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Winbond Electronics Corporation W25Q01JVZEIM TR
- Part No.:
- W25Q01JVZEIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q01JVZEIM TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,729
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Product details
Overview
W25Q01JVZEIM TR from Winbond is a 1G-bit (128MB) dual-die serial flash memory supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock, 4KB uniform sectors, and 2.7–3.6V single-supply operation. It delivers 66MB/s continuous data transfer and supports XIP execution, code shadowing, and secure parameter storage in space-constrained embedded systems.
For engineers reviewing the W25Q01JVZEIM TR datasheet, W25Q01JVZEIM TR pinout, W25Q01JVZEIM TR application, or W25Q01JVZEIM TR equivalent, key selection considerations include 4-byte addressing support, Quad Enable (QE) bit configuration, /HOLD vs /RESET pin mapping per package, and JEDEC SFDP register compatibility for auto-configuration.
Technical Context
The W25Q01JVZEIM TR implements a two-die stacked architecture enabling linear 1G-bit addressing across 524,288 × 256-byte pages. Each die maintains independent BUSY and SUS status bits, allowing concurrent erase/program operations across dies under host coordination.
It supports four operational modes: Standard SPI (DI/DO), Dual I/O (IO0/IO1), Quad I/O (IO0–IO3), and QPI with DTR-where QE bit (SR2[1]) must be set non-volatilely to enable IO2 (/WP) and IO3 (/HOLD) functions. The /RESET pin is hardware-only on SOIC-16 and TFBGA packages; on WSON ZE, it shares IO3 and requires SR2[7] configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (128 MB) as two 512 M-bit stacked dies with linear address space |
| Interface Modes | Standard/Dual/Quad SPI, QPI, and DTR read-requires QE=1 for Quad I/O pin remapping |
| Max Clock Frequency | 133 MHz SPI clock; enables 266 MHz (Dual) or 532 MHz (Quad) effective throughput |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), plus 32 KB and 64 KB blocks for flexible firmware partitioning |
| Data Retention | 20+ years at +85°C-validated for industrial lifecycle requirements |
| Write Endurance | 100,000 program/erase cycles per sector-supports frequent OTA update logging |
| Operating Voltage | 2.7 V to 3.6 V single supply-compatible with 3.3 V logic domains without level shifting |
| Temperature Range | −40°C to +85°C-qualified for extended industrial ambient conditions |
Pinout & Package
W25Q01JVZEIM TR uses the 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond code ZE), with exposed thermal pad. Pin 1 is /CS; pins 2–3 and 5–8 are bidirectional I/Os configurable per interface mode; pin 4 is GND; pin 6 is CLK; pin 8 is VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS (Pin 1) | Chip Select Input | Active-low enable: high = device deselected (high-Z DO/IOs, standby current); low = active communication |
| DO / IO1 (Pin 2) | Data Output / I/O 1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI-used for instruction/data readback |
| /WP / IO2 (Pin 3) | Write Protect Input / I/O 2 | Hardware write lock when low (if QE=0); becomes IO2 in Quad mode (QE=1)-no dedicated /WP in Quad |
| GND (Pin 4) | Ground Reference | Primary return path for VCC and all I/O signals; must be low-impedance connection to system ground plane |
| DI / IO0 (Pin 5) | Data Input / I/O 0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI-carries instructions, addresses, and data |
| CLK (Pin 6) | Serial Clock Input | Edge-triggered timing reference: rising edge for input sampling, falling edge for output valid window |
| /HOLD or /RESET / IO3 (Pin 7) | Hold or Reset Input / I/O 3 | Active-low pause signal (if QE=0); configured as /RESET via SR2[7] (if QE=0); disabled as I/O in Quad mode (QE=1) |
| VCC (Pin 8) | Power Supply | 2.7–3.6 V core and I/O supply-requires local 1 µF ceramic decoupling adjacent to pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Enables seamless 1G-bit access without software bank switching-critical for XIP boot loaders |
| Erase/Program suspend & resume | Allows foreground read access during background erase/write-essential for real-time logging |
| 64-bit unique ID + SFDP register | Enables automatic driver initialization and device-specific configuration without hard-coded parameters |
| Three 256-byte security registers | OTP-lockable storage for keys, calibration data, or firmware signatures-prevents unauthorized readback |
| Top/bottom/complement array protection | Hardware-enforced write lock on configurable memory regions-protects bootloader or factory settings |
| 4-byte addressing mode | Required for full 1G-bit access; enabled via B7h instruction and retained across power cycles if ADP=1 |
Applications
| Industrial HMI Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing GUI assets, firmware images, and calibration tables in panel-mounted HMIs operating at −40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable Quad SPI interface for low-latency UI rendering. Use Value: 4KB sector granularity enables atomic updates of individual display modules without erasing full firmware image. |
Use Scenario: Holding boot code and sensor fusion algorithms for radar/EPS ECUs requiring AEC-Q100 alignment. IC Role / Device Role / Timing Role: Primary boot memory accessed via QPI-DTR at 532 MHz effective rate for sub-100ms cold start. Use Value: Dual-die architecture allows parallel read from separate firmware partitions-reducing boot latency by ~35% vs single-die flash. |
| Medical IoT Sensor Node | Networking Equipment Configuration |
|
Use Scenario: Logging patient vital sign history and storing encrypted device certificates in portable diagnostic devices. IC Role / Device Role / Timing Role: Secure parameter and event log storage using OTP-locked security registers and individual sector locks. Use Value: 100K endurance cycles support >5 years of daily 20-record logging; 20-year retention ensures data integrity over device lifetime. |
Use Scenario: Holding FPGA bitstreams, switch ASIC configurations, and fail-safe recovery images in enterprise switches. IC Role / Device Role / Timing Role: High-reliability configuration store with hardware write protection against accidental overwrite during firmware upgrade. Use Value: Top/bottom block protect + CMP bits prevent corruption of critical boot sectors while allowing dynamic config updates elsewhere. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1G45GMIL0 | 1 G-bit, 3.3 V, supports only standard/dual SPI (no QPI/DTR); no 4-byte addressing; 100K P/E cycles | Lacks Quad I/O and DTR-limits max throughput to ~40 MB/s; unsuitable for XIP or high-bandwidth streaming | Select when QPI/DTR and 4-byte addressing are unnecessary and cost sensitivity outweighs performance needs |
| S25FL132K0XMFI010 | 128 MB, 3.0 V, supports Octal DTR (up to 400 MHz), includes on-die ECC; 100K P/E cycles; -40°C to +105°C | Higher temperature rating and built-in ECC-better for mission-critical automotive or telecom infrastructure | Choose for extended temp range or where bit error correction is mandatory; higher BOM cost than W25Q01JVZEIM TR |
Compared with MX25L1G45GMIL0 and S25FL132K0XMFI010, W25Q01JVZEIM TR uniquely balances Quad SPI + QPI + DTR flexibility, 4-byte addressing, and dual-die linear access-making it optimal for cost-sensitive industrial and consumer designs needing scalable bandwidth without ECC overhead.
Availability
W25Q01JVZEIM TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive ADAS boot memory, medical IoT sensor node logging, networking equipment configuration, and embedded edge AI model caching requiring stable component supply and long-term lifecycle assurance.
Supply support for W25Q01JVZEIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions since 1987.
The W25Q series targets high-performance embedded systems requiring fast, secure, and reliable code and data storage-designed specifically for XIP, OTA updates, and industrial-grade reliability.
FAQ
What is the package type and pin count of W25Q01JVZEIM TR?
W25Q01JVZEIM TR uses an 8-pin WSON 8×6-mm package (Winbond code ZE, JEDEC MO-252). It has eight terminals: /CS, DO/IO1, /WP/IO2, GND, DI/IO0, CLK, /HOLD or /RESET/IO3, and VCC. No NC pins are present-every terminal is functional and electrically assigned per the datasheet.
Does W25Q01JVZEIM TR support 4-byte addressing, and how is it enabled?
Yes, W25Q01JVZEIM TR supports 4-byte addressing for full 1G-bit access. It is enabled via the Enter 4-Byte Address Mode instruction (B7h). The setting persists across power cycles only if the ADP bit (Status Register-3[0]) is set non-volatilely; otherwise, it reverts to 3-byte mode after reset.
How does the dual-die architecture of W25Q01JVZEIM TR affect read/write operations?
W25Q01JVZEIM TR integrates two independent 512M-bit dies in one package with unified linear addressing. Each die has its own BUSY and SUS status bits, enabling host-coordinated concurrent operations-e.g., reading from one die while erasing the other-improving effective throughput in multitasked firmware environments.
Can W25Q01JVZEIM TR be used for Execute-in-Place (XIP) applications?
Yes, W25Q01JVZEIM TR supports XIP via Dual/Quad SPI and QPI interfaces. Its 133MHz clock with DTR capability achieves up to 532MHz effective bandwidth, enabling low-latency instruction fetch. XIP requires proper cache coherency handling and QE bit configuration to enable Quad I/O mode for maximum performance.
What security features are implemented in W25Q01JVZEIM TR?
W25Q01JVZEIM TR includes hardware write protection via /WP pin and Status Register BP/TB/CMP bits, three 256-byte OTP-lockable security registers, 64-bit unique ID, JEDEC SFDP register, and programmable output driver strength. These features collectively support secure boot, firmware integrity verification, and tamper-resistant parameter storage.
W25Q01JVZEIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI, DTR
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3.5ms
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q01JVZEIM TR FAQ
1.How can I place an order for W25Q01JVZEIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01JVZEIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01JVZEIM TR reliable?
The price and inventory of W25Q01JVZEIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01JVZEIM TR is usually 5 days.
3.What payment methods are accepted for W25Q01JVZEIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01JVZEIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01JVZEIM TR?
W25Q01JVZEIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01JVZEIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01JVZEIM TR?
For technical support, including W25Q01JVZEIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01JVZEIM TR requirements.
6.How does Aetrix verify that W25Q01JVZEIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q01JVZEIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01JVZEIM TR meets industry standards.
7.What is the process for return or replacement of W25Q01JVZEIM TR?
All W25Q01JVZEIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01JVZEIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01JVZEIM TR part is unused and in its original packaging.
Return procedure for W25Q01JVZEIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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