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Winbond Electronics Corporation W25Q01NWSFIM
- Part No.:
- W25Q01NWSFIM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q01NWSFIM.pdf
- Description:
- IC FLASH 1GBIT SPI 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,626
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Product details
Overview
W25Q01NWSFIM from Winbond is a 1G-bit (dual-die 512M-bit × 2) serial flash memory IC supporting Dual/Quad SPI interfaces, 1.7–1.95V single-supply operation, 133MHz max clock, and 4KB uniform sector erase. It enables XIP (execute-in-place) code execution and data storage in space-constrained embedded systems requiring high-density nonvolatile memory with low power-down current (0.4µA typ.).
For engineers reviewing the W25Q01NWSFIM datasheet, W25Q01NWSFIM pinout, W25Q01NWSFIM application, or W25Q01NWSFIM equivalent, this page delivers verified package mapping (SOIC-16 SF), confirmed pin functions (/CS, CLK, IO0–IO3, /WP, /HOLD, /RESET), JEDEC ID support, SFDP register compliance, and real-world timing behavior for boot code shadowing and firmware update use cases.
Technical Context
The W25Q01NWSFIM implements a dual-die stacked architecture with linear 1G-bit addressing, independent status registers per die (including BUSY and SUS bits), and hardware reset capability via dedicated /RESET pin. It supports 3-byte and 4-byte address modes controlled by non-volatile ADP bit and software commands (B7h/E9h).
Its Quad SPI mode requires non-volatile QE bit setting in Status Register-2; when enabled, /WP becomes IO2 and /HOLD becomes IO3. Erase/program suspend/resume functionality enables concurrent background operations without interrupting host communication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (two 512M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration into 1.8V logic domains without level shifting |
| Max Clock Frequency | 133 MHz - supports 532 MB/s effective Quad I/O throughput (133 MHz × 4) |
| Erase Granularity | 4 KB sectors (32,768 total), 32 KB blocks, 64 KB blocks (2,048 total) - enables fine-grained firmware partitioning |
| Program-Erase Cycles | 100,000 min - ensures long-term reliability for field-updatable firmware storage |
| Data Retention | 20+ years - validated for industrial temperature range (−40°C to +85°C) |
| Power-Down Current | 0.4 µA typ. - critical for battery-backed or ultra-low-power IoT endpoint designs |
Pinout & Package
W25Q01NWSFIM uses the 16-pin SOIC 300-mil package (package code SF), featuring a dedicated /RESET pin and full Dual/Quad SPI I/O support. Pin functions are electrically validated per Winbond datasheet Rev. B (July 2021).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS (Pin 7) | Chip Select Input | Active-low enable signal; must transition high→low after power-up before instruction acceptance |
| CLK (Pin 16) | Serial Clock Input | Timing reference for all SPI transfers; supports Mode 0 and Mode 3 clock polarity/idle states |
| DI (IO0) (Pin 15) | Serial Data Input / Bidirectional I/O | Input for Standard SPI; becomes bidirectional IO0 in Dual/Quad modes when QE=1 |
| DO (IO1) (Pin 8) | Serial Data Output / Bidirectional I/O | Output for Standard SPI; becomes bidirectional IO1 in Dual/Quad modes when QE=1 |
| /WP (IO2) (Pin 9) | Write Protect Input / Bidirectional I/O | Hardware write protection when low; repurposed as IO2 in Quad SPI upon QE bit set |
| /HOLD (IO3) (Pin 1) | Hold Input / Bidirectional I/O | Pauses active SPI transaction; becomes IO3 in Quad SPI when QE=1 |
| /RESET (Pin 3) | Hardware Reset Input | Dedicated active-low reset; forces device to power-on state regardless of internal state (~1 µs pulse required) |
| VCC (Pin 2) | Power Supply | 1.7–1.95 V supply; powers internal charge pumps and logic |
| GND (Pin 10) | Ground Reference | Return path for all I/O and core circuitry; decoupling capacitor required near pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad SPI Interface | Enables 266 MB/s (Dual) or 532 MB/s (Quad) effective bandwidth - eliminates need for parallel NOR flash in boot ROM applications |
| 4KB Uniform Sector Architecture | Allows independent firmware image, parameter, and log storage partitions - simplifies OTA update rollback and secure boot validation |
| Erase/Program Suspend & Resume | Permits host to pause background erase/program operations and service time-critical interrupts - essential for real-time OS environments |
| JEDEC ID + SFDP Register | Enables automatic driver initialization and configuration discovery - removes hardcoded timing/register dependencies in bootloader code |
| Two 64-bit Unique Serial Numbers | One per die - supports cryptographic key binding, device identity attestation, and anti-cloning in secure boot chains |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
Use Scenario: Storing primary bootloader and initial application firmware in microcontroller-based edge nodes. IC Role / Device Role / Timing Role: Nonvolatile boot ROM replacement with XIP-capable Quad SPI interface. Use Value: Enables direct execution of startup code without RAM copy, reducing boot latency by >40% vs. standard SPI flash. | Use Scenario: Holding signed firmware images during over-the-air (OTA) updates in industrial gateways. IC Role / Device Role / Timing Role: Secure, field-upgradable firmware repository with atomic sector-level erase. Use Value: Supports A/B partitioning using 4KB sectors - guarantees safe rollback if update fails mid-write. |
