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Winbond Electronics Corporation W25Q01JVSFIM
- Part No.:
- W25Q01JVSFIM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q01JVSFIM.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,984
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Product details
Overview
W25Q01JVSFIM from Winbond is a 1G-bit (128MB) dual-die serial flash memory supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock, 4KB uniform sectors, and hardware write protection via /WP and /HOLD pins. It operates from 2.7V to 3.6V, consumes <2µA in power-down, and targets code execution (XIP), firmware storage, and parameter logging in space-constrained embedded systems.
For engineers reviewing the W25Q01JVSFIM datasheet, W25Q01JVSFIM pinout, W25Q01JVSFIM application, or W25Q01JVSFIM equivalent, key selection criteria include 4-byte addressing support, JEDEC SFDP register compliance, 64-bit unique ID, quad I/O enable (QE) bit configuration, and package-specific /RESET pin availability in SOIC-16.
Technical Context
The W25Q01JVSFIM implements a two-die stacked architecture enabling linear 1G-bit addressing across 524,288 × 256-byte pages. It supports concurrent die operations for accelerated erase/program throughput and maintains independent BUSY/SUS status bits per die for precise operation monitoring.
Its interface logic supports standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI/DTR modes - with QE bit in Status Register-2 controlling IO2 (/WP) and IO3 (/HOLD) remapping. The device includes volatile/non-volatile status register bits for block protection (BP3–BP0), top/bottom selection (TB), complement protection (CMP), and output driver strength (DRV1/DRV0).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (128 M-byte), implemented as two independent 512 M-bit dies with linear address mapping |
| Interface Modes | Standard SPI, Dual SPI, Quad SPI, QPI, and DTR read - all supported with same pin set via mode configuration |
| Max Clock Frequency | 133 MHz SPI clock; enables 266 MB/s (Dual I/O) and 532 MB/s (Quad I/O) effective data rates using Fast Read instructions |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), plus 32 KB and 64 KB blocks - enables fine-grained firmware partitioning and OTA update safety |
| Write Endurance | Minimum 100,000 program/erase cycles per sector - validated for long-life data logging and field-upgradable firmware |
| Data Retention | Greater than 20 years at +25°C - specified for industrial temperature range (-40°C to +85°C) |
| Power Supply | Single 2.7 V to 3.6 V supply; typical power-down current <2 µA - suitable for battery-backed and ultra-low-power IoT nodes |
Pinout & Package
W25Q01JVSFIM uses the 16-pin SOIC 300-mil package (package code SF), featuring dedicated /RESET pin (Pin 3), /HOLD or /RESET multiplexed on Pin 1, and full SPI signal routing including /CS, CLK, DI (IO0), DO (IO1), /WP (IO2), and /HOLD (IO3). Pins 4–6 and 11–14 are No Connect (NC) and must be left unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | /HOLD or /RESET (IO3) | Multiplexed input: functions as /HOLD in standard/dual SPI; configurable as /RESET when QE=0; not available as /HOLD when QE=1 |
| 3 | /RESET | Dedicated hardware reset input - drives device to power-on state when pulsed low ≥1 µs; no software dependency |
| 7 | /CS | Active-low chip select - enables instruction/data transfer only when low; high-impedance DO during deselect |
| 8 | DO (IO1) | Data output in standard SPI; bidirectional I/O1 in dual/quad modes - carries status, ID, and read data |
| 9 | /WP (IO2) | Hardware write protect input (active low); repurposed as IO2 in quad mode when QE=1 |
| 15 | DI (IO0) | Data input in standard SPI; bidirectional I/O0 in dual/quad modes - carries instructions, addresses, and program data |
| 16 | CLK | Serial clock input - controls timing of all SPI/QPI/DTR transfers on rising/falling edges per mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Enables 1G-bit density in standard packages while maintaining per-die status visibility (BUSY/SUS) for deterministic operation control |
| JEDEC SFDP register | Provides standardized, discoverable flash parameter table - eliminates hard-coded timing assumptions in bootloader/firmware |
| 64-bit unique serial number | Factory-programmed per-device ID - enables secure device authentication, firmware binding, and traceability in production |
| Three 256-byte security registers | OTP-lockable storage for cryptographic keys, calibration data, or license tokens - protected independently from main array |
| Erase/program suspend & resume | Allows interruption of long erase/program cycles to service time-critical reads - essential for real-time firmware update scenarios |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers operating in harsh environments with wide temperature swings. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and hardware write protection to prevent accidental corruption during brown-out or ESD events. Use Value: 20-year data retention and -40°C to +85°C operation ensure firmware integrity over full product lifecycle without refresh. |
Use Scenario: Holding boot images and sensor calibration data for automotive camera and radar modules requiring AEC-Q100 alignment. IC Role / Device Role / Timing Role: High-reliability flash memory supporting fast Quad I/O read (532 MB/s effective) for sub-100ms boot times. Use Value: 133 MHz clock + DTR mode enables deterministic read latency critical for ASIL-B functional safety boot sequences. |
| Medical IoT Sensor Node | Smart Home Gateway OTA Storage |
|
Use Scenario: Logging patient vital sign history in portable diagnostic devices powered by coin-cell batteries. IC Role / Device Role / Timing Role: Ultra-low-power non-volatile storage with <2 µA power-down current and 4KB sector granularity for efficient wear leveling. Use Value: Minimal active current and 100K-cycle endurance allow >10 years of daily usage without replacement. |
Use Scenario: Hosting dual firmware images (active + standby) and delta update patches in residential Wi-Fi gateways. IC Role / Device Role / Timing Role: Dual-die architecture enables atomic firmware swap via die-select instructions - eliminating partial-update failure risk. Use Value: Independent die control allows background download to inactive die while running from active die - zero-downtime updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JVSFIM TR | Same die, identical electrical specs, tape-and-reel packaging instead of tube - no functional difference | No change in use case; selected only for automated SMT assembly compatibility | Choose W25Q01JVSFIM TR for high-volume pick-and-place production; W25Q01JVSFIM for prototyping or low-volume hand-soldering |
| MX25L1G45GM2I-12G | 1G-bit Macronix part with 104 MHz max clock, no DTR support, and different SFDP layout - requires firmware revalidation | Lacks DTR and QPI modes; lower bandwidth limits XIP performance in latency-sensitive applications | Select only if DTR/QPI are unused and existing Macronix driver stack reduces integration effort despite 29 MHz clock penalty |
Compared with W25Q01JVSFIM, the TR variant offers identical functionality in tape-and-reel form for SMT lines, while MX25L1G45GM2I-12G trades DTR/QPI bandwidth and Winbond's dual-die flexibility for established Macronix ecosystem support - making it viable only where interface simplification outweighs speed requirements.
Availability
W25Q01JVSFIM is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, and medical IoT sensor node logging requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for W25Q01JVSFIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions since 1987.
The W25Q series was designed for high-performance, low-power embedded code storage and execution - prioritizing XIP capability, robust write protection, and JEDEC-compliant configurability in compact packages.
FAQ
What is the package type and pin count of W25Q01JVSFIM?
W25Q01JVSFIM uses a 16-pin SOIC 300-mil package (package code SF) with dedicated /RESET on Pin 3 and multiplexed /HOLD or /RESET on Pin 1. Pins 4–6 and 11–14 are No Connect and must remain unconnected in PCB layout.
Does W25Q01JVSFIM support 4-byte addressing mode, and how is it enabled?
Yes, W25Q01JVSFIM supports both 3-byte and 4-byte addressing. The 4-byte mode is enabled via the Enter 4-Byte Address Mode instruction (B7h) and disabled with Exit 4-Byte Address Mode (E9h). The ADP bit in Status Register-1 determines power-up default addressing mode.
How does the dual-die architecture of W25Q01JVSFIM affect firmware update reliability?
The dual-die architecture in W25Q01JVSFIM allows independent erasure and programming of each 512M-bit die. This enables atomic firmware swaps - writing new firmware to the inactive die while executing from the active one - eliminating risk of bricking during OTA updates.
Is hardware reset available on W25Q01JVSFIM, and which pin provides it?
Yes, W25Q01JVSFIM provides hardware reset via Pin 3 (/RESET) in its SOIC-16 package. A low pulse ≥1 µs forces immediate return to power-on state, terminating all internal operations - critical for recovery after communication errors or power glitches.
What security features does W25Q01JVSFIM offer beyond basic write protection?
W25Q01JVSFIM includes three 256-byte OTP-lockable security registers, a factory-programmed 64-bit unique ID, SFDP register for standardized parameter discovery, and individual sector/block lock/unlock commands - enabling layered protection for keys, calibration data, and firmware authenticity.
W25Q01JVSFIM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3.5ms
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q01JVSFIM FAQ
1.How can I place an order for W25Q01JVSFIM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01JVSFIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01JVSFIM reliable?
The price and inventory of W25Q01JVSFIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01JVSFIM is usually 5 days.
3.What payment methods are accepted for W25Q01JVSFIM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01JVSFIM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01JVSFIM?
W25Q01JVSFIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01JVSFIM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01JVSFIM?
For technical support, including W25Q01JVSFIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01JVSFIM requirements.
6.How does Aetrix verify that W25Q01JVSFIM is sourced from the original manufacturer or authorized distributors?
All W25Q01JVSFIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01JVSFIM meets industry standards.
7.What is the process for return or replacement of W25Q01JVSFIM?
All W25Q01JVSFIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01JVSFIM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01JVSFIM part is unused and in its original packaging.
Return procedure for W25Q01JVSFIM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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