Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W25P16VSFIG T&R

Part No.:
W25P16VSFIG T&R
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixW25P16VSFIG T&R.pdf
Description:
IC FLASH 16MBIT SPI 50MHZ 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,107

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W25P16VSFIG T&R from Winbond is a 16M-bit (2MB) serial flash memory IC designed for code storage and data logging in space-constrained embedded systems. It operates on a single 2.7V–3.6V supply, supports SPI Modes 0 and 3 at up to 50MHz clock rate, and features 256-byte page programming with 100,000 erase/write cycles and 20-year data retention. It is used in microcontroller-based boot code storage and firmware update applications.

For engineers reviewing the W25P16VSFIG T&R datasheet, W25P16VSFIG T&R pinout, W25P16VSFIG T&R application, or W25P16VSFIG T&R equivalent, key selection considerations include SOIC-8 208-mil package compatibility, hardware write protection via /WP pin, parameter page support for configuration data, and sector-level erase granularity (64KB sectors).

Technical Context

The W25P16VSFIG T&R implements a standard 4-wire SPI interface (CLK, /CS, DI, DO) with optional /HOLD and /WP control lines. Its internal architecture includes a 8,192 × 256-byte programmable array organized into 32 erasable sectors of 64KB each, plus a dedicated 256-byte parameter page isolated from main memory.

It supports full SPI command set including Page Program (02h), Sector Erase (D8h), Chip Erase (C7h), Read Status Register (05h), and Write Status Register (01h). Protection logic combines software-configurable Block Protect bits (BP2–BP0) with hardware /WP pin control and Status Register Protect (SRP) bit for robust non-volatile memory security.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 M-bit (2,097,152 bytes), organized as 8,192 pages × 256 bytes
Interface 4-wire SPI (CLK, /CS, DI, DO); supports Modes 0 and 3; 50 MHz max clock
Supply Voltage 2.7 V to 3.6 V - enables direct interfacing with 3.3 V microcontrollers without level shifting
Active Current 4 mA typical - minimizes power draw during firmware read/verify operations
Erase/Write Endurance 100,000 cycles - ensures reliability for field-updatable firmware storage
Data Retention 20 years at +85°C - validated for long-life industrial and automotive deployments
Operating Temperature −40°C to +85°C - qualified for extended temperature embedded environments
Package 8-pin SOIC, 208-mil width (Winbond code SS) - industry-standard footprint for PCB layout reuse

Pinout & Package

W25P16VSFIG T&R is packaged in an 8-pin SOIC (208-mil width, Winbond package code SS), compatible with standard SOIC-8 footprints and reflow processes. Pin assignments are defined per Figure 1a and Table 4 of the December 2005 datasheet.

Pin/Terminal Circuit Role Design Meaning
1 /CS Chip Select Input Active-low enable; places DO in high-impedance when deasserted; must track VCC at power-up
2 DO Serial Data Output Tri-state output; data shifted out on falling edge of CLK; high-Z when /CS high or /HOLD active
3 /WP Write Protect Input Active-low hardware lock; disables Status Register writes when SRP=1 and /WP=low
4 GND Ground Reference Primary return path for VCC and I/O signals; requires low-impedance PCB connection
5 DI Serial Data Input Instruction/address/data input; sampled on rising edge of CLK; MSB-first protocol
6 CLK Serial Clock Input Master-generated timing signal; defines SPI data rate; supports Mode 0 (idle low) and Mode 3 (idle high)
7 /HOLD Hold Input Active-low pause control; suspends ongoing SPI transfer without resetting internal state
8 VCC Power Supply 2.7–3.6 V supply; decoupling capacitor required near pin for stable operation

Key Features

Feature Design Value
Parameter Page Dedicated 256-byte EEPROM-like area for device ID, revision, or config data - erased separately in <200 ms
Hardware Write Protection /WP pin + SRP bit combination prevents accidental Status Register modification - critical for secure boot integrity
Sector-Level Erase 32 × 64KB sectors allow selective firmware partitioning - enables A/B OTA updates without full chip erase
Fast Read Support 0Bh instruction adds dummy cycle for higher throughput - reduces boot time in latency-sensitive applications
Power-down Mode B9h instruction reduces current to 1 µA - extends battery life in portable devices between firmware accesses
JEDEC ID Compliance 9Fh command returns manufacturer (EFh) and memory type/capacity - enables automated BOM validation and toolchain detection

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code execution memory accessed via SPI during reset initialization sequence.

Use Value: Enables reliable, low-pin-count boot from external memory while freeing internal MCU flash for runtime variables.

Use Scenario: Holding staged firmware images for over-the-air (OTA) updates in connected IoT gateways.

IC Role / Device Role / Timing Role: Dual-bank storage medium supporting atomic swap between active and pending firmware partitions.

Use Value: Allows safe rollback and fail-safe update recovery using sector-level erase isolation and parameter page version tracking.

Configuration Data Logging Audio/Text Asset Storage

Use Scenario: Recording calibration coefficients, sensor offsets, and user preferences in industrial HMI panels.

IC Role / Device Role / Timing Role: Persistent parameter store updated infrequently but requiring guaranteed write integrity.

Use Value: Combines hardware (/WP) and software (BP bits) protection to prevent corruption during brown-out or reset events.

Use Scenario: Hosting voice prompts, multilingual UI text, or audio samples in medical handheld devices.

