the BUF bit (bit 7) in Status Register-2 (SR-2) via Write Status Register (1Fh) instruction. When BUF=0, the device enters Sequential Read Mode; when BUF=1 (default), it operates in Buffer Read Mode.

What ECC capabilities does W25N04KVZEIU provide and how are ECC errors reported?

W25N04KVZEIU integrates an on-chip 8-bit ECC engine that corrects up to 8 bit errors per 512-byte sector. ECC status is reported via three dedicated status register bits: ECC-1/ECC-0 (cumulative ECC status), P-FAIL/E-FAIL (program/erase failure), and BFD/BFS/BFR registers (bit-flip detection and reporting). These are readable via Status Register-3 (Cxh) and extended ECC registers.

Can W25N04KVZEIU be hardware write-protected, and how is it configured?

Yes, W25N04KVZEIU supports hardware write protection via the /WP pin when WP-E bit (in Status Register-1) is set to 1. With WP-E=1 and /WP tied to GND, all program, erase, and register-write operations are disabled - rendering the entire device read-only, including OTP pages and status registers. This configuration is OTP-lockable for permanent protection.

W25N04KVZEIU Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
250µs
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25N04KVZEIU FAQ

1.How can I place an order for W25N04KVZEIU through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N04KVZEIU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N04KVZEIU reliable?

The price and inventory of W25N04KVZEIU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N04KVZEIU is usually 5 days.

3.What payment methods are accepted for W25N04KVZEIU?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N04KVZEIU transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N04KVZEIU?

W25N04KVZEIU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N04KVZEIU order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N04KVZEIU?

For technical support, including W25N04KVZEIU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N04KVZEIU requirements.

6.How does Aetrix verify that W25N04KVZEIU is sourced from the original manufacturer or authorized distributors?

All W25N04KVZEIU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N04KVZEIU meets industry standards.

7.What is the process for return or replacement of W25N04KVZEIU?

All W25N04KVZEIU units undergo pre-shipment inspection (PSI). If there is an issue with W25N04KVZEIU, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N04KVZEIU part is unused and in its original packaging.

Return procedure for W25N04KVZEIU:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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