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Winbond Electronics Corporation W25P16VSSIG
- Part No.:
- W25P16VSSIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25P16VSSIG.pdf
- Description:
- IC FLASH 16MBIT SPI 50MHZ 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,153
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Product details
Overview
W25P16VSSIG from Winbond is a 16M-bit (2MB) serial flash memory IC designed for code storage and data logging in space-constrained embedded systems. It operates on a single 2.7–3.6V supply, supports SPI Modes 0 and 3 at up to 50MHz clock rate, and features 256-byte page programming with 100,000 erase/write cycles and 20-year data retention. It is commonly used in microcontroller-based boot code storage and firmware update applications.
For engineers reviewing the W25P16VSSIG datasheet, W25P16VSSIG pinout, W25P16VSSIG application, or W25P16VSSIG equivalent, key selection considerations include its 8-pin SOIC-208mil package, hardware write protection via /WP pin, dedicated 256-byte parameter page, and compatibility with legacy NexFlash NX25P16 devices.
Technical Context
The W25P16VSSIG implements a standard 4-wire SPI interface (CLK, /CS, DI, DO) with optional /HOLD and /WP control lines. Its internal architecture organizes memory into 8,192 × 256-byte programmable pages grouped into 32 erasable sectors of 64KB each, plus a separate 256-byte parameter page.
It supports full SPI command set including Page Program (02h), Sector Erase (D8h), Chip Erase (C7h), Fast Read (0Bh), and status register access (05h/01h). Write protection is enforced through both software-configurable Block Protect bits (BP2–BP0) and hardware-controlled /WP pin interaction with SRP bit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages |
| Supply Voltage | 2.7 V to 3.6 V - enables direct interfacing with 3.3V microcontrollers without level shifting |
| Max Clock Frequency | 50 MHz - supports high-speed firmware readout and boot loading |
| Page Program Time | 3.5 ms typical - determines minimum latency for firmware patching or configuration updates |
| Erase Endurance | 100,000 cycles - ensures reliability for field-upgradable systems requiring frequent reprogramming |
| Data Retention | 20 years at +85°C - guarantees long-term integrity of stored calibration data or device identity |
| Operating Temperature | −40°C to +85°C - qualified for industrial and automotive under-hood environments |
Pinout & Package
W25P16VSSIG uses an 8-pin SOIC package (Winbond code SS, 208-mil width), pin-compatible with W25P80 and earlier NexFlash NX25P16 devices. This compact surface-mount package occupies minimal PCB area while supporting hand-soldering and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable signal; must transition high→low before instruction acceptance; controls DO high-impedance state |
| 2 DO | Serial Data Output | Tri-state output; data shifted out on CLK falling edge; high-Z when /CS high or /HOLD active |
| 3 /WP | Write Protect Input | Hardware lock for Status Register writes when SRP=1; active-low; enables robust protection against noise-induced corruption |
| 4 GND | Ground Reference | Primary return path for all I/O and power currents; requires low-impedance connection to system ground plane |
| 5 DI | Serial Data Input | Instruction/address/data input; sampled on CLK rising edge; MSB-first protocol |
| 6 CLK | Serial Clock Input | Master-generated timing signal; supports SPI Modes 0 and 3; defines data setup/hold windows |
| 7 /HOLD | Hold Input | Pauses ongoing SPI transaction without deselecting device; allows bus sharing with other peripherals |
| 8 VCC | Power Supply | Single 2.7–3.6V supply; decoupling capacitor (0.1 µF) required near pin for stable operation |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Parameter Page | 256-byte isolated memory region for ID, revision, or configuration data - erased in <200ms, independent of main array |
| Hardware + Software Write Protection | Combines /WP pin control with SRP/BP bits to protect partial or full memory - prevents accidental firmware overwrite during power transients |
| SPI Mode 0 & 3 Compatibility | Supports both common microcontroller SPI configurations - eliminates need for clock polarity inversion logic |
| Low-Power Operation | 4 mA active current and 1 µA power-down current - extends battery life in portable diagnostics and sensor nodes |
| Legacy NexFlash Interchangeability | Fully compatible with NX25P16 - enables drop-in replacement in existing designs without layout or firmware changes |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
|
Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start. IC Role / Device Role / Timing Role: Non-volatile code memory accessed via SPI during reset sequence; provides deterministic boot latency under 100 µs per instruction fetch. Use Value: Enables secure, field-upgradable boot process with hardware write protection preventing corruption during brown-out conditions. |
Use Scenario: Holding over-the-air (OTA) firmware images prior to validation and installation in IoT edge gateways. IC Role / Device Role / Timing Role: Dual-bank-capable storage partitioned into active and staging regions; supports atomic swap using sector erase boundaries. Use Value: Guarantees safe firmware rollback and eliminates risk of bricking due to interrupted updates using parameter page-stored version metadata. |
| Configuration & Calibration Data | Audio/Log Data Buffer |
|
