Winbond Electronics Corporation W25Q01JVTBIM TR

Overview

W25Q01JVTBIM TR from Winbond is a 1G-bit (128MB) dual-die serial flash memory supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock, 4KB uniform sector erase, and 2.7–3.6V single-supply operation. It delivers 66MB/s continuous data transfer and supports XIP execution in embedded boot code storage applications.

For engineers reviewing the W25Q01JVTBIM TR datasheet, W25Q01JVTBIM TR pinout, W25Q01JVTBIM TR application, or W25Q01JVTBIM TR equivalent, key selection criteria include 4-byte addressing support, quad I/O enable (QE) configuration, /HOLD vs /RESET pin mapping in TFBGA, JEDEC SFDP compliance, and 100K program-erase cycle endurance.

Technical Context

The W25Q01JVTBIM TR implements a two-die stacked architecture enabling linear 1G-bit addressing across 524,288 × 256-byte pages. It supports concurrent die operations only for non-addressed instructions (e.g., Write Enable), while address-based reads/writes target one die at a time via internal address decoding.

Its interface logic supports four operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3), and QPI (4-bit command/address/data bus), all with optional DTR timing. The QE bit in Status Register-2 must be set to enable Quad I/O mode, repurposing /WP and /HOLD as IO2 and IO3 respectively.

Key Specifications

Pinout & Package

W25Q01JVTBIM TR uses the 24-ball TFBGA 8x6-mm package (Package Code TB, 5×5 ball array), with dedicated /RESET pin and shared /HOLD functionality on Ball D4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial flash memory applications.

Compared with MX25L1G45GM and IS25LP1G-SO, W25Q01JVTBIM TR uniquely combines dual-die linear addressing, DTR-enhanced throughput, JEDEC SFDP auto-configuration, and factory-programmed 64-bit UID - making it optimal for secure, high-performance embedded boot and update architectures where die transparency and cryptographic binding are essential.

Availability

W25Q01JVTBIM TR is available at Aetrix Electronics and suitable for industrial control systems, automotive infotainment modules, and IoT edge gateways requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for W25Q01JVTBIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including serial flash, PSRAM, and mobile DRAM for embedded and communications markets.

The W25Q series targets high-reliability embedded applications demanding robust code storage, secure firmware updates, and flexible interface options - with W25Q01JVTBIM TR specifically engineered for 1G-bit density, industrial temperature operation, and advanced security features.

FAQ

What is the package type and pin count of W25Q01JVTBIM TR?

W25Q01JVTBIM TR uses a 24-ball TFBGA 8x6-mm package (5×5 ball array) with Package Code TB. It includes dedicated /RESET (Ball A4), /CS (C2), CLK (B2), VCC (B4), GND (B3), and bidirectional IO0–IO3 pins mapped to DI (D3), DO (D2), /WP (C4), and /HOLD (D4). This package supports hardware reset and full Quad SPI functionality without pin multiplexing conflicts.

Does W25Q01JVTBIM TR support 4-byte addressing mode?

Yes, W25Q01JVTBIM TR fully supports both 3-byte and 4-byte addressing modes. The Enter 4-Byte Address Mode (B7h) and Exit 4-Byte Address Mode (E9h) instructions allow dynamic switching. All read, program, and erase commands-including Fast Read Quad I/O (6Ch) and Page Program (12h)-are available in 4-byte mode, enabling access to the full 1G-bit linear address space without bank switching.

How does the dual-die architecture of W25Q01JVTBIM TR affect memory access?

W25Q01JVTBIM TR integrates two independent 512M-bit dies into a single package with unified linear addressing. Address bits A29–A0 span the full 1G-bit range; lower addresses (0x00000000–0x1FFFFFFF) map to Die 0, higher addresses (0x20000000–0x3FFFFFFF) to Die 1. Reads/writes are automatically routed-no software die selection is required-enabling seamless XIP and atomic firmware swaps across die boundaries.

What security features are implemented in W25Q01JVTBIM TR?

W25Q01JVTBIM TR includes hardware write protection via /WP pin and Status Register bits (BP0–BP3, TB, CMP), volatile/non-volatile SRP/SRL lock bits, three 256-byte OTP-lockable security registers, a factory-programmed 64-bit unique ID, and JEDEC SFDP register for standardized parameter discovery. These features collectively support secure boot verification, firmware signing key storage, and tamper-resistant configuration data retention.

Is W25Q01JVTBIM TR compatible with Quad SPI and QPI interfaces?

Yes, W25Q01JVTBIM TR supports both Quad SPI and QPI protocols. Quad SPI requires setting the Quad Enable (QE) bit in Status Register-2, which reassigns /WP and /HOLD to IO2 and IO3. QPI mode is entered via the 38h instruction and uses 4-bit-wide command/address/data transfers. Both modes operate at up to 133MHz clock with DTR support for doubled data rates on each clock edge.