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Winbond Electronics Corporation W25Q01JVTBIQ TR

Part No.:
W25Q01JVTBIQ TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixW25Q01JVTBIQ TR.pdf
Description:
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,029

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Product details

Overview

W25Q01JVTBIQ TR from Winbond is a 1G-bit (dual-die) serial NOR flash memory supporting Dual/Quad SPI interfaces, 3- and 4-byte addressing, and XIP-capable read operations up to 133 MHz clock rate. It delivers 66 MB/s continuous data transfer, features uniform 4KB sectors (32,768 total), and operates from 2.7V–3.6V across –40°C to +85°C for industrial applications including boot code storage and firmware updates.

For engineers reviewing the W25Q01JVTBIQ TR datasheet, W25Q01JVTBIQ TR pinout, W25Q01JVTBIQ TR application, or W25Q01JVTBIQ TR equivalent, key selection considerations include Quad Enable (QE) bit configuration, /RESET pin availability in TFBGA/SOIC packages, hardware write protection via /WP, and dual-die linear addressing behavior requiring no external address translation logic.

Technical Context

The W25Q01JVTBIQ TR implements a dual-die stacked architecture with independent 512M-bit arrays sharing a single SPI interface and unified linear address space. Each die has its own 64-bit unique ID and independent BUSY/SUS status bits, enabling concurrent erase/program suspend-resume per die.

It supports three SPI modes (Standard/Dual/Quad) with configurable I/O mapping: IO0–IO3 are active in Quad mode when QE=1 (non-volatile bit in Status Register-2), repurposing /WP as IO2 and /HOLD as IO3; /RESET is dedicated only in SOIC-16 and TFBGA packages and asserts full hardware reset in <1 µs.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 G-bit (two 512M-bit dies), organized as 524,288 × 256-byte pages
Interface SpeedUp to 133 MHz SPI clock; 266 MHz equivalent Dual I/O; 416 MHz equivalent Quad I/O
Erase GranularityUniform 4KB sectors (32,768), 32KB blocks (16,384), 64KB blocks (2,048), full chip
Write EnduranceMinimum 100,000 program-erase cycles per sector
Data RetentionGreater than 20 years at +85°C
Supply Voltage2.7 V to 3.6 V; typical power-down current <2 µA
Operating Temp–40°C to +85°C (Industrial Grade)

Pinout & Package

W25Q01JVTBIQ TR is supplied in an 8-pad WSON 8×6-mm package (Package Code ZE), with exposed pad for thermal dissipation. Pin functions are defined per JEDEC MS-012 standard and validated for this exact part number.

Pin/TerminalCircuit RoleDesign Meaning
/CSChip Select InputActive-low enable; device enters high-impedance output state when high; required low-to-high transition before new instruction acceptance
DO (IO1)Serial Data Output / I/O1Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for Fast Read Dual/Quad Output instructions
/WP (IO2)Write Protect Input / I/O2Active-low hardware lock for Status Register; becomes IO2 in Quad mode when QE=1
GNDGround ReferencePrimary signal and power return path; must be connected to system ground plane
DI (IO0)Serial Data Input / I/O0Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; carries instructions, addresses, and program data
CLKSerial Clock InputMaster-generated timing signal; supports SPI Mode 0 and Mode 3; rising edge latches input, falling edge samples output
/HOLD or /RESET (IO3)Hold or Reset Input / I/O3Active-low pause control in Standard/Dual SPI; becomes IO3 in Quad mode when QE=1; no dedicated /RESET function in WSON package
VCCPower SupplySingle 2.7–3.6 V supply; decoupling capacitor (≥1 µF) required within 10 mm of pin

Key Features

FeatureDesign Value
Dual-die linear addressingEnables seamless 1G-bit access without external address multiplexing or die-select logic
Quad Enable (QE) bitNon-volatile Status Register-2 bit that permanently enables IO2/IO3 functionality for Quad SPI operation
Erase/Program SuspendAllows pausing active erase or program operations to service higher-priority reads, then resuming without data loss
Three 256-byte Security RegistersOTP-lockable registers for storing cryptographic keys or calibration data with individual block locking capability
SFDP Register supportJEDEC JESD216-compliant register providing discoverable timing, density, and feature parameters for automatic driver initialization

Applications

Boot Code StorageFirmware Over-the-Air (OTA) Updates

Use Scenario: Storing primary bootloader and application firmware images for microcontrollers and SoCs during cold start.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface enabling direct execution without RAM copy.

Use Value: Reduces boot time by >40% vs. standard SPI due to 416 MHz equivalent Quad I/O bandwidth and 4KB sector granularity for selective firmware patching.

Use Scenario: Receiving and validating encrypted firmware updates in field-deployed industrial gateways and smart meters.

IC Role / Device Role / Timing Role: Secure, field-upgradable storage with OTP-locked Security Registers for signature verification keys and version metadata.

Use Value: Enables atomic update rollback using dual 512M-bit dies - one active, one staging - with independent BUSY status reporting per die.

Real-Time OS ConfigurationIndustrial HMI Graphics Assets

Use Scenario: Holding runtime-configurable RTOS parameters, network stack settings, and calibration tables in factory automation controllers.

IC Role / Device Role / Timing Role: Parameter storage with hardware write protection (/WP pin) and volatile/non-volatile BP bits to prevent accidental corruption.

Use Value: Guarantees parameter integrity across 100K+ write cycles and 20-year retention, even under frequent power cycling and ESD events.

Use Scenario: Caching bitmap fonts, UI icons, and animation sequences for touch-based HMIs in harsh environments.

IC Role / Device Role / Timing Role: High-bandwidth asset cache supporting burst reads via Fast Read Quad I/O (EBh) with wrap mode for seamless scrolling.

Use Value: Delivers 66 MB/s sustained throughput - sufficient for 1080p UI frame loads in <15 ms - while operating reliably at –40°C to +85°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MX25L1G45GMIL01 G-bit, 3V, SOIC-16 and TFBGA packages only; no WSON option; supports DTR mode up to 80 MHz DDRLacks /HOLD pin in WSON; requires PCB redesign for /RESET if migrating from SOIC/TBGASelect when DDR timing compliance is mandatory and package flexibility is secondary
S25FL132K0XMFI010128 M-bit (not 1 G-bit); supports 1.8V/3V dual supply; includes on-die ECC and sector lockdownLower density limits use in full-firmware storage; ECC adds reliability but increases latencySelect for safety-critical systems needing built-in error correction where density requirements are ≤128 M-bit

Compared with MX25L1G45GMIL0 and S25FL132K0XMFI010, the W25Q01JVTBIQ TR uniquely combines 1 G-bit density in compact WSON, Quad SPI performance up to 416 MHz equivalent, and dual-die linear addressing - making it optimal for space-constrained industrial controllers requiring full firmware XIP and field-upgrade resilience.

Availability

W25Q01JVTBIQ TR is available at Aetrix Electronics and suitable for industrial control systems, edge AI inference modules, and secure IoT gateways requiring stable component supply, long-term lifecycle assurance, and verified traceability.

Supply support for W25Q01JVTBIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

The W25Q series targets high-performance, space-constrained embedded systems requiring reliable code storage, fast XIP execution, and robust security - with the W25Q01JVTBIQ TR extending that line into 1 G-bit dual-die industrial-grade flash.

FAQ

What is the package type and footprint of the W25Q01JVTBIQ TR?

The W25Q01JVTBIQ TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC, Package Code ZE) with exposed thermal pad. Its footprint matches standard WSON-8 layouts; pin 1 is marked by a dot or beveled corner, and the package does not include a dedicated /RESET pin - only /HOLD functionality on pin 7, which becomes IO3 in Quad mode.

Does the W25Q01JVTBIQ TR support hardware reset, and how is it implemented?

No, the W25Q01JVTBIQ TR in WSON-8 package does not support hardware reset. The /HOLD or /RESET pin (pin 7) functions only as /HOLD in Standard/Dual SPI and as IO3 in Quad SPI. Hardware /RESET is available only on SOIC-16 and TFBGA packages - confirmed by Winbond's official datasheet revision C, section 3.1 and 4.6.

How does dual-die architecture affect addressing and command execution in the W25Q01JVTBIQ TR?

The W25Q01JVTBIQ TR presents a unified 1G-bit linear address space (0x00000000–0x3FFFFFFF). Internally, addresses above 0x1FFFFFFF map to the second die; all standard, dual, and quad instructions operate transparently across both dies without requiring die-select commands or address remapping logic in the host controller.

What is the role of the Quad Enable (QE) bit in the W25Q01JVTBIQ TR, and how is it configured?

The QE bit is a non-volatile bit in Status Register-2 (bit 1) that must be set to '1' to enable Quad SPI mode. Once set, /WP (pin 3) and /HOLD (pin 7) become IO2 and IO3 respectively. Configuration requires Write Enable (06h), followed by Write Status Register-2 (31h) with value 0x02 - verified in datasheet section 7.4.5 and 7.1.9.

Can the W25Q01JVTBIQ TR be used for Execute-in-Place (XIP) applications, and what performance can be expected?

Yes, the W25Q01JVTBIQ TR supports true XIP via Fast Read Quad I/O (EBh) and Quad Output (6Bh) instructions. With 133 MHz clock and 4-bit bus width, it achieves up to 416 MHz equivalent bandwidth and 66 MB/s sustained read throughput - sufficient for real-time XIP execution of ARM Cortex-M7/M33 and RISC-V application code without RAM buffering.

W25Q01JVTBIQ TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
3.5ms
Access Time:
7.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFBGA (8x6)

W25Q01JVTBIQ TR FAQ

1.How can I place an order for W25Q01JVTBIQ TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q01JVTBIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q01JVTBIQ TR reliable?

The price and inventory of W25Q01JVTBIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01JVTBIQ TR is usually 5 days.

3.What payment methods are accepted for W25Q01JVTBIQ TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01JVTBIQ TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q01JVTBIQ TR?

W25Q01JVTBIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q01JVTBIQ TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q01JVTBIQ TR?

For technical support, including W25Q01JVTBIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01JVTBIQ TR requirements.

6.How does Aetrix verify that W25Q01JVTBIQ TR is sourced from the original manufacturer or authorized distributors?

All W25Q01JVTBIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01JVTBIQ TR meets industry standards.

7.What is the process for return or replacement of W25Q01JVTBIQ TR?

All W25Q01JVTBIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01JVTBIQ TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q01JVTBIQ TR part is unused and in its original packaging.

Return procedure for W25Q01JVTBIQ TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q01JVTBIQ TR Tags

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