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Winbond Electronics Corporation W25N512GVFIR
- Part No.:
- W25N512GVFIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25N512GVFIR.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,778
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Product details
Overview
W25N512GVFIR from Winbond is a 512M-bit (64MB) Serial SLC NAND Flash memory with Dual/Quad SPI interface, organized as 32,768 pages × 2,048 bytes, supporting 128KB uniform block erase, on-chip 1-bit ECC, and continuous read mode for efficient code shadowing in space-constrained embedded systems.
For engineers reviewing the W25N512GVFIR datasheet, W25N512GVFIR pinout, W25N512GVFIR application, or W25N512GVFIR equivalent, key selection considerations include its 166MHz SPI clock support, BUF-mode configuration (default Buffer Read), TFBGA-24 8×6-mm package with IO0–IO3 quad I/O capability, and hardware/software write protection via /WP and /HOLD pins.
Technical Context
The W25N512GVFIR implements a serial NAND architecture with dual/quad I/O SPI command compatibility, enabling up to 664MHz equivalent bandwidth using Fast Read Quad I/O instructions. It integrates configurable buffer read and continuous read modes - the latter eliminates inter-page "Page Data Read" commands for linear array access.
Its internal ECC engine corrects single-bit errors per 528-byte sector and reports status via ECC-1/ECC-0 bits in Status Register-3. Bad block management is handled via dedicated LUT access (A5h instruction) and automatic invalid block tracking, while OTP lockability secures SRP, BP, and OTP-L bits against unintended reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 M-bit (64 MB), organized as 32,768 × 2,048-byte pages |
| Interface | Dual/Quad SPI with standard SPI backward compatibility; supports CLK up to 166 MHz |
| Erase Unit | Uniform 128 KB blocks (512 total blocks); no partial-block erase |
| ECC | On-chip 1-bit error correction per 528-byte sector; status reported in SR-3 |
| Read Modes | Buffer Read (BUF=1, default for F/G variants) and Continuous Read (BUF=0, default for T variant) |
| Operating Voltage | 2.7 V to 3.6 V single supply; 25 mA active, 10 µA standby, 1 µA deep power-down current |
| Endurance & Retention | 100,000 program/erase cycles; 10-year data retention at +85°C |
Pinout & Package
W25N512GVFIR is supplied in a 24-ball TFBGA 8×6-mm package (Package Code B, 5×5 ball array), with 19 functional balls and 5 no-connect (NC) positions. Pin assignments follow JEDEC-standard layout optimized for high-density PCB routing and signal integrity in quad I/O configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; device enters standby when high; required high-to-low transition before instruction acceptance |
| CLK | Serial Clock Input | Drives all SPI timing; supports up to 166 MHz; rising edge for input, falling edge for output |
| DI (IO0) | Data Input / I/O0 | Primary data input in Standard/Dual SPI; bidirectional I/O0 in Quad SPI |
| DO (IO1) | Data Output / I/O1 | Primary data output in Standard SPI; bidirectional I/O1 in Dual/Quad SPI |
| /WP (IO2) | Write Protect Input / I/O2 | Hardware lock for Status Register when WP-E=1; serves as I/O2 in Quad SPI when WP-E=0 |
| /HOLD (IO3) | Hold Input / I/O3 | Suspends ongoing serial transfer without deselecting device; serves as I/O3 in Quad SPI when H-DIS=0 |
| VCC | Power Supply | 2.7–3.6 V main supply; decoupling capacitor required per datasheet layout guidelines |
| GND | Ground | Reference for all I/O and internal circuitry; low-impedance connection critical for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Continuous Read Mode | Enables full-array sequential access with one Read command - eliminates repeated Page Data Read overhead for firmware loading |
| Configurable BUF Mode | Buffer Read (BUF=1) or Continuous Read (BUF=0) selected via Status Register-2; W25N512GVFIR defaults to BUF=1 at power-up |
| Hardware Write Protection | /WP pin combined with SR-1 BP[3:0] and SRP[1:0] bits enables selective 128KB block or full-array lock; OTP-lockable |
| Bad Block Management (BBM) | Dedicated A1h/A5h instructions manage invalid block table (LUT); LUT-F flag indicates table overflow |
| OTP Configuration Space | Ten 2KB OTP pages plus 2KB Unique ID and 2KB Parameter pages - used for secure calibration, serialization, or firmware binding |
Applications
| Industrial HMI Firmware Storage | Medical Device Boot Image |
|---|---|
|
Use Scenario: Storing boot firmware and UI assets in compact medical-grade HMIs where PCB real estate and thermal budget are constrained. IC Role / Device Role / Timing Role: Non-volatile storage for XIP-capable bootloader and compressed GUI resources accessed via Quad SPI at ≥60 MB/s sustained rate. Use Value: Continuous Read Mode reduces CPU overhead during firmware load; 10-year data retention ensures long-term field reliability without refresh. |
Use Scenario: Secure boot image storage in FDA-cleared diagnostic equipment requiring traceable firmware versioning and tamper resistance. IC Role / Device Role / Timing Role: Primary flash for signed boot images; leverages OTP pages for cryptographic key binding and Unique ID for device-level serialization. Use Value: On-chip 1-bit ECC prevents silent corruption of critical boot code; SRP/BP bits + /WP hardware lock prevent accidental overwrite during field updates. |
| Smart Energy Meter Log Buffer | Automotive Infotainment OS Partition |
|
Use Scenario: Cyclic logging of energy consumption metrics in Class 0.5S utility meters operating across -40°C to +85°C ambient. IC Role / Device Role / Timing Role: High-endurance NAND for wear-leveled log storage; uses 128KB block erase and BBM to manage field-induced invalid blocks. Use Value: 100,000 P/E cycles and industrial temp rating ensure >15-year service life; Deep Power-Down (1 µA) extends battery backup runtime. |
Use Scenario: Secondary OS partition storage in automotive infotainment head units requiring fast, deterministic boot and OTA update resilience. IC Role / Device Role / Timing Role: Dual-boot image repository accessed via Fast Read Dual I/O; leverages parameter page for A/B partition metadata. Use Value: 332 MHz equivalent bandwidth enables sub-200ms kernel load; configurable BUF mode optimizes throughput vs. latency trade-off per boot stage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F512G08CFAAAWP-IT:F | 512Gb (64GB) Toggle Mode 2.0 NAND; parallel interface, not SPI; requires NAND controller | Targeted at high-throughput SSD/embedded storage with dedicated controller; no native SPI/XIP support | Select only if system already includes NAND controller and requires >64MB density; incompatible pinout and protocol |
| GD5F512M8EFIGR | 512Mb (64MB) Serial NAND; SPI interface; 100MHz max clock; no Continuous Read mode; 1-bit ECC only in external controller | Lower bandwidth and no on-die continuous read; relies on host for ECC and BBM management | Choose for cost-sensitive designs where 50MB/s throughput and autonomous BBM are non-critical; verify host driver compatibility |
Compared with MT29F512G08CFAAAWP-IT:F and GD5F512M8EFIGR, the W25N512GVFIR uniquely delivers SPI-native 50MB/s continuous throughput, autonomous on-die ECC and BBM, and dual read-mode flexibility - making it optimal for resource-constrained MCU-based systems needing direct XIP or simplified firmware storage.
Availability
W25N512GVFIR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device boot image retention, and smart energy meter log buffering requiring stable component supply, long-lifecycle assurance, and qualified automotive-grade temperature operation.
Supply support for W25N512GVFIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs.
The W25N SpiFlash family was designed to bring large-capacity NAND density and endurance to SPI-based microcontroller platforms - eliminating the need for complex NAND controllers while retaining robust data integrity features.
FAQ
What is the default BUF mode setting for W25N512GVFIR at power-up?
The W25N512GVFIR defaults to Buffer Read mode (BUF = 1) at power-up, as indicated by its 'F' suffix in the part numbering scheme (W25N512GVxxF). This is confirmed in the datasheet's Feature section and Table 12.1. The BUF bit resides in Status Register-2 (SR-2, address Bxh) and can be modified via Write Status Register instruction (1Fh/01h) after issuing Write Enable (06h).
Does W25N512GVFIR support Quad SPI commands in both BUF=0 and BUF=1 modes?
Yes, W25N512GVFIR supports all Quad SPI instructions - including Fast Read Quad I/O (EBh), Quad Load Program Data (32h), and Quad Random Load (34h) - regardless of BUF mode. The BUF bit only affects the Read Data (03h) and Fast Read (0Bh) command behavior (page-aligned vs. continuous access); all other instructions operate identically in both modes.
How is hardware write protection implemented on W25N512GVFIR?
Hardware write protection on W25N512GVFIR is enabled by asserting /WP low while setting WP-E = 1 in Status Register-1. When active, /WP locks Status Register-1 bits (BP3–BP0, SRP1/SRP0) and prevents writes to protected blocks. The /WP pin functions as IO2 in Quad SPI only when WP-E = 0. SRP bits themselves are OTP-lockable for permanent protection.
What package type does W25N512GVFIR use, and how many functional terminals does it have?
W25N512GVFIR uses a 24-ball TFBGA 8×6-mm package (Package Code B, 5×5 ball array) with 19 functional terminals: /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), /HOLD (IO3), VCC, GND, and 11 NC balls. Ball assignments match Figure 1c and Table 3.6 in the datasheet, with /HOLD on D4, /WP on C4, and CLK on B2.
Can W25N512GVFIR be used for Execute-in-Place (XIP) applications?
Yes, W25N512GVFIR supports XIP via Dual/Quad SPI Fast Read instructions (3Bh/3Ch/BBh/BCh/EBh/ECh), delivering up to 664MHz equivalent bandwidth. Its Continuous Read Mode further enhances XIP efficiency by enabling seamless linear access across page boundaries without reissuing Page Data Read commands - ideal for MCU-based code shadowing.
W25N512GVFIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 6 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25N512GVFIR FAQ
1.How can I place an order for W25N512GVFIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25N512GVFIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25N512GVFIR reliable?
The price and inventory of W25N512GVFIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N512GVFIR is usually 5 days.
3.What payment methods are accepted for W25N512GVFIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N512GVFIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25N512GVFIR?
W25N512GVFIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25N512GVFIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25N512GVFIR?
For technical support, including W25N512GVFIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N512GVFIR requirements.
6.How does Aetrix verify that W25N512GVFIR is sourced from the original manufacturer or authorized distributors?
All W25N512GVFIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N512GVFIR meets industry standards.
7.What is the process for return or replacement of W25N512GVFIR?
All W25N512GVFIR units undergo pre-shipment inspection (PSI). If there is an issue with W25N512GVFIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25N512GVFIR part is unused and in its original packaging.
Return procedure for W25N512GVFIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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