Winbond Electronics Corporation W25N04KWTBIR

Overview

W25N04KWTBIR from Winbond is a 4G-bit (512MB) SLC QspiNAND Flash memory IC operating from 1.70V to 1.95V, supporting Standard/Dual/Quad SPI up to 104MHz clock (416MHz equivalent Quad I/O), with on-chip 8-bit ECC, 128KB uniform block erase, and dual read modes (Buffer Read and Sequential Read). It serves as non-volatile storage for code shadowing, XIP execution, and data logging in space-constrained embedded systems.

For engineers reviewing the W25N04KWTBIR datasheet, W25N04KWTBIR pinout, W25N04KWTBIR application, or W25N04KWTBIR equivalent, key selection considerations include its 24-ball TFBGA 8x6-mm (Package Code TB) footprint, hardware/software write protection via /WP and status register bits, 60,000 program/erase cycles, -40°C to +85°C operation, and support for Fast Read Quad I/O with 4-byte addressing.

Technical Context

The W25N04KWTBIR implements a QspiNAND architecture combining SPI command compatibility with NAND-style density and page/block organization: 262,144 × 2,048-byte pages across 4,096 × 128KB blocks. Its dual read mode-configurable via BUF bit in Status Register-2-enables either buffered page access or continuous sequential streaming from any address with a single command.

It integrates configurable internal ECC (ECC-E bit), real-time ECC status reporting (ECC-1/ECC-0, BFD/BFS/BFR registers), and flexible protection: volatile BP[3:0]/TB bits plus OTP-lockable WP-E, SRP[1:0], and SR1-L bits. The /WP and /HOLD pins serve dual roles-dedicated control in Standard/Dual SPI, but repurposed as IO2/IO3 in Quad SPI mode-requiring host firmware coordination.

Key Specifications

Pinout & Package

W25N04KWTBIR uses a 24-ball TFBGA 8×6-mm package (Package Code TB, 5×5 ball array), optimized for high-density PCB layouts with minimal footprint. Pin assignments follow JEDEC MO-270AB standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QspiNAND flash memory applications.

Compared with MX35LF4GEKM, W25N04KWTBIR provides richer ECC telemetry for predictive maintenance; compared with MT29F4G01ABAGDWB, it delivers SPI-native simplicity and proven qualification in industrial temperature grades without controller redesign.

Availability

W25N04KWTBIR is available at Aetrix Electronics and suitable for industrial HMI displays, medical diagnostic loggers, smart energy meters, automotive telematics ECUs, and portable instrumentation requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature compliance.

Supply support for W25N04KWTBIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for consumer, industrial, and automotive markets.

The W25N QspiNAND product line was designed to bridge the density gap between legacy SPI NOR and traditional parallel NAND, delivering NAND economics with SPI simplicity for resource-constrained embedded systems.

FAQ

What is the package type and footprint of W25N04KWTBIR?

W25N04KWTBIR uses a 24-ball TFBGA 8×6-mm package with a 5×5 ball array (Package Code TB). Its compact footprint measures 8 mm × 6 mm with 0.8 mm ball pitch, supporting high-density PCB layouts while maintaining thermal performance across -40°C to +85°C operation. This package is distinct from the 8-pad WSON variant (ZE) and the 6×4 TFBGA variant (TC).

Does W25N04KWTBIR support execute-in-place (XIP) functionality?

Yes, W25N04KWTBIR supports XIP operation via Dual/Quad SPI interfaces, enabling direct code execution from flash without prior copying to RAM. Its Fast Read Dual/Quad I/O instructions achieve up to 416 MB/s effective bandwidth, making it suitable for real-time firmware execution in microcontroller-based systems where RAM is constrained.

How does the /WP pin function in W25N04KWTBIR, and can it be disabled?

The /WP pin in W25N04KWTBIR functions as hardware write protection when WP-E = 1 (Hardware Protection mode), disabling all program/erase operations if tied to GND. When WP-E = 0 (Software Protection mode), /WP acts as IO2 in Quad SPI and only protects Status Register-1. It cannot be fully disabled but its role is dynamically controlled by the WP-E bit in the Protection Register.

What is the difference between Buffer Read and Sequential Read modes in W25N04KWTBIR?

Buffer Read mode (BUF = 1) loads one 2,048-byte page into an internal buffer for random access; Sequential Read mode (BUF = 0) streams data continuously across page boundaries with a single READ command. Sequential Read eliminates inter-page latency, achieving 50 MB/s sustained throughput ideal for audio/video or sensor log playback.

Can W25N04KWTBIR's ECC be disabled, and what happens to corrected data?

Yes, W25N04KWTBIR's on-die ECC is controlled by the ECC-E bit in Status Register-2 and can be disabled. When enabled, corrected data is automatically delivered to the host; uncorrectable errors trigger BUSY timeout and set P-FAIL/E-FAIL flags. ECC status (ECC-1/ECC-0) and bit-flip counters (BFD/BFR) remain readable regardless of ECC-E state.