IC Role / Device Role / Timing Role: Sequential read-only data archive accessed via fast-read SPI bursts.

Use Value: Delivers deterministic read latency (<100 ns address setup) and 50 MHz throughput for real-time playback buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
W25Q16JVSSIQ Same 16M-bit density, but newer generation: Quad SPI support, 104 MHz DTR mode, 3V-only (2.7–3.6V), 100K cycles Enables faster boot and OTA transfers via QPI; requires controller QSPI peripheral and updated driver stack Choose W25Q16JVSSIQ if migrating to higher-speed interfaces and can modify firmware to support quad commands.
MX25L1606EM2I-12G 16M-bit SPI flash; identical 208-mil SOIC-8 package; 3V supply; 100K cycles; supports standard SPI only (no QPI) Pin-compatible drop-in replacement with same timing and instruction set; minor differences in status register bit mapping Choose MX25L1606EM2I-12G for second-source assurance where identical footprint and minimal firmware changes are required.

Compared with W25P16VSFIG T&R, W25Q16JVSSIQ offers higher bandwidth and modern feature set at cost of driver complexity, while MX25L1606EM2I-12G provides seamless mechanical and electrical compatibility for supply chain diversification without design change.

Availability

W25P16VSFIG T&R is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and configuration data logging requiring stable component supply across industrial, medical, and consumer electronics production programs.

Supply support for W25P16VSFIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, PSRAM, and mobile DRAM.

The W25P series was designed as a cost-optimized, pin-compatible successor to NexFlash NX25P devices for legacy embedded systems requiring proven reliability and long-term availability.

FAQ

What is the package type and dimensions of W25P16VSFIG T&R?

W25P16VSFIG T&R uses an 8-pin SOIC package with 208-mil body width (Winbond package code SS). Its dimensions are 5.3 mm × 5.3 mm × 1.75 mm, compliant with JEDEC MS-012 standards. The "VSFIG" suffix confirms this variant is the 208-mil SOIC option - distinct from the 300-mil 16-pin SOIC variant used for W25P16 in higher-pin-count configurations.

Does W25P16VSFIG T&R support Quad SPI or only standard SPI?

W25P16VSFIG T&R supports only standard 4-wire SPI (CLK, /CS, DI, DO) and does not implement Quad SPI (QPI) or Dual SPI modes. It is fully compatible with SPI Modes 0 and 3, with maximum clock frequency of 50 MHz. Quad-capable alternatives like W25Q16JV require different instruction sets and hardware interface support.

How many erase cycles does W25P16VSFIG T&R guarantee, and what is its data retention period?

W25P16VSFIG T&R guarantees 100,000 program/erase cycles per sector and 20 years of data retention at +85°C ambient temperature. These values are specified in the December 2005 datasheet Section 10.4 and reflect accelerated life testing under worst-case conditions - enabling reliable use in industrial firmware storage applications.

Can W25P16VSFIG T&R be used as a direct replacement for NexFlash NX25P16 devices?

Yes, W25P16VSFIG T&R is explicitly stated as fully compatible with NexFlash NX25P16 devices per the datasheet's General Description and Revision History. It maintains identical pinout, instruction set, timing parameters, and electrical characteristics - allowing drop-in replacement without PCB or firmware modification.

What is the function of the Parameter Page in W25P16VSFIG T&R, and how is it accessed?

The Parameter Page in W25P16VSFIG T&R is a dedicated 256-byte memory region separate from the main array, accessed via Read Parameter Page (53h), Fast Read Parameter Page (5Bh), Program Parameter Page (52h), and Erase Parameter Page (D5h) instructions. It is intended for storing device-specific metadata such as calibration data, firmware version, or configuration flags - erased independently in under 200 ms.

W25P16VSFIG T&R Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
2M x 8
Memory Interface:
SPI
Clock Frequency:
50 MHz
Write Cycle Time - Word, Page:
7ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

W25P16VSFIG T&R FAQ

1.How can I place an order for W25P16VSFIG T&R through Aetrix?

Please submit a Request for Quotation (RFQ) for W25P16VSFIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25P16VSFIG T&R reliable?

The price and inventory of W25P16VSFIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25P16VSFIG T&R is usually 5 days.

3.What payment methods are accepted for W25P16VSFIG T&R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25P16VSFIG T&R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25P16VSFIG T&R?

W25P16VSFIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25P16VSFIG T&R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25P16VSFIG T&R?

For technical support, including W25P16VSFIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25P16VSFIG T&R requirements.

6.How does Aetrix verify that W25P16VSFIG T&R is sourced from the original manufacturer or authorized distributors?

All W25P16VSFIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25P16VSFIG T&R meets industry standards.

7.What is the process for return or replacement of W25P16VSFIG T&R?

All W25P16VSFIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25P16VSFIG T&R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25P16VSFIG T&R part is unused and in its original packaging.

Return procedure for W25P16VSFIG T&R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25P16VSFIG T&R Tags

  • W25P16VSFIG T&R
  • W25P16VSFIG T&R PDF
  • W25P16VSFIG T&R Datasheet
  • W25P16VSFIG T&R Specifications
  • W25P16VSFIG T&R Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W25P16VSFIG T&R
  • Buy W25P16VSFIG T&R
  • W25P16VSFIG T&R Price
  • W25P16VSFIG T&R Distributor
  • W25P16VSFIG T&R Supplier
  • W25P16VSFIG T&R Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER