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Winbond Electronics Corporation W25P16VSFIG

Part No.:
W25P16VSFIG
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25P16VSFIG.pdf
Description:
IC FLASH 16MBIT SPI 50MHZ 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,107

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Product details

Overview

W25P16VSFIG from Winbond is a 16M-bit (2MB) serial Flash memory IC designed for embedded code storage and data logging in space-constrained systems. It operates on a single 2.7V–3.6V supply, supports SPI Modes 0 and 3 up to 50MHz, features 256-byte page programming (3.5ms typical), 64KB sector erase (0.6s), and includes hardware/software write protection via /WP pin and status register bits BP2–BP0/SRP.

For engineers reviewing the W25P16VSFIG datasheet, W25P16VSFIG pinout, W25P16VSFIG application, or W25P16VSFIG equivalent, key selection criteria include SOIC-8 208-mil package compatibility, parameter page support for configuration data, 100,000 program/erase cycles, 20-year data retention, and SPI bus sharing capability via /HOLD functionality.

Technical Context

The W25P16VSFIG implements a standard 4-wire SPI interface (CLK, /CS, DI, DO) with optional /HOLD and /WP control lines, enabling seamless integration with microcontrollers lacking parallel memory buses. Its internal architecture organizes memory into 8,192 × 256-byte programmable pages grouped into 32 erasable sectors of 64KB each.

Write operations require explicit Write Enable (06h) instruction before Page Program (02h), Sector Erase (D8h), or Write Status Register (01h); the BUSY bit (S0) and Write Enable Latch (WEL, S1) in the 8-bit status register provide real-time execution feedback and access control. The dedicated 256-byte Parameter Page resides outside the main array and supports sub-200ms erase.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 M-bit (2,097,152 bytes), organized as 8,192 pages × 256 bytes
Supply Voltage 2.7 V to 3.6 V - compatible with 3.3 V logic systems without level shifting
Max Clock Frequency 50 MHz - enables high-throughput firmware updates and boot code loading
Page Program Time 3.5 ms typical - limits burst write latency in real-time logging applications
Sector Erase Time 0.6 s typical - defines minimum time window for field-upgradable firmware partitioning
Data Retention 20 years - ensures long-term reliability in industrial and automotive deployments
Endurance 100,000 program/erase cycles - supports frequent OTA update or configuration change scenarios

Pinout & Package

W25P16VSFIG is supplied in an 8-pin SOIC package (208-mil width, Winbond code SS), pin-compatible with legacy NexFlash NX25P16 devices. This compact surface-mount package supports automated PCB assembly and fits tight board layouts.

Pin Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; must transition high→low after power-up before accepting instructions
2 DO Serial Data Output Tri-state output; data shifted out on CLK falling edge; high-impedance when /CS high or /HOLD active
3 /WP Write Protect Input Hardware lock for status register writes when SRP=1; active-low, requires external pull-up
4 GND Ground Reference Primary return path for VCC current and signal reference for all I/O pins
5 DI Serial Data Input Instruction/address/data input; sampled on CLK rising edge; MSB-first protocol
6 CLK Serial Clock Input Master-generated timing signal; supports SPI Modes 0 (CLK idle low) and 3 (CLK idle high)
7 /HOLD Hold Input Pauses ongoing SPI transaction without resetting internal state; enables multi-device bus sharing
8 VCC Power Supply Single 2.7–3.6 V supply; draws 4 mA active, 1 µA in power-down mode

Key Features

Feature Design Value
Parameter Page 256-byte dedicated non-volatile area separate from main array, erasable in <200 ms for fast configuration updates
SPI Mode Flexibility Supports both Mode 0 and Mode 3 clock polarity/phase configurations, easing integration with diverse MCU SPI peripherals
Hardware Write Protection /WP pin + SRP/BP bits allow selective locking of upper memory regions (e.g., bootloader section) against accidental overwrite
Low-Power Operation 1 µA power-down current enables battery-backed operation in portable or energy-harvesting systems
HOLD Functionality Enables deterministic pause/resume of SPI transfers during interrupt servicing-critical for real-time OS environments

Applications

Firmware Boot Storage Industrial Sensor Data Logging

Use Scenario: Storing boot code and firmware images for microcontrollers in factory automation controllers.

IC Role / Device Role / Timing Role: Non-volatile code storage device accessed during cold start and firmware upgrade sequences via SPI.

Use Value: 2MB capacity accommodates dual-image OTA updates; 50MHz interface reduces boot time; hardware write protection prevents corruption of critical bootloader region.

Use Scenario: Capturing timestamped sensor readings (temperature, pressure, vibration) in remote monitoring nodes.

IC Role / Device Role / Timing Role: Cyclic data buffer with wear-leveling handled by host MCU; leverages fast page programming and sector erase.

Use Value: 100,000 endurance cycles support >10 years of daily logging; parameter page stores calibration coefficients separately from operational data.

Consumer Audio Voice Storage Medical Device Configuration Storage

Use Scenario: Storing pre-recorded voice prompts and alarm tones in home health monitors and smart speakers.

IC Role / Device Role / Timing Role: Read-intensive serial memory mapped via SPI DMA for glitch-free audio playback.

Use Value: Fast Read (0Bh) instruction enables continuous streaming at 50MHz; 20-year retention guarantees prompt integrity over product lifetime.

Use Scenario: Holding device-specific calibration data, user preferences, and regulatory compliance flags in portable diagnostic tools.

IC Role / Device Role / Timing Role: Secure configuration store with hardware-enforced write lock during normal operation.

Use Value: /WP pin + BP bits prevent unauthorized modification of safety-critical parameters; parameter page isolates config data from firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25Q16JVSSIQ Same density (16M-bit), but newer generation: Quad SPI support, faster erase (sector: 40ms), higher endurance (100K vs same), 1.65–3.6V supply Enables faster firmware updates and lower-voltage operation; requires Quad SPI controller support Select W25Q16JVSSIQ if migrating to Quad SPI or requiring extended voltage range; W25P16VSFIG remains optimal for legacy SPI-only designs.
AT25DF161-SSH-T 16M-bit SPI Flash from Microchip; 2.7–3.6V supply; 50MHz max clock; no /HOLD pin; different status register layout and protection scheme Lacks /HOLD functionality and parameter page; uses different instruction set (e.g., 0x3B for fast read) Choose AT25DF161-SSH-T only when /HOLD is unused and host firmware can be adapted to alternate command set and protection model.

Compared with W25Q16JVSSIQ and AT25DF161-SSH-T, the W25P16VSFIG offers proven /HOLD support for interrupt-driven SPI sharing and a dedicated parameter page for configuration-features absent in the alternatives-making it uniquely suited for legacy industrial designs requiring deterministic bus arbitration and isolated config storage.

Availability

W25P16VSFIG is available at Aetrix Electronics and suitable for firmware boot storage, industrial sensor data logging, and consumer audio voice storage requiring stable component supply across long-lifecycle programs.

Supply support for W25P16VSFIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including Serial Flash, PSRAM, and mobile DRAM for embedded and communications markets.

The W25P series was designed as a drop-in replacement for NexFlash NX25P devices, targeting cost-sensitive, space-constrained applications needing reliable SPI-based non-volatile storage with hardware write protection and parameter page flexibility.

FAQ

What is the package type and pin count for W25P16VSFIG?

W25P16VSFIG uses an 8-pin SOIC package with 208-mil width (Winbond package code SS). Pin assignments include /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC - fully documented in the December 2005 datasheet revision J. This package is identical to that used for W25P80 and differs from the 16-pin SOIC used for W25P32 variants.

Does W25P16VSFIG support Quad SPI or only standard SPI?

W25P16VSFIG supports only standard 4-wire SPI (CLK, /CS, DI, DO) with optional /HOLD and /WP control lines. It does not implement Quad SPI (QSPI) or Dual SPI modes. The datasheet explicitly confirms compatibility with SPI Modes 0 and 3 only, and no quad-capable instructions (e.g., 06Bh, 6BH) appear in its instruction set.

How is write protection implemented on W25P16VSFIG?

W25P16VSFIG implements dual-layer write protection: hardware-based via the /WP pin (active-low, controlling status register writes when SRP=1) and software-based via Block Protect (BP2–BP0) and Status Register Protect (SRP) bits in the status register. These bits allow selective locking of memory sectors - e.g., BP2–BP0 = 101 protects the upper 8MB - and persist through power cycles.

What is the purpose and location of the Parameter Page in W25P16VSFIG?

The Parameter Page in W25P16VSFIG is a dedicated 256-byte memory region physically separate from the main array, accessible via Read Parameter Page (53h) and Program Parameter Page (52h) instructions. It is intended for storing infrequently changed data such as device ID, calibration values, or configuration flags - enabling fast, independent erase (<200ms) without affecting firmware or logged data.

Can W25P16VSFIG be used interchangeably with W25P16VSIQ?

W25P16VSFIG and W25P16VSIQ share identical electrical specifications, pinout, instruction set, and timing - differing only in temperature grade (I: -40°C to +85°C for VSFIG; unspecified industrial grade for VSIQ) and packaging detail (G = lead-free, RoHS-compliant plating). They are functionally and mechanically interchangeable in standard industrial applications.

W25P16VSFIG Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI
Clock Frequency:
50 MHz
Write Cycle Time - Word, Page:
7ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25P16VSFIG FAQ

1.How can I place an order for W25P16VSFIG through Aetrix?

Please submit a Request for Quotation (RFQ) for W25P16VSFIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25P16VSFIG reliable?

The price and inventory of W25P16VSFIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25P16VSFIG is usually 5 days.

3.What payment methods are accepted for W25P16VSFIG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25P16VSFIG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25P16VSFIG?

W25P16VSFIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25P16VSFIG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25P16VSFIG?

For technical support, including W25P16VSFIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25P16VSFIG requirements.

6.How does Aetrix verify that W25P16VSFIG is sourced from the original manufacturer or authorized distributors?

All W25P16VSFIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25P16VSFIG meets industry standards.

7.What is the process for return or replacement of W25P16VSFIG?

All W25P16VSFIG units undergo pre-shipment inspection (PSI). If there is an issue with W25P16VSFIG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25P16VSFIG part is unused and in its original packaging.

Return procedure for W25P16VSFIG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25P16VSFIG Tags

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