Winbond Electronics Corporation W25P16VSSIG T&R
- Part No.:
- W25P16VSSIG T&R
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25P16VSSIG T&R.pdf
- Description:
- IC FLASH 16MBIT SPI 50MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25P16VSSIG T&R from Winbond is a 16M-bit (2MB) serial flash memory IC designed for SPI-based code storage and data logging in space-constrained embedded systems. It operates on a single 2.7–3.6V supply, delivers up to 50MHz clock speed, supports page programming (256 bytes in 3.5ms), sector erase (64KB in 0.6s), and offers 100,000 program/erase cycles with 20-year data retention. It is used in microcontroller boot code storage and firmware update buffers.
For engineers reviewing the W25P16VSSIG T&R datasheet, W25P16VSSIG T&R pinout, W25P16VSSIG T&R application, or W25P16VSSIG T&R equivalent, key selection criteria include SOIC-8 (208-mil) package compatibility, hardware write protection via /WP pin, Parameter Page support for configuration data, and SPI Mode 0/3 interoperability with ARM Cortex-M and RISC-V host controllers.
Technical Context
The W25P16VSSIG T&R implements a standard 4-wire SPI interface (CLK, /CS, DI, DO) with optional /HOLD and /WP control lines. Its internal architecture includes a 8,192-page × 256-byte array organized into 32 erasable sectors of 64KB each, plus a dedicated 256-byte Parameter Page isolated from main memory.
It uses a status register (8-bit) with BUSY flag, Write Enable Latch (WEL), three Block Protect bits (BP2–BP0), and Status Register Protect (SRP) bit - enabling granular software/hardware write protection. All instructions are initiated on /CS falling edge and completed on /CS rising edge, with byte-aligned termination required for program/erase commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 M-bit (2,097,152 bytes), organized as 8,192 × 256-byte pages |
| Interface | 4-wire SPI (CLK, /CS, DI, DO); supports Modes 0 and 3; /HOLD and /WP pins for flow control |
| Max Clock Frequency | 50 MHz - enables fast sequential read at ~6.25 MB/s theoretical throughput |
| Page Program Time | 3.5 ms typical - allows efficient firmware patching without full-sector erase |
| Sector Erase Time | 0.6 s typical - targets 64KB blocks; avoids full-chip erase latency in field updates |
| Data Retention | 20 years at +25°C - ensures long-term reliability in industrial and automotive control modules |
| Endurance | 100,000 program/erase cycles - supports frequent OTA firmware revisions in connected devices |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3V logic domains and battery-backed operation |
Pinout & Package
W25P16VSSIG T&R is housed in an 8-pin SOIC package (208-mil width), Winbond package code SS, with gull-wing leads and surface-mount footprint. Pin 4 is GND and Pin 8 is VCC; all I/O pins are CMOS-compatible with 3.3V logic levels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable: drives DO to high-Z when high; required low-to-high transition before instruction acceptance after power-up |
| 2 DO | Serial Data Output | Tri-state output; data shifted out on CLK falling edge; high-Z during /HOLD or /CS high |
| 3 /WP | Write Protect Input | Active-low hardware lock: disables Status Register writes when SRP=1 and /WP=low |
| 4 GND | Ground Reference | Primary return path for VCC and I/O; must be low-impedance for stable SPI timing and noise immunity |
| 5 DI | Serial Data Input | Instruction/address/data input; sampled on CLK rising edge; MSB-first protocol |
| 6 CLK | Serial Clock Input | Master-generated timing signal; defines SPI Mode 0 (CLK idle low) or Mode 3 (CLK idle high) |
| 7 /HOLD | Hold Input | Active-low pause: suspends ongoing SPI transfer without resetting internal state; useful in multi-device bus sharing |
| 8 VCC | Power Supply | 2.7–3.6V nominal; internal voltage regulator enables consistent timing across supply range |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Parameter Page | 256-byte EEPROM-like area for device ID, revision, or calibration data - erased separately in <200ms, independent of main array |
| Hardware + Software Write Protection | Combines /WP pin control with BP2–BP0 and SRP bits to protect any memory region - prevents accidental overwrite during power transients or firmware bugs |
| Auto-Write Disable | WEL bit clears automatically after Page Program, Sector Erase, Chip Erase, or Write Status Register - eliminates risk of unintended subsequent writes |
| Power-down Mode | 1 µA typical standby current - extends battery life in portable diagnostics tools and sensor nodes |
| JEDEC ID & Manufacturer ID Support | Returns EFh manufacturer ID and 2015h device ID via 9Fh instruction - enables runtime flash identification and BOM validation in bootloader |
| Reset-on-Power-Up Safety | Internal reset asserted while VCC < VWI threshold; write instructions disabled for tPUW delay - prevents corruption during brown-out conditions |
Applications
| Boot Code Storage | Firmware Update Buffer |
|---|---|
|
Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M4 microcontrollers in industrial PLCs. IC Role / Device Role / Timing Role: Non-volatile code repository accessed at power-on reset via SPI x1 mode; supports fast read and secure sector erase. Use Value: Enables deterministic boot sequence with verified firmware integrity; Parameter Page stores signature hash for secure boot validation. |
Use Scenario: Holding staged firmware images during over-the-air (OTA) updates in smart metering gateways. IC Role / Device Role / Timing Role: Dual-bank storage: active image in main array, new image in reserved sectors; atomic swap on success. Use Value: Eliminates risk of bricking during update failure; 64KB sector granularity allows partial image rollback without full reflash. |
| Configuration Data Log | Audio Voice Prompt Storage |
|
Use Scenario: Recording calibration coefficients, sensor offsets, and network credentials in medical infusion pumps. IC Role / Device Role / Timing Role: Persistent parameter store updated infrequently; accessed via Read/Write Status Register and Page Program. Use Value: 20-year data retention and 100K endurance ensure lifetime validity of critical settings without external EEPROM. |
Use Scenario: Storing pre-recorded voice prompts (e.g., "Low battery", "Door open") in home security panels. IC Role / Device Role / Timing Role: Sequential audio buffer read via Fast Read (0Bh) instruction with dummy cycle optimization. Use Value: 50MHz clock supports real-time playback at 16-bit/8kHz PCM; SOIC-8 footprint minimizes PCB area in cost-sensitive enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q16JVSSIQ | Quad SPI (x4) interface, 104MHz dual/quad mode, 16MB density, same SOIC-8 package | Higher throughput for graphics or large firmware; requires QSPI controller support | Select when system demands >20 MB/s read bandwidth and QSPI peripheral is available |
| AT25DF161-SSHN-B | 16Mb density, SOIC-8, 85MHz max clock, supports SFDP, different instruction set (e.g., 02h vs 06h for write enable) | Legacy Atmel ecosystem compatibility; lacks Parameter Page and /HOLD pin | Choose for drop-in replacement in existing Atmel-based designs where /HOLD is unused |
Compared with W25P16VSSIG T&R, W25Q16JVSSIQ delivers higher bandwidth but requires QSPI hardware investment, while AT25DF161-SSHN-B offers instruction-level familiarity in legacy systems but sacrifices Parameter Page flexibility and hold functionality - making W25P16VSSIG T&R optimal for balanced cost, feature set, and design simplicity in new 3.3V embedded projects.
Availability
W25P16VSSIG T&R is available at Aetrix Electronics and suitable for industrial control, medical device firmware storage, and IoT edge node configuration requiring stable component supply across extended product lifecycles.
Supply support for W25P16VSSIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, flash memory, and mobile chips, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.
The W25P series was designed as a cost-optimized, pin-compatible successor to NexFlash NX25P devices for mainstream embedded code storage - emphasizing SPI simplicity, low-power operation, and robust write protection for resource-constrained MCUs.
FAQ
What is the package type and lead count of W25P16VSSIG T&R?
W25P16VSSIG T&R uses an 8-pin SOIC package with 208-mil width (Winbond package code SS). It has gull-wing leads, surface-mount construction, and is RoHS-compliant. The "VSSIG" suffix confirms this specific variant is the SOIC-8 version - distinct from the 16-pin SOIC-300-mil variant used in W25P16SFxx parts.
Does W25P16VSSIG T&R support Quad SPI or only standard SPI?
W25P16VSSIG T&R supports only standard 4-wire SPI (single I/O) - CLK, /CS, DI, and DO - with optional /HOLD and /WP. It does not implement Quad SPI (QSPI) or Dual SPI modes. For quad-capable alternatives, consider Winbond's W25QxxJ series, which require different instruction sets and hardware signaling.
How is write protection implemented on W25P16VSSIG T&R?
W25P16VSSIG T&R implements dual-layer write protection: hardware via the /WP pin (active-low, disables Status Register writes when SRP=1), and software via Block Protect (BP2–BP0) and Status Register Protect (SRP) bits. This allows selective locking of upper memory regions - e.g., protecting bootloader sectors while permitting application data updates.
What is the purpose of the Parameter Page in W25P16VSSIG T&R?
The Parameter Page in W25P16VSSIG T&R is a dedicated 256-byte memory region separate from the main array, intended for storing non-volatile configuration data such as device ID, calibration values, or firmware revision numbers. It supports independent erase (<200ms) and programming, enabling fast updates without disturbing operational code or data.
Can W25P16VSSIG T&R be used with SPI Mode 1 or Mode 2 controllers?
No - W25P16VSSIG T&R supports only SPI Modes 0 (CPOL=0, CPHA=0) and 3 (CPOL=1, CPHA=1). It does not operate correctly in Mode 1 (CPOL=0, CPHA=1) or Mode 2 (CPOL=1, CPHA=0), as its data sampling (DI on rising CLK) and output timing (DO on falling CLK) are fixed to those two modes per the datasheet specification.
W25P16VSSIG T&R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 50 MHz
- Write Cycle Time - Word, Page:
- 7ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25P16VSSIG T&R FAQ
1.How can I place an order for W25P16VSSIG T&R through Aetrix?
Please submit a Request for Quotation (RFQ) for W25P16VSSIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25P16VSSIG T&R reliable?
The price and inventory of W25P16VSSIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25P16VSSIG T&R is usually 5 days.
3.What payment methods are accepted for W25P16VSSIG T&R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25P16VSSIG T&R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25P16VSSIG T&R?
W25P16VSSIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25P16VSSIG T&R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25P16VSSIG T&R?
For technical support, including W25P16VSSIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25P16VSSIG T&R requirements.
6.How does Aetrix verify that W25P16VSSIG T&R is sourced from the original manufacturer or authorized distributors?
All W25P16VSSIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25P16VSSIG T&R meets industry standards.
7.What is the process for return or replacement of W25P16VSSIG T&R?
All W25P16VSSIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25P16VSSIG T&R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25P16VSSIG T&R part is unused and in its original packaging.
Return procedure for W25P16VSSIG T&R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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