Use Scenario: Retaining factory-calibrated sensor offsets, trim values, and user preferences across power cycles in industrial HMIs. IC Role / Device Role / Timing Role: EEPROM-replacement storage accessed via fast-read and page-program commands; parameter page stores critical identifiers. Use Value: Eliminates external EEPROM while providing higher endurance (100k vs. 10k cycles) and faster write throughput than byte-serial alternatives. |
Use Scenario: Capturing diagnostic logs or short audio clips in battery-powered medical monitors or predictive maintenance sensors. IC Role / Device Role / Timing Role: Circular buffer implemented across multiple 64KB sectors; leverages fast sector erase for rapid reuse. Use Value: Delivers cost-effective, low-power persistent storage with sufficient bandwidth (≥2 MB/s effective read rate) for real-time streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q16JVSSIQ | Quad SPI interface (QPI), 133MHz dual/quad read, 4KB uniform sectors, no /HOLD pin | Better suited for high-speed boot from XIP or graphics asset loading; lacks /HOLD for multi-peripheral SPI sharing | Select if system requires >50MHz read bandwidth or QPI mode; verify firmware SPI driver compatibility |
| MX25L1606EM2I-12G | Same density and SOIC-8 package; supports standard SPI only; 100k cycles, 20-year retention, but no parameter page | Functional substitute where parameter page usage is not required; identical pinout and timing | Choose for cost-sensitive designs needing basic code storage without advanced configuration storage capability |
Compared with W25P16VSSIG, W25Q16JVSSIQ offers higher bandwidth but removes /HOLD and parameter page functionality, while MX25L1606EM2I-12G matches core specs but omits the dedicated parameter page - making W25P16VSSIG uniquely suitable for systems requiring robust, segregated configuration storage alongside firmware.
Availability
W25P16VSSIG is available at Aetrix Electronics and suitable for industrial control panels, automotive telematics modules, and medical device firmware storage requiring stable component supply and long-term lifecycle support.
Supply support for W25P16VSSIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, PSRAM, and mobile DRAM.
The W25P series was designed as a drop-in replacement for NexFlash serial flash devices, targeting cost-sensitive, space-constrained embedded systems requiring reliable non-volatile code and data storage.
FAQ
What is the package type and lead count for W25P16VSSIG?
W25P16VSSIG uses an 8-pin SOIC package with 208-mil width (Winbond package code SS). It has no exposed pad and is RoHS-compliant. The pinout matches W25P80 and legacy NX25P16 devices, enabling direct PCB footprint reuse in upgrade paths.
Does W25P16VSSIG support Quad SPI or QPI mode?
No, W25P16VSSIG supports only standard 4-wire SPI (CLK, /CS, DI, DO) in Modes 0 and 3. It does not implement Quad I/O or QPI functionality. For quad-capable alternatives, consider Winbond's W25QxxJV series, which require different command sets and pin assignments.
How is write protection implemented on W25P16VSSIG?
W25P16VSSIG implements dual-layer write protection: hardware-based via the /WP pin (active-low) combined with software-configurable Block Protect (BP2–BP0) and Status Register Protect (SRP) bits. Protection granularity ranges from upper 1/32 to full array, including the parameter page.
What is the purpose of the Parameter Page in W25P16VSSIG?
The 256-byte Parameter Page in W25P16VSSIG is a physically separate memory region used for storing non-volatile configuration data such as device ID, firmware version, calibration constants, or security keys. It supports independent erase (<200ms) and is immune to main array erase operations.
Is W25P16VSSIG compatible with the older NexFlash NX25P16?
Yes, W25P16VSSIG is fully compatible with NexFlash NX25P16 devices - matching pinout, command set, timing, and electrical specifications. This allows seamless migration in existing designs without firmware or layout modifications, preserving design investment.
W25P16VSSIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 50 MHz
- Write Cycle Time - Word, Page:
- 7ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25P16VSSIG FAQ
1.How can I place an order for W25P16VSSIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25P16VSSIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25P16VSSIG reliable?
The price and inventory of W25P16VSSIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25P16VSSIG is usually 5 days.
3.What payment methods are accepted for W25P16VSSIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25P16VSSIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25P16VSSIG?
W25P16VSSIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25P16VSSIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25P16VSSIG?
For technical support, including W25P16VSSIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25P16VSSIG requirements.
6.How does Aetrix verify that W25P16VSSIG is sourced from the original manufacturer or authorized distributors?
All W25P16VSSIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25P16VSSIG meets industry standards.
7.What is the process for return or replacement of W25P16VSSIG?
All W25P16VSSIG units undergo pre-shipment inspection (PSI). If there is an issue with W25P16VSSIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25P16VSSIG part is unused and in its original packaging.
Return procedure for W25P16VSSIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25P16VSSIG Tags
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