My Inquiry
My Account
Winbond Electronics Corporation W25Q01NWTBIM TR
- Part No.:
- W25Q01NWTBIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q01NWTBIM TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,086
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25Q01NWTBIM TR from Winbond is a 1.8V, 1G-bit (dual-die) serial flash memory supporting standard, dual, and quad SPI interfaces with up to 133 MHz clock frequency, 4KB uniform sector erase granularity, and hardware write protection via /WP and /HOLD pins - deployed in embedded boot code storage, firmware update partitions, and XIP-capable microcontroller systems.
For engineers reviewing the W25Q01NWTBIM TR datasheet, W25Q01NWTBIM TR pinout, W25Q01NWTBIM TR application, or W25Q01NWTBIM TR equivalent, this page delivers verified package mapping (TFBGA-24, Package Code TB), confirmed 4-byte addressing support, JEDEC ID read capability (9Fh), SFDP register compliance, and dual-die linear address architecture - all critical for secure, high-throughput flash integration in space-constrained industrial and automotive control units.
Technical Context
The W25Q01NWTBIM TR implements a two-die stacked architecture delivering 1G-bit total capacity as a single linear 4GB address space, with each die providing independent BUSY/SUS status bits and a unique 64-bit serial number. It supports 3-byte and 4-byte address modes controlled by non-volatile ADP bit and software commands B7h/E9h.
Quad SPI operation requires non-volatile QE bit (Status Register-2) to be set, reassigning /WP → IO2 and /HOLD → IO3; hardware /RESET is dedicated and active-low on TFBGA packages, enabling deterministic power-on initialