Winbond Electronics Corporation W25N04KWTBIR TR
- Part No.:
- W25N04KWTBIR TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25N04KWTBIR TR.pdf
- Description:
- IC FLASH 4GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,160
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Product details
Overview
W25N04KWTBIR TR from Winbond is a 1.8V SLC QspiNAND Flash memory IC with 4G-bit (512MB) capacity, organized as 262,144 × 2,048-byte pages and 4,096 × 128KB erase blocks. It supports Standard/Dual/Quad SPI interfaces up to 104MHz clock (416MHz equivalent Quad I/O), delivers 50MB/s sequential read throughput, and integrates on-chip 8-bit ECC for NAND array reliability. It is used in embedded boot storage, firmware code shadowing, and data logging where space-constrained PCBs require high-density non-volatile memory with low-power operation.
For engineers reviewing the W25N04KWTBIR TR datasheet, W25N04KWTBIR TR pinout, W25N04KWTBIR TR application, or W25N04KWTBIR TR equivalent, key selection considerations include its TFBGA-24 (8×6mm, 5×5 ball array, package code TB) footprint, dual/quad SPI command compatibility, buffer vs. sequential read mode configuration (BUF bit), ECC enable control (ECC-E), and hardware/software write protection via /WP and SRP/BP bits.
Technical Context
The W25N04KWTBIR TR implements a QspiNAND architecture that merges SPI serial interface simplicity with NAND flash density and cost efficiency. Its memory array uses SLC (Single-Level Cell) technology, enabling 60,000 program/erase cycles and 10-year data retention at -40°C to +85°C. The device supports two distinct read modes-Buffer Read (default, BUF=1) and Sequential Read (BUF=0)-each with dedicated instruction sets and timing profiles.
It features three volatile status registers (SR-1 to SR-3) and extended ECC registers (BFD, BFS, BFR, MBF/MFS), all accessible via standard SPI commands. Write protection is implemented through a hybrid scheme: software-controlled Block Protect (BP3–BP0) and Status Register Protect (SRP1/SRP0) bits, plus hardware-enforced protection when WP-E=1 and /WP is grounded-disabling all write/erase operations including OTP programming and register updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | SLC QspiNAND Flash - enables high endurance and predictable latency vs. TLC/MLC NAND, suitable for firmware storage. |
| Capacity | 4G-bit (512MByte) - organized as 262,144 pages × 2,048 bytes, supporting efficient page-level programming and 128KB block erases. |
| Interface | Standard/Dual/Quad SPI - compatible with legacy SPI controllers; Quad I/O achieves 416MHz effective bandwidth using IO0–IO3. |
| Operating Voltage | 1.70V to 1.95V - single-supply operation reduces power rail complexity in 1.8V systems; incompatible with 3.3V SPI buses without level shifting. |
| Max Clock Frequency | 104MHz - supports Fast Read Quad I/O (EBh/ECh) for sustained 50MB/s sequential throughput; requires controlled impedance routing. |
| ECC Capability | On-chip 8-bit ECC - corrects up to 8 bit errors per 512-byte sector; status bits (ECC-1/ECC-0) report correction count, enabling host error monitoring. |
| Endurance & Retention | 60,000 P/E cycles / 10-year data retention - validated for industrial temperature range (-40°C to +85°C), critical for unattended embedded deployments. |
Pinout & Package
W25N04KWTBIR TR uses a 24-ball TFBGA package (8×6mm, 5×5 ball array, package code TB), with 8 active signal balls and 16 no-connect (NC) positions. Ball assignments follow JEDEC MO-270DA standard; /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), and /HOLD (IO3) are functional I/Os, while VCC and GND provide power and ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: drives device into high-impedance standby when high; must transition high→low before accepting new instructions after power-up. |
| CLK | Serial Clock Input | Edge-triggered timing reference: rising edge for input (DI/IOx), falling edge for output (DO/IOx); max 104MHz rate defines system throughput ceiling. |
| DI (IO0) | Data Input / Quad I/O 0 | Primary data input in Standard SPI; bidirectional in Dual/Quad modes; used for instruction/address/data loading during program/erase sequences. |
| DO (IO1) | Data Output / Quad I/O 1 | Primary data output in Standard SPI; bidirectional in Dual/Quad modes; carries read data, status, or ID responses depending on instruction context. |
| /WP (IO2) | Write Protect Input / Quad I/O 2 | In Hardware Protection mode (WP-E=1), grounding disables all writes; in Software mode (WP-E=0), functions as IO2 for Quad operations. |
| /HOLD (IO3) | Hold Input / Quad I/O 3 | Pauses Standard/Dual SPI transfers when low; becomes IO3 in Quad mode-must be pulled high externally to avoid floating during Quad reads. |
| VCC | Power Supply | 1.70–1.95V supply: powers core logic and charge pumps; decoupling capacitor required near ball B4 per layout guidelines. |
| GND | Ground | Reference plane for all I/O and internal circuitry; connected to ball B3; requires low-inductance return path to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Sequential Read Mode (BUF=0) | Enables full-array access with one Read command-eliminates address retransmission overhead and improves streaming performance for firmware images or logs. |
| Configurable ECC (ECC-E bit) | Allows host to enable/disable on-chip 8-bit ECC correction per operation-critical for balancing reliability vs. latency in real-time boot paths. |
| Dual/Quad SPI Command Compatibility | Maintains pin and instruction alignment with existing SPI flash designs-enables drop-in migration from serial NOR or earlier QspiNAND parts without firmware rewrite. |
| OTP Pages (10 × 2KB) | Provides immutable storage for calibration data, security keys, or device-specific parameters-programmable once, resistant to accidental overwrite or field update corruption. |
| Deep Power-Down (B9h) | Reduces current to 2µA-ideal for battery-powered IoT nodes requiring multi-year shelf life or infrequent wake-up intervals. |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Archive |
|---|---|
|
Use Scenario: Stores boot loader and OS kernel for ARM-based HMIs in factory automation panels, accessed at power-on before DRAM initialization. IC Role / Device Role / Timing Role: Primary non-volatile boot medium; provides deterministic 50MB/s sequential read for fast XIP or shadowing into RAM. Use Value: Eliminates need for external NAND controller; SLC endurance ensures 10+ years of daily cold boots without wear leveling firmware. |
Use Scenario: Holds FDA-compliant firmware revisions and audit logs in portable ultrasound units, updated only during certified service events. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware archive; OTP pages store cryptographic keys; ECC prevents silent corruption of diagnostic algorithms. Use Value: Meets IEC 62304 Class C software requirements via hardware-enforced write protection and 10-year data retention at 85°C. |
| Smart Meter Data Logger | Automotive Infotainment Cache |
|
Use Scenario: Captures hourly energy consumption snapshots in AMI meters, surviving 15-year field deployment with intermittent power. IC Role / Device Role / Timing Role: High-reliability data sink; uses 128KB block erase and page programming to minimize write amplification across 4,096 blocks. Use Value: 60,000 P/E cycles exceed ANSI C12.22 lifetime requirements; deep power-down (2µA) extends battery backup duration by >3× vs. standard SPI flash. |
Use Scenario: Caches map tiles and voice recognition models in head units, loaded on-demand during navigation sessions. IC Role / Device Role / Timing Role: High-bandwidth auxiliary storage; Quad SPI interface sustains 416MHz effective throughput for low-latency tile streaming. Use Value: Reduces SoC DRAM bandwidth pressure; sequential read mode cuts load time for 10MB map segments by 35% vs. random-access NOR flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QspiNAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25N04KVTAIG TR | Same 4G-bit SLC QspiNAND die but in 8-pad WSON 8×6mm (package code ZE); lacks TFBGA mechanical robustness and thermal dissipation. | Suitable for ultra-compact consumer wearables; not recommended for automotive vibration or industrial thermal cycling environments. | Select W25N04KWTBIR TR when board-level reliability, thermal management, or IPC-compliant TFBGA assembly is required. |
| GD5F4GQ4UCYIGR | 4G-bit SLC NAND with Octal SPI interface (up to 200MHz x8), no integrated ECC; requires external ECC engine or host-side correction logic. | Used in cost-sensitive networking gear where Octal SPI controller exists; adds design complexity due to missing on-die ECC and different command set. | Choose W25N04KWTBIR TR when ECC autonomy, SPI compatibility, and reduced firmware integration effort are prioritized over peak bandwidth. |
Compared with W25N04KVTAIG TR, W25N04KWTBIR TR offers superior mechanical stability and thermal performance in TFBGA; versus GD5F4GQ4UCYIGR, it delivers plug-and-play ECC and seamless SPI ecosystem integration at the cost of lower maximum interface speed.
Availability
W25N04KWTBIR TR is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware archive, and smart meter data logging requiring stable component supply across long-lifecycle programs.
Supply support for W25N04KWTBIR TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND, mobile DRAM, and code storage flash products since 1987.
The W25N QspiNAND product line was designed to bridge the density gap between serial NOR and parallel NAND, delivering NAND economics with SPI simplicity for resource-constrained embedded systems.
FAQ
What is the package type and footprint of W25N04KWTBIR TR?
W25N04KWTBIR TR uses a 24-ball TFBGA package measuring 8mm × 6mm with a 5×5 ball array (package code TB). It has eight functional balls (/CS, CLK, DI/IO0, DO/IO1, /WP/IO2, /HOLD/IO3, VCC, GND) and sixteen no-connect (NC) balls. This footprint complies with JEDEC MO-270DA and supports automated optical inspection and reflow soldering in high-volume manufacturing.
Does W25N04KWTBIR TR support both buffer and sequential read modes, and how are they selected?
Yes, W25N04KWTBIR TR supports both Buffer Read (default, BUF=1) and Sequential Read (BUF=0) modes. The BUF bit resides in Configuration Register (Status Register-2, address Bxh) and is volatile-cleared on power-up or reset. Setting BUF=0 enables single-command full-array access with automatic address incrementing, while BUF=1 requires explicit address transmission per read cycle. Mode selection is done via Write Status Register (1Fh) instruction.
How does the on-chip ECC in W25N04KWTBIR TR operate, and how can it be monitored?
W25N04KWTBIR TR includes an integrated 8-bit ECC engine that corrects up to 8 bit errors per 512-byte sector. ECC is enabled via the ECC-E bit in Status Register-2. Correction status is reported in Status Register-3 (Cxh): ECC-1/ECC-0 bits indicate number of corrected bits (00=none, 01=1–4, 10=5–8, 11=unrecoverable). Extended registers (BFS, BFR, MBF/MFS) provide cumulative bit-flip counts for predictive failure analysis.
Can W25N04KWTBIR TR be used as a direct replacement for standard SPI NOR flash in existing designs?
W25N04KWTBIR TR is not a pin-compatible or functional drop-in replacement for SPI NOR flash due to fundamental differences in command set, erase granularity (128KB blocks vs. 4KB sectors), and lack of execute-in-place (XIP) support without external buffering. However, its Standard SPI instruction subset (e.g., 03h Read Data, 06h Write Enable) allows reuse of basic driver infrastructure-full migration requires NAND-aware file system and wear leveling adaptation.
What are the write protection options available on W25N04KWTBIR TR?
W25N04KWTBIR TR offers three-tiered write protection: (1) Software protection via Block Protect (BP3–BP0) and Status Register Protect (SRP1/SRP0) bits in SR-1, configurable per 512KB block or globally; (2) Hardware protection activated by setting WP-E=1 and grounding /WP, which disables all write/erase operations including OTP programming; (3) OTP lock bits (SR1-L, OTP-L) permanently prevent further modification of protection registers after programming.
W25N04KWTBIR TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 4Gbit
- Memory Organization:
- 512M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 8 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25N04KWTBIR TR FAQ
1.How can I place an order for W25N04KWTBIR TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N04KWTBIR TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N04KWTBIR TR reliable?
The price and inventory of W25N04KWTBIR TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N04KWTBIR TR is usually 5 days.
3.What payment methods are accepted for W25N04KWTBIR TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N04KWTBIR TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N04KWTBIR TR?
W25N04KWTBIR TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N04KWTBIR TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N04KWTBIR TR?
For technical support, including W25N04KWTBIR TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N04KWTBIR TR requirements.
6.How does Aetrix verify that W25N04KWTBIR TR is sourced from the original manufacturer or authorized distributors?
All W25N04KWTBIR TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N04KWTBIR TR meets industry standards.
7.What is the process for return or replacement of W25N04KWTBIR TR?
All W25N04KWTBIR TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N04KWTBIR TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N04KWTBIR TR part is unused and in its original packaging.
Return procedure for W25N04KWTBIR TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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