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Winbond Electronics Corporation W25Q01JVZEIQ TR
- Part No.:
- W25Q01JVZEIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q01JVZEIQ TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,939
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Product details
Overview
W25Q01JVZEIQ TR from Winbond is a 1G-bit (dual-die 512M-bit × 2) serial flash memory IC supporting Dual/Quad SPI, 3- and 4-byte addressing, and XIP operation. It delivers 133 MHz SPI clock rate, 66 MB/s continuous read throughput, and operates from 2.7V to 3.6V across –40°C to +105°C. Used for code storage, firmware boot, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q01JVZEIQ TR datasheet, W25Q01JVZEIQ TR pinout, W25Q01JVZEIQ TR application, or W25Q01JVZEIQ TR equivalent, this page provides verified package mapping (WSON 8x6-mm ZE), confirmed Quad I/O pin functions, JEDEC ID/SFDP register support, and validated industrial-plus temperature grade performance - all critical for automotive MCU boot, industrial HMI firmware, and secure IoT device storage selection.
Technical Context
The W25Q01JVZEIQ TR implements a dual-die stacked architecture with independent 64-bit unique serial numbers per die and separate BUSY/SUS status bits, enabling concurrent operations across die boundaries. Its Quad SPI mode requires non-volatile QE bit setting in Status Register-2, repurposing /WP as IO2 and /HOLD as IO3.
It supports hardware reset via dedicated /RESET pin (available only in SOIC-16 and TFBGA packages), while the WSON ZE variant uses /HOLD as IO3 in Quad mode and lacks dedicated /RESET. The ADP bit determines power-up address mode (3- vs 4-byte), but does not dynamically switch modes during operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (two 512 M-bit dies), organized as 524,288 × 256-byte pages |
| SPI Clock Rate | Up to 133 MHz standard/Dual/Quad SPI; enables 266 MHz (Dual) or 532 MHz (Quad) effective data rates |
| Data Transfer Rate | 66 MB/s continuous read via Fast Read Quad I/O (EBh), outperforming parallel Flash in random access |
| Operating Voltage | 2.7 V to 3.6 V single supply; <2 µA typical power-down current for ultra-low standby power |
| Temperature Range | –40°C to +105°C (Industrial Plus grade), qualified for extended thermal cycling in harsh environments |
| Erase/Program Endurance | Minimum 100,000 program-erase cycles per sector; >20-year data retention at 55°C |
| Security Features | Three 256-byte OTP-lockable security registers, individual sector/block lock (36h/39h), SFDP register, and JEDEC ID (9Fh) |
Pinout & Package
W25Q01JVZEIQ TR uses the 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond package code ZE), with exposed thermal pad (not electrically connected). Pin 1 is /CS; pins 2–3–5–7 are bidirectional I/Os (IO1/IO2/IO0/IO3); pin 4 is GND; pin 6 is CLK; pin 8 is VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: high = high-Z outputs and standby power; low = active communication and increased current draw |
| DO (IO1) | Bidirectional Data I/O | Serial data output in Standard/Dual SPI; becomes IO1 in Quad mode; supports Fast Read Dual/Quad Output |
| /WP (IO2) | Bidirectional Data I/O / Hardware Protect | In Quad mode: IO2; in Standard/Dual mode: active-low write protect for status register and memory sectors |
| GND | Ground Reference | Primary return path for VCC and all I/O signals; must be low-impedance for stable timing and noise immunity |
| DI (IO0) | Bidirectional Data I/O | Serial data input in Standard/Dual SPI; becomes IO0 in Quad mode; used for all instruction/address/data writes |
| CLK | Serial Clock Input | Edge-triggered timing reference (Mode 0 or Mode 3); rising edge for input, falling edge for output in Standard SPI |
| /HOLD (IO3) | Bidirectional Data I/O / Hold Control | In Quad mode: IO3; in Standard/Dual mode: active-low pause signal that freezes ongoing transfers without deselecting device |
| VCC | Power Supply | 2.7–3.6 V main supply; decoupling capacitor required within 5 mm of pin for transient current stability |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Single 1G-bit address space (0x00000000–0x3FFFFFFF) abstracts two physical dies; no software interleaving required |
| Quad Enable (QE) bit | Non-volatile bit in Status Register-2 controls permanent IO2/IO3 remapping; eliminates need for external configuration on power-up |
| Erase/Program Suspend | 75h/7Ah instructions allow pausing long erase/program operations to service time-critical reads or interrupts |
| Individual sector lock | 36h/39h commands enable per-sector (4KB) write protection with OTP lock capability for firmware partitioning |
| Discoverable Parameters (SFDP) | 5Ah instruction returns standardized JEDEC SFDP v1.6 table, enabling automatic driver configuration without hard-coded timing values |
Applications
| Automotive Infotainment Boot | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and OS kernel for head-unit MCU requiring fast cold-start execution. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable Quad SPI interface enabling direct CPU execution without RAM copy. Use Value: 133 MHz Quad SPI and 66 MB/s read throughput reduce boot time by >40% vs legacy 80 MHz SPI Flash; dual-die architecture ensures full 1G-bit linear address space for large A/B firmware images. | Use Scenario: Retaining configuration parameters, calibration data, and firmware updates in programmable logic controllers operating in factory-floor environments. IC Role / Device Role / Timing Role: Secure, field-upgradable storage with hardware write protection and sector-level locking for mission-critical data integrity. Use Value: Individual 4KB sector lock (36h) and OTP security registers prevent unauthorized firmware modification; –40°C to +105°C rating ensures reliability under thermal stress during continuous operation. |
| Medical Imaging Device Log Buffer | Smart Energy Meter Firmware Vault |
Use Scenario: Capturing diagnostic logs and sensor calibration history in portable ultrasound equipment with strict data retention requirements. IC Role / Device Role / Timing Role: High-endurance, long-retention data logger using uniform 4KB sectors for wear-leveling and timestamped record management. Use Value: 100K program-erase cycles and >20-year data retention at 55°C meet IEC 62304 Class C software lifecycle requirements; SFDP register enables auto-tuning of read latency for varying temperature conditions. | Use Scenario: Storing encrypted firmware and cryptographic keys in utility-grade smart meters deployed outdoors for 15+ years. IC Role / Device Role / Timing Role: Tamper-resistant firmware vault leveraging three 256-byte OTP-locked security registers and JEDEC-compliant Unique ID for device authentication. Use Value: Dedicated security registers with OTP locks prevent key extraction during physical probing; dual-die Unique IDs (64-bit each) support device-specific key binding and secure provisioning workflows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1G45GM | 1 G-bit density, 133 MHz max clock, but only supports 3-byte addressing and lacks 4-byte mode or SFDP register | No native support for >16 MB linear addressing; requires software address translation for full capacity use | Choose when system firmware is fixed below 16 MB and SFDP-driven driver portability is unnecessary |
| IS25LP1G | 1 G-bit, 133 MHz, full Quad SPI and SFDP v1.6 support, but rated only to +85°C (Industrial grade, not Industrial Plus) | Not qualified for extended temperature operation above 85°C; unsuitable for under-hood or high-ambient industrial deployments | Choose for cost-sensitive consumer or commercial applications where ambient temperature remains ≤85°C |
Compared with MX25L1G45GM and IS25LP1G, the W25Q01JVZEIQ TR uniquely combines 4-byte addressing, SFDP v1.6, dual-die Unique IDs, and –40°C to +105°C Industrial Plus qualification - making it the only option among the three for future-proof, high-reliability, large-address-space embedded firmware storage.
Availability
W25Q01JVZEIQ TR is available at Aetrix Electronics and suitable for automotive infotainment boot, industrial PLC firmware storage, and medical imaging log buffer applications requiring stable component supply, long-term lifecycle assurance, and guaranteed Industrial Plus temperature compliance.
Supply support for W25Q01JVZEIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR flash, RAM, and mobile DRAM, serving automotive, industrial, and communications markets since 1987.
The W25Q series was designed for high-performance, secure, and scalable code storage in resource-constrained embedded systems - emphasizing XIP capability, robust security features, and extended temperature reliability for next-generation firmware architectures.
FAQ
What package type does W25Q01JVZEIQ TR use, and is it lead-free?
W25Q01JVZEIQ TR uses the 8-pad WSON 8×6-mm package (package code ZE) with RoHS-compliant, lead-free finish and halogen-free molding compound. The exposed thermal pad is non-functional and must remain unconnected or grounded per PCB layout guidelines in Winbond's AN-401 application note. This package meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
Does W25Q01JVZEIQ TR support hardware reset, and how is it implemented?
W25Q01JVZEIQ TR does not include a dedicated /RESET pin in the WSON ZE package. Hardware reset is only available on SOIC-16 (pin 3) and TFBGA (ball A4) variants. For W25Q01JVZEIQ TR, system-level reset must be handled via software commands (66h + 99h) or power-cycle sequencing. The /HOLD pin (pin 7) functions as IO3 in Quad mode and cannot serve as reset.
How is Quad SPI enabled on W25Q01JVZEIQ TR, and what changes occur to pin functions?
Quad SPI is enabled on W25Q01JVZEIQ TR by setting the Quad Enable (QE) bit in Status Register-2 using instruction 31h. Once set, /WP (pin 3) becomes IO2 and /HOLD (pin 7) becomes IO3. This remapping is non-volatile and persists across power cycles. Standard and Dual SPI retain /WP as hardware write-protect and /HOLD as pause control.
What is the significance of the "dual-die" architecture in W25Q01JVZEIQ TR?
The dual-die architecture in W25Q01JVZEIQ TR integrates two independent 512 M-bit dies into one package with unified linear addressing (0x00000000–0x3FFFFFFF). Each die has its own 64-bit Unique ID and independent BUSY/SUS status bits, enabling die-level concurrency and redundancy - critical for high-availability systems where partial die failure must not halt full memory access.
Can W25Q01JVZEIQ TR be used for secure key storage, and which features support this?
Yes, W25Q01JVZEIQ TR supports secure key storage via three dedicated 256-byte Security Registers (SR1–SR3), each protected by OTP lock bits (LB1–LB3). Once locked, contents cannot be overwritten or read back. Combined with individual sector lock (36h), JEDEC Unique ID (4Bh), and SFDP-based timing auto-configuration, it enables tamper-resistant firmware signing key storage compliant with IEC 62443 Level 2 requirements.
W25Q01JVZEIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3.5ms
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q01JVZEIQ TR FAQ
1.How can I place an order for W25Q01JVZEIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01JVZEIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01JVZEIQ TR reliable?
The price and inventory of W25Q01JVZEIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01JVZEIQ TR is usually 5 days.
3.What payment methods are accepted for W25Q01JVZEIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01JVZEIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01JVZEIQ TR?
W25Q01JVZEIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01JVZEIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01JVZEIQ TR?
For technical support, including W25Q01JVZEIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01JVZEIQ TR requirements.
6.How does Aetrix verify that W25Q01JVZEIQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q01JVZEIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01JVZEIQ TR meets industry standards.
7.What is the process for return or replacement of W25Q01JVZEIQ TR?
All W25Q01JVZEIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01JVZEIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01JVZEIQ TR part is unused and in its original packaging.
Return procedure for W25Q01JVZEIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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