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Winbond Electronics Corporation W25N512GVFIT TR

Part No.:
W25N512GVFIT TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25N512GVFIT TR.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,205

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Product details

Overview

W25N512GVFIT TR from Winbond is a 512M-bit (64MB) Serial SLC NAND Flash memory with Dual/Quad SPI interface, organized as 32,768 × 2,048-byte pages and 512 × 128KB uniform erase blocks. It supports 166MHz standard/Dual/Quad SPI clocks, delivers up to 50MB/s continuous read throughput in Continuous Read Mode, and operates from 2.7V–3.6V across –40°C to +85°C - enabling code shadowing, XIP execution, and firmware storage in space-constrained embedded systems.

For engineers reviewing the W25N512GVFIT TR datasheet, W25N512GVFIT TR pinout, W25N512GVFIT TR application, or W25N512GVFIT TR equivalent, key selection considerations include BUF-mode default (TR = BUF=0), on-chip 1-bit ECC, hardware/software write protection, OTP page support, and compatibility with SPI, Dual I/O, and Quad I/O instruction sets including Fast Read Quad I/O (6Bh/6Ch) and Deep Power-Down (B9h).

Technical Context

The W25N512GVFIT TR implements a true serial NAND architecture with internal 2,048-byte page buffer, supporting both Buffer Read (BUF=1) and Continuous Read (BUF=0) modes - the latter eliminating inter-command page addressing overhead for linear access. Its command set includes dedicated instructions for Bad Block Management (A1h), BBM Look-Up Table read (A5h), and Last ECC Failure Page address retrieval (A9h).

It integrates configurable protection registers (SR-1/SR-2) with volatile and OTP-lockable bits (BP3–BP0, WP-E, SRP1/SRP0, ECC-E, BUF), plus status-only SR-3 reporting cumulative ECC status (ECC-1/ECC-0), P-FAIL/E-FAIL, and BUSY. The device uses JEDEC-standard manufacturer ID (EFh) and device ID (AA21h) and supports 4-byte addressing for >16MB capacity access.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 M-bit (64 MB), organized as 32,768 pages × 2,048 bytes/page
Interface Standard/Dual/Quad SPI with CLK, /CS, IO0–IO3; supports Fast Read Quad I/O (6Bh/6Ch)
Read Throughput Up to 50 MB/s in Continuous Read Mode (BUF=0), enabling efficient code shadowing
Erase Granularity Uniform 128 KB block erase (512 blocks total); no sector or sub-block erase
Endurance & Retention 100,000 program/erase cycles with on-chip 1-bit ECC; 10-year data retention at +85°C
Power Supply Single 2.7 V–3.6 V supply; 25 mA active, 10 µA standby, 1 µA deep power-down current
Operating Temperature –40°C to +85°C industrial grade; validated for extended temperature operation
OTP Capacity Ten 2,048-byte One-Time Programmable pages for secure configuration or calibration data

Pinout & Package

W25N512GVFIT TR is supplied in an 8-pad WSON 6×5-mm package (Package Code P), with exposed thermal pad. Pin functions are fully compatible with Winbond's W25N family pinout mapping and support Standard, Dual, and Quad SPI protocols.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; high-impedance DO/IO pins when deasserted; required high-to-low transition before instruction acceptance
DO (IO1) Data Output / Bidirectional I/O Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for status/data read on CLK falling edge
/WP (IO2) Write Protect Input / Bidirectional I/O Hardware lock for Status Register when WP-E=1; serves as IO2 in Quad SPI mode when WP-E=0
GND Ground Reference Primary signal and power return path; must be low-impedance for stable timing and ECC reliability
DI (IO0) Data Input / Bidirectional I/O Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and data on CLK rising edge
CLK Serial Clock Input Master-controlled clock up to 166 MHz; timing-critical for all SPI modes; defines data sampling edges
/HOLD (IO3) Hold Input / Bidirectional I/O Suspends ongoing serial transfer without deselecting device; serves as IO3 in Quad SPI when H-DIS=0
VCC Power Supply 2.7–3.6 V core supply; decoupling capacitor required near pin to maintain voltage stability during fast read/write bursts

Key Features

Feature Design Value
Continuous Read Mode (BUF=0) Enables single-command linear access across full memory array - eliminates repeated "Page Data Read" overhead for boot code loading
On-chip 1-bit ECC Automatically corrects single-bit errors per 528-byte codeword; ECC status bits (ECC-1/ECC-0) report correction events without host intervention
Configurable Write Protection Combines volatile BP[3:0] bits, OTP-lockable SRP[1:0], and hardware /WP pin to protect any 128KB block or entire array
Bad Block Management (BBM) Internal LUT stores invalid block addresses; accessible via A5h instruction - reduces host firmware complexity for NAND wear leveling
OTP & Unique ID Pages Includes ten 2KB OTP pages for immutable calibration/security data and one 2KB Unique ID page for device serialization
Deep Power-Down Mode Reduces current to 1 µA while preserving memory state; exited via ABh command - ideal for battery-backed firmware storage

Applications

Industrial HMI Display Boot Medical Device Firmware Storage

Use Scenario: Embedded HMI controller loads GUI assets and boot firmware from flash at power-on.

IC Role / Device Role / Timing Role: Primary non-volatile code and asset store with XIP-capable Quad SPI interface.

Use Value: Continuous Read Mode enables <50ms full-image load time; 100K-cycle endurance ensures 10+ years of daily updates.

Use Scenario: Portable ultrasound unit stores calibrated firmware, sensor profiles, and diagnostic logs.

IC Role / Device Role / Timing Role: Secure, long-retention firmware and parameter storage with OTP-backed calibration data.

Use Value: Ten OTP pages preserve factory calibration; on-chip ECC prevents silent corruption in radiation-prone environments.

Smart Energy Meter Firmware Automotive Telematics Log Buffer

Use Scenario: Utility meter records tariff schedules, firmware patches, and tamper logs over 15-year field life.

IC Role / Device Role / Timing Role: High-reliability, temperature-stable firmware and event log storage.

Use Value: –40°C to +85°C rating and 10-year data retention meet ANSI C12.1/C12.20 standards; hardware /WP prevents accidental overwrite.

Use Scenario: Telematics control unit buffers GPS, CAN, and crash-event data before upload.

IC Role / Device Role / Timing Role: High-throughput, low-latency sequential write buffer with error resilience.

Use Value: 50 MB/s Continuous Read + 128KB block erase supports burst logging; ECC-E bit enables real-time error detection during writes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NAND flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25N512GVFIA TR Same die, SOIC 300-mil (16-pin) package; /HOLD and /WP on Pins 1 & 9; no WSON thermal pad Preferred for through-hole prototyping or legacy PCBs requiring SOIC footprint Select when board layout mandates SOIC-16 or requires manual solder rework capability
MT29F512G08CFAAAWP-IT:E 512Gb (64GB) SLC NAND with ONFI 3.2 interface; parallel x8 bus, not SPI; requires NAND controller Used in high-bandwidth embedded storage (e.g., infotainment SSDs), not direct SPI replacement Choose only when migrating to controller-based NAND architecture with higher density and bandwidth needs

Compared with W25N512GVFIT TR, the W25N512GVFIA TR offers identical functionality in SOIC packaging but lacks WSON's thermal performance and board area savings, while the MT29F512G08CFAAAWP-IT:E demands external ECC and controller logic - making it unsuitable as a drop-in alternative.

Availability

W25N512GVFIT TR is available at Aetrix Electronics and suitable for industrial HMI, medical diagnostics, smart metering, and automotive telematics applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for W25N512GVFIT TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and TrustME secure memory products.

The W25N SpiFlash family was designed specifically to bring NAND density and cost advantages to SPI-based microcontroller platforms - eliminating the need for external NAND controllers while retaining robust ECC, BBM, and OTP features.

FAQ

What is the default BUF mode setting for W25N512GVFIT TR at power-up?

The W25N512GVFIT TR defaults to Continuous Read Mode (BUF=0) at power-up, as indicated by the "T" suffix in its part number. This allows immediate linear memory access without issuing Page Data Read commands. The BUF bit is stored in volatile Configuration Register (SR-2, bit 5) and can be changed dynamically via Write Status Register (1Fh) instruction.

Does W25N512GVFIT TR support Quad SPI commands like Fast Read Quad I/O?

Yes, W25N512GVFIT TR fully supports Quad SPI operation using IO0–IO3, including Fast Read Quad I/O (EBh) and Fast Read Quad I/O with 4-byte address (ECh). These commands achieve up to 664 MHz equivalent throughput (166 MHz × 4) and require BUF mode configuration and proper I/O drive strength settings (ODS-1/ODS-0 bits in SR-2).

How does the on-chip ECC in W25N512GVFIT TR function during read operations?

W25N512GVFIT TR applies 1-bit ECC correction automatically during every page read. The cumulative ECC status (ECC-1/ECC-0 bits in SR-3) indicates whether zero, one, or multiple corrections occurred in the last read. No host software intervention is needed for correction, though status bits allow firmware to log or flag marginal cells before failure.

Can the /WP and /HOLD pins on W25N512GVFIT TR be repurposed as general I/Os?

Yes - when WP-E=0 (Software Protection mode), /WP functions as IO2 in Quad SPI; when H-DIS=1, /HOLD becomes IO3. Both pins retain their dual-role capability per datasheet Section 4.2 and Figure 1a. However, /WP and /HOLD remain functional only in Standard/Dual SPI - they are not used in Quad SPI's four-wire mode unless explicitly enabled via configuration bits.

What package type is used for W25N512GVFIT TR, and is thermal performance documented?

W25N512GVFIT TR uses the 8-pad WSON 6×5-mm package (Package Code P) with exposed thermal pad. Thermal resistance (θJA) is specified as 110°C/W in the datasheet's Package Specifications section (11.1), and the pad must be soldered to a PCB copper pour for optimal junction temperature control during sustained 50 MB/s reads.

W25N512GVFIT TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
700µs
Access Time:
6 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25N512GVFIT TR FAQ

1.How can I place an order for W25N512GVFIT TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25N512GVFIT TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25N512GVFIT TR reliable?

The price and inventory of W25N512GVFIT TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25N512GVFIT TR is usually 5 days.

3.What payment methods are accepted for W25N512GVFIT TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25N512GVFIT TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25N512GVFIT TR?

W25N512GVFIT TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25N512GVFIT TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25N512GVFIT TR?

For technical support, including W25N512GVFIT TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25N512GVFIT TR requirements.

6.How does Aetrix verify that W25N512GVFIT TR is sourced from the original manufacturer or authorized distributors?

All W25N512GVFIT TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25N512GVFIT TR meets industry standards.

7.What is the process for return or replacement of W25N512GVFIT TR?

All W25N512GVFIT TR units undergo pre-shipment inspection (PSI). If there is an issue with W25N512GVFIT TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25N512GVFIT TR part is unused and in its original packaging.

Return procedure for W25N512GVFIT TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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