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Winbond Electronics Corporation W25Q01NWSFIQ
- Part No.:
- W25Q01NWSFIQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q01NWSFIQ.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,582
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Product details
Overview
W25Q01NWSFIQ from Winbond is a 1 G-bit (two-die 512 M-bit × 2) serial flash memory IC supporting Dual/Quad SPI, 1.7–1.95 V single-supply operation, 133 MHz clock rate, and linear 4-byte addressing. It delivers 66 MB/s continuous read throughput and supports execute-in-place (XIP) for code storage in space-constrained embedded systems including IoT edge nodes and industrial controllers.
For engineers reviewing the W25Q01NWSFIQ datasheet, W25Q01NWSFIQ pinout, W25Q01NWSFIQ application, or W25Q01NWSFIQ equivalent, key selection considerations include its dual-die architecture with independent status registers, hardware /RESET availability only in SOIC-16 and TFBGA packages, Quad Enable (QE) bit dependency for IO2/IO3 functionality, and 4 KB uniform sector erase granularity for firmware partitioning.
Technical Context
The W25Q01NWSFIQ implements a two-die stacked architecture with independent 64-bit Unique Serial Numbers per die and separate BUSY/SUS status bits, enabling concurrent die-level operations under host coordination. Its SPI interface supports Mode 0 and Mode 3, with Quad I/O requiring non-volatile QE bit setting in Status Register-2 to repurpose /WP and /HOLD as IO2 and IO3.
It features three 256-byte Security Registers with OTP lock capability, SFDP register compliance for discoverable parameters, and flexible protection schemes including top/bottom block protect (TB), complement protect (CMP), and individual sector lock/unlock via dedicated instructions (36h/39h/3Dh). Power-down current is specified at 0.4 µA (typ), supporting ultra-low-power battery-backed applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (2 × 512 M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8 V logic domains without level shifting |
| Max Clock Frequency | 133 MHz - supports 532 MHz equivalent Quad I/O data rate (66 MB/s continuous read) |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), 32 KB blocks, 64 KB blocks - allows fine-grained firmware update partitioning |
| Endurance & Retention | 100,000 program/erase cycles minimum; >20 years data retention at +25°C |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded deployment |
| Security Features | Three 256-byte OTP-lockable Security Registers; JEDEC ID, SFDP, and 64-bit Unique ID per die |
Pinout & Package
W25Q01NWSFIQ is packaged in an 8-pad WSON 8×6 mm (Package Code ZE) with exposed pad. Pin functions are defined per the standard SPI/Dual/Quad I/O protocol and support hardware write protection and hold functionality. The /RESET pin is not present in this WSON variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable signal; places DO/IO pins in high-impedance state when deasserted |
| DO (IO1) | Data Output / Quad I/O Line 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad modes |
| /WP (IO2) | Write Protect Input / Quad I/O Line 2 | Hardware lock for status register writes; becomes IO2 when QE=1 in Quad mode |
| GND | Ground Reference | Primary return path for all I/O and core circuitry; requires low-impedance PCB connection |
| DI (IO0) | Data Input / Quad I/O Line 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad modes |
| CLK | Serial Clock Input | Synchronizes all SPI transfers; supports Mode 0 and Mode 3 clock polarity/phase |
| /HOLD (IO3) | Hold Input / Quad I/O Line 3 | Pauses ongoing transfers while /CS remains low; becomes IO3 when QE=1 |
| VCC | Power Supply | 1.7–1.95 V supply; must ramp monotonically during power-up to avoid undefined behavior |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stack architecture | Two independent 512 M-bit dies with separate BUSY/SUS status bits and unique 64-bit IDs - enables die-level parallelism and redundancy-aware firmware layout |
| Quad SPI with configurable I/O mapping | QE bit in Status Register-2 controls /WP and /HOLD reassignment to IO2/IO3 - ensures deterministic interface behavior across boot and runtime modes |
| 4 KB uniform sector erase | 32,768 erasable sectors - supports atomic firmware updates, parameter storage isolation, and wear leveling in resource-constrained MCUs |
| Hardware write protection | /WP pin + BP/TB/CMP bits + SRP/SRL lock - provides layered, tamper-resistant configuration lockdown for production firmware images |
| Security register suite | Three 256-byte OTP-lockable registers - enables secure key storage, device identity binding, and anti-cloning mechanisms in certified applications |
Applications
| Firmware Storage in Industrial PLCs | Secure Boot Image Storage |
|---|---|
|
Use Scenario: Storing field-upgradable ladder logic and configuration data in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile code and parameter storage with deterministic 4 KB sector erase for atomic firmware patching. Use Value: Enables zero-downtime field updates using independent sector locking and suspend/resume during erase, minimizing machine stoppage time. |
Use Scenario: Holding signed bootloader images and cryptographic keys in medical imaging devices requiring IEC 62304 compliance. IC Role / Device Role / Timing Role: Secure, tamper-evident storage of immutable boot assets with OTP-locked security registers. Use Value: Prevents unauthorized firmware modification via hardware /WP pin + CMP/TB protection and 20-year data retention for long-lifecycle devices. |
| Edge AI Model Parameter Storage | Automotive ADAS Camera Firmware |
|
Use Scenario: Caching quantized neural network weights and calibration coefficients in battery-powered smart sensors. IC Role / Device Role / Timing Role: High-throughput XIP-capable flash supporting fast model loading via Quad I/O at 66 MB/s. Use Value: Reduces cold-start latency by 3.2× versus standard SPI flash, leveraging 133 MHz clock and linear 4-byte addressing for large tensor access. |
Use Scenario: Storing camera ISP firmware and lens correction tables in automotive surround-view systems meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Industrial-temp (-40°C to +85°C) serial flash with dual-die redundancy for fail-safe firmware recovery. Use Value: Dual-die architecture allows mirrored firmware storage; if one die fails, the system boots from the second die without BOM change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1G45GMI-08G | 1 G-bit, 1.65–2.0 V supply, 104 MHz max clock, no dual-die architecture or per-die Unique ID | Lacks die-level status independence and concurrent die control - unsuitable for redundancy-critical boot paths | Select when cost sensitivity outweighs need for dual-die fault tolerance and higher throughput |
| S25FL132K0XMFI010 | 128 M-bit density (not 1 G-bit), 2.7–3.6 V supply, HyperBus interface - incompatible voltage and protocol | Requires level-shifting and different controller IP; not drop-in replaceable | Consider only for brownfield designs already committed to Cypress HyperFlash ecosystem |
Compared with MX25L1G45GMI-08G and S25FL132K0XMFI010, W25Q01NWSFIQ uniquely delivers 1 G-bit capacity at 1.8 V with dual-die parallelism, Quad I/O throughput exceeding 66 MB/s, and industrial temperature support - making it optimal for next-generation edge compute and safety-critical firmware storage where density, speed, and reliability converge.
Availability
W25Q01NWSFIQ is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and automotive ADAS applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for W25Q01NWSFIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets.
W25Q01NWSFIQ belongs to Winbond's W25Q family of high-performance serial flash memories, designed specifically for code execution (XIP), firmware storage, and secure parameter retention in resource-constrained embedded systems.
FAQ
What is the package type and pin count of W25Q01NWSFIQ?
W25Q01NWSFIQ uses an 8-pad WSON 8×6 mm package (Package Code ZE) with no /RESET pin. Its pinout includes /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD (IO3), and VCC. This compact footprint supports high-density PCB layouts in space-constrained applications like portable medical devices and IoT edge nodes. The absence of /RESET means hardware reset must be handled externally or via software commands (66h + 99h).
Does W25Q01NWSFIQ support Quad SPI operation out of the box?
No - W25Q01NWSFIQ requires the Quad Enable (QE) bit in Status Register-2 to be set (non-volatile write) before IO2 and IO3 become active. Until QE=1, /WP and /HOLD retain their standard functions. This design prevents accidental misconfiguration during initialization. The QE bit can be programmed via Write Status Register-2 (31h) instruction after issuing Write Enable (06h); verification is confirmed by reading SR-2 (35h).
How does the dual-die architecture of W25Q01NWSFIQ impact firmware update strategies?
The dual-die architecture of W25Q01NWSFIQ enables independent status tracking (BUSY/SUS per die) and die-specific Unique IDs, allowing firmware partitions to be distributed across dies for wear leveling or redundancy. During updates, one die can be erased and reprogrammed while the other remains active for runtime execution - reducing system downtime. However, linear addressing abstracts the die boundary, so host software must manage die-aware operations explicitly via address mapping or dedicated instructions.
What security mechanisms does W25Q01NWSFIQ provide for protecting firmware images?
W25Q01NWSFIQ provides multi-layer security: hardware /WP pin + volatile/non-volatile Block Protect (BP0–BP3), Top/Bottom (TB), Complement (CMP), and Status Register Protect (SRP/SRL) bits; three 256-byte Security Registers with OTP locks; and per-die 64-bit Unique IDs. These features allow segmented protection - e.g., locking bootloader sectors with TB+BP while leaving application sectors writable - and prevent cloning via unique ID binding in secure boot chains.
Can W25Q01NWSFIQ operate in 3-byte and 4-byte address modes, and how is the mode selected?
Yes - W25Q01NWSFIQ supports both 3-byte and 4-byte addressing. The Power-Up Address Mode (ADP) bit in Status Register-3 determines initial mode at power-on: ADP=0 selects 3-byte, ADP=1 selects 4-byte. While ADP is non-volatile, address mode cannot be switched dynamically during operation; instead, Enter 4-Byte Address Mode (B7h) or Exit 4-Byte Address Mode (E9h) instructions must be issued. All instructions (read/write/erase) have distinct 3- and 4-byte variants (e.g., 03h vs. 13h).
W25Q01NWSFIQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q01NWSFIQ FAQ
1.How can I place an order for W25Q01NWSFIQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWSFIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWSFIQ reliable?
The price and inventory of W25Q01NWSFIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWSFIQ is usually 5 days.
3.What payment methods are accepted for W25Q01NWSFIQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWSFIQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWSFIQ?
W25Q01NWSFIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWSFIQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWSFIQ?
For technical support, including W25Q01NWSFIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWSFIQ requirements.
6.How does Aetrix verify that W25Q01NWSFIQ is sourced from the original manufacturer or authorized distributors?
All W25Q01NWSFIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWSFIQ meets industry standards.
7.What is the process for return or replacement of W25Q01NWSFIQ?
All W25Q01NWSFIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWSFIQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWSFIQ part is unused and in its original packaging.
Return procedure for W25Q01NWSFIQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q01NWSFIQ Tags
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M24C02-WMN6TP
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