| Secure Configuration Storage | Audio/Log Data Buffering |
Use Scenario: Storing encrypted calibration parameters and device-specific keys in medical sensors. IC Role / Device Role / Timing Role: Tamper-resistant configuration vault leveraging Security Registers and OTP locks. Use Value: Three 256-byte Security Registers with individual OTP lock bits prevent runtime modification of critical settings. | Use Scenario: Capturing sensor logs or voice snippets in battery-powered wearables between host uploads. IC Role / Device Role / Timing Role: Low-power, high-endurance data buffer with 100K program-erase cycles. Use Value: 0.4 µA power-down current extends battery life to >12 months in intermittent logging mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JWSFIM | Same density and SOIC-16 package, but rated for −40°C to +105°C extended temperature range | Required for automotive under-hood or industrial motor drive control units | Select W25Q01JWSFIM only when operating ambient exceeds +85°C |
| MX25L1G45GMI-13G | 1G-bit Macronix part; supports 133MHz Quad SPI but lacks dual-die architecture and individual die unique IDs | Suitable for cost-sensitive consumer electronics where die-level uniqueness is not required | Choose MX25L1G45GMI-13G when JEDEC ID compatibility suffices and die-level security features are unnecessary |
Compared with W25Q01JWSFIM, the W25Q01NWSFIM offers identical pinout and instruction set but trades extended temperature rating for lower cost; versus MX25L1G45GMI-13G, it provides stronger security via per-die unique IDs and dedicated Security Registers - critical for certified IoT deployments.
Availability
W25Q01NWSFIM is available at Aetrix Electronics and suitable for boot code storage, firmware update buffering, and secure configuration retention requiring stable component supply across industrial, medical, and connected-device production programs.
Supply support for W25Q01NWSFIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions including serial flash, PSRAM, and code storage devices for embedded systems.
The W25Q series targets high-performance, low-voltage embedded applications demanding XIP capability, robust security, and industrial temperature reliability - with W25Q01NWSFIM optimized for 1.8V systems needing 1G-bit density in SOIC packaging.
FAQ
What is the package type and pin count for W25Q01NWSFIM?
W25Q01NWSFIM uses the 16-pin SOIC 300-mil package (package code SF). It includes dedicated pins for /CS, CLK, DI/IO0, DO/IO1, /WP/IO2, /HOLD/IO3, /RESET, VCC, and GND - with /RESET available only on SOIC and TFBGA variants, not WSON.
Does W25Q01NWSFIM support Quad SPI mode out of the box?
No - W25Q01NWSFIM requires the non-volatile Quad Enable (QE) bit in Status Register-2 to be set (via Write Status Register-2 command 31h) before /WP and /HOLD pins function as IO2 and IO3. Until QE=1, only Standard or Dual SPI modes are active.
How does the dual-die architecture of W25Q01NWSFIM affect addressing and performance?
W25Q01NWSFIM presents a unified 1G-bit linear address space; the dual-die structure is transparent to the host. Each die has its own 64-bit Unique ID and independent BUSY/SUS status bits, enabling concurrent operations across dies only in specific command flows - not general parallel access.
What is the role of the /RESET pin on W25Q01NWSFIM, and how does it differ from software reset?
The /RESET pin on W25Q01NWSFIM is a dedicated hardware reset input that forces immediate return to power-on state regardless of ongoing erase/program cycles. Unlike software reset (66h + 99h), it requires no SPI communication and works even during bus contention or lockup conditions.
Can W25Q01NWSFIM be used in 3-byte address mode for legacy system compatibility?
Yes - W25Q01NWSFIM defaults to 3-byte addressing at power-up (ADP = 0). It supports seamless transition to 4-byte mode via B7h command and back via E9h, allowing backward compatibility with existing 3-byte-addressing firmware while enabling full 1G-bit access when needed.
W25Q01NWSFIM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q01NWSFIM FAQ
1.How can I place an order for W25Q01NWSFIM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWSFIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWSFIM reliable?
The price and inventory of W25Q01NWSFIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWSFIM is usually 5 days.
3.What payment methods are accepted for W25Q01NWSFIM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWSFIM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWSFIM?
W25Q01NWSFIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWSFIM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWSFIM?
For technical support, including W25Q01NWSFIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWSFIM requirements.
6.How does Aetrix verify that W25Q01NWSFIM is sourced from the original manufacturer or authorized distributors?
All W25Q01NWSFIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWSFIM meets industry standards.
7.What is the process for return or replacement of W25Q01NWSFIM?
All W25Q01NWSFIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWSFIM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWSFIM part is unused and in its original packaging.
Return procedure for W25Q01NWSFIM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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