My Inquiry
My Account
Winbond Electronics Corporation W25Q01NWSFIQ TR
- Part No.:
- W25Q01NWSFIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25Q01NWSFIQ TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,024
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25Q01NWSFIQ TR from Winbond is a 1 G-bit (two-die 512 M-bit × 2) serial flash memory IC supporting Dual/Quad SPI, 1.7–1.95 V single-supply operation, 133 MHz clock rate, and 4 KB uniform sector erase. It enables execute-in-place (XIP) code execution and data storage in space-constrained embedded systems such as IoT edge nodes and industrial controllers.
For engineers reviewing the W25Q01NWSFIQ TR datasheet, W25Q01NWSFIQ TR pinout, W25Q01NWSFIQ TR application, or W25Q01NWSFIQ TR equivalent, this page delivers verified package mapping (WSON 8x6-mm ZE), confirmed Quad I/O pin assignment, JEDEC ID and SFDP register support, and real-world XIP timing behavior - all validated against Winbond's official Rev. B datasheet (July 2021).
Technical Context
The W25Q01NWSFIQ TR implements a dual-die stacked architecture with linear 1G-bit addressing, independent status registers per die (including BUSY and SUS bits), and hardware reset only on SOIC/TFBGA packages - absent in the WSON variant. Its Quad SPI mode requires non-volatile QE bit setting in Status Register-2, repurposing /WP and /HOLD as IO2 and IO3.
It supports both 3-byte and 4-byte address modes via ADP bit (non-volatile) and B7h/E9h instructions, with Fast Read Quad I/O (EBh/ECh) achieving up to 532 MHz effective throughput. Erase granularity includes 4 KB sectors (32,768 total), 32 KB blocks, and 64 KB blocks (2,048 total), enabling fine-grained firmware partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (two 512 M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8 V logic domains without level shifting |
| SPI Clock Rate | Up to 133 MHz - supports 66 MB/s continuous read in Quad I/O mode (532 MHz effective) |
| Erase Granularity | 4 KB sectors (32,768), 32 KB blocks, 64 KB blocks (2,048), and full-chip erase - allows secure OTA update partitioning |
| Data Retention | 20+ years - qualified for long-life industrial and automotive control firmware storage |
| Program-Erase Cycles | 100,000 minimum - sufficient for field firmware updates over product lifetime |
| Operating Temp | −40 °C to +85 °C - meets industrial-grade environmental requirements |
| Power-Down Current | 0.4 µA typical - critical for battery-backed or energy-harvesting edge devices |
Pinout & Package
W25Q01NWSFIQ TR uses the 8-pad WSON 8×6-mm package (Package Code ZE), with exposed thermal pad. Pin 4 = GND, Pin 5 = DI (IO0), Pin 6 = CLK, Pin 7 = /HOLD or /RESET (IO3), Pin 8 = VCC. No dedicated /RESET pin in this variant - /HOLD function only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; high-impedance DO when deasserted; must transition high→low after power-up before instruction acceptance |
| 2 DO (IO1) | Data Output / Quad I/O Line 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI; used for Fast Read Dual/Quad Output |
| 3 /WP (IO2) | Write Protect Input / Quad I/O Line 2 | Hardware write-protection for status register; becomes IO2 when QE=1 - enables full Quad I/O bus |
| 4 GND | Ground Reference | Primary return path for VCC and I/O signals; connects to thermal pad for thermal dissipation |
| 5 DI (IO0) | Data Input / Quad I/O Line 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI; required for all program/erase commands |
| 6 CLK | Serial Clock Input | Edge-triggered timing reference; supports SPI Modes 0 and 3; max 133 MHz frequency defines interface bandwidth ceiling |
| 7 /HOLD (IO3) | Hold Input / Quad I/O Line 3 | Pauses ongoing SPI transfer; becomes IO3 when QE=1 - completes 4-line Quad I/O bus; no /RESET function in WSON |
| 8 VCC | Power Supply | 1.7–1.95 V supply; powers core logic, charge pumps, and I/O buffers; decoupling capacitor required at pin |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad SPI Interface | Enables 266 MB/s (Dual) and 532 MB/s (Quad) effective throughput - eliminates need for parallel NOR flash in XIP designs |
| Two Independent 512 M-bit Dies | Each die has unique 64-bit serial number and separate BUSY/SUS status bits - supports concurrent die access and redundancy schemes |
| 4 KB Uniform Sector Architecture | Allows precise firmware image, parameter, and log partitioning - essential for secure OTA updates and FOTA rollback safety |
| JEDEC ID + SFDP Register | Enables automatic driver initialization and runtime configuration detection - removes hard-coded timing assumptions in bootloader code |
| Three 256-byte Security Registers | OTP-lockable storage for cryptographic keys, device certificates, or calibration data - isolated from main array and protected by LB1–LB3 bits |
| Volatile/Non-Volatile Status Control | BP, TB, CMP, SRP bits configurable in volatile or non-volatile mode - supports both temporary debug lock and permanent production lockdown |
Applications
| Industrial PLC Firmware Storage | IoT Edge Node Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary boot memory providing XIP-capable code execution and field-upgradable firmware partitions. Use Value: 20-year data retention and −40°C to +85°C operation ensure reliable firmware persistence across extended maintenance cycles and temperature swings. |
Use Scenario: Hosting bootloader, RTOS kernel, and sensor fusion algorithms in battery-powered wireless sensor nodes. IC Role / Device Role / Timing Role: Low-power serial flash delivering 0.4 µA deep-sleep current and fast Quad I/O wake-up reads. Use Value: 133 MHz Quad SPI enables sub-100 ms firmware validation and decompression - critical for responsive edge inference startup. |
| Automotive Infotainment UI Assets | Medical Device Calibration Data |
Use Scenario: Storing graphical assets, voice prompts, and localization strings in automotive head units with strict AEC-Q100 alignment needs. IC Role / Device Role / Timing Role: High-reliability serial flash supporting rapid GUI asset streaming via Fast Read Quad I/O. Use Value: 100K program-erase cycles and 4 KB sector erase allow frequent UI language pack updates without wear-out risk. |
Use Scenario: Securing calibration coefficients, sensor offsets, and regulatory audit logs in Class II medical instruments. IC Role / Device Role / Timing Role: Tamper-resistant memory with OTP-locked security registers and hardware write protection. Use Value: Three 256-byte security registers with LB1–LB3 OTP locks prevent unauthorized calibration tampering - satisfies IEC 62304 traceability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JWSFIQ | Same density and WSON package, but 3 V supply (2.7–3.6 V); no 1.8 V compatibility | Requires separate 3 V rail; incompatible with 1.8 V SoC interfaces without level shifters | Select only if system lacks 1.8 V supply and board layout accommodates voltage translation. |
| MX25L1G45GMI-13G | 1 G-bit, 1.8 V, but uses standard SPI only (no Quad I/O); max 104 MHz clock; no SFDP register | Lacks XIP performance and auto-configuration capability; slower firmware load times | Choose when cost sensitivity outweighs throughput needs and bootloader simplicity is prioritized over speed. |
Compared with W25Q01NWSFIQ TR, W25Q01JWSFIQ requires higher voltage and cannot interface directly with 1.8 V controllers, while MX25L1G45GMI-13G omits Quad I/O and SFDP - limiting XIP efficiency and driver portability across platforms.
Availability
W25Q01NWSFIQ TR is available at Aetrix Electronics and suitable for industrial PLCs, IoT edge nodes, automotive infotainment systems, and medical instrumentation requiring stable component supply, long-term lifecycle assurance, and guaranteed 1.8 V serial flash performance.
Supply support for W25Q01NWSFIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, RAM, and mobile DRAM, serving industrial, communications, and consumer markets.
The W25Q series targets high-performance embedded systems needing reliable, low-voltage, multi-I/O serial flash for code execution and data logging - optimized for XIP, OTA updates, and secure storage.
FAQ
What is the operating voltage range of the W25Q01NWSFIQ TR?
The W25Q01NWSFIQ TR operates strictly within 1.7 V to 1.95 V. This narrow 1.8 V nominal range ensures compatibility with modern low-power microcontrollers and SoCs without external level shifting. Operation outside this window may cause undefined behavior or failure to initialize - always verify VCC regulation stability during power ramp-up per Section 8.2 of the Winbond datasheet.
Does the W25Q01NWSFIQ TR support hardware reset (/RESET pin)?
No, the W25Q01NWSFIQ TR in WSON 8x6-mm (ZE) package does not include a dedicated /RESET pin. Pin 7 functions as /HOLD only. Hardware reset is available only on SOIC-16 (SF) and TFBGA (TB) variants. For WSON, system-level reset must be handled via software commands (66h + 99h) or power-cycle sequencing.
How is Quad SPI enabled on the W25Q01NWSFIQ TR?
Quad SPI is enabled by setting the Quad Enable (QE) bit in Status Register-2 (SR2). This is a non-volatile bit - once set, it persists across power cycles. When QE = 1, pins /WP (Pin 3) and /HOLD (Pin 7) become IO2 and IO3, completing the 4-line I/O bus required for instructions like Fast Read Quad I/O (EBh).
What package type is used by the W25Q01NWSFIQ TR?
The W25Q01NWSFIQ TR uses the 8-pad WSON 8×6-mm package (Package Code ZE), with an exposed thermal pad. It is distinct from SOIC-16 and TFBGA variants - pin count, footprint, and thermal characteristics differ. PCB layout must follow Winbond's ZE land pattern (Figure 1a) and solder paste stencil recommendations.
Can the W25Q01NWSFIQ TR be used for execute-in-place (XIP) applications?
Yes, the W25Q01NWSFIQ TR supports true XIP via Fast Read Quad I/O (EBh/ECh) at up to 133 MHz, delivering 532 MHz effective bandwidth. Its 4 KB uniform sector architecture and low-latency read timing (tV < 7 ns) enable deterministic code fetch - validated in real-time RTOS boot sequences on ARM Cortex-M7 and RISC-V SoCs.
What security features does the W25Q01NWSFIQ TR provide for firmware protection?
The W25Q01NWSFIQ TR provides layered security: hardware write-protection via /WP pin, non-volatile block protect (BP0–BP3), top/bottom/complement array locking, individual sector lock/unlock (36h/39h), and three 256-byte OTP-lockable security registers. These features collectively prevent unauthorized firmware overwrite, cloning, or calibration tampering - meeting baseline requirements for IEC 62443 and ISO/SAE 21434.
W25Q01NWSFIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25Q01NWSFIQ TR FAQ
1.How can I place an order for W25Q01NWSFIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWSFIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWSFIQ TR reliable?
The price and inventory of W25Q01NWSFIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWSFIQ TR is usually 5 days.
3.What payment methods are accepted for W25Q01NWSFIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWSFIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWSFIQ TR?
W25Q01NWSFIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWSFIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWSFIQ TR?
For technical support, including W25Q01NWSFIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWSFIQ TR requirements.
6.How does Aetrix verify that W25Q01NWSFIQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q01NWSFIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWSFIQ TR meets industry standards.
7.What is the process for return or replacement of W25Q01NWSFIQ TR?
All W25Q01NWSFIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWSFIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWSFIQ TR part is unused and in its original packaging.
Return procedure for W25Q01NWSFIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q01NWSFIQ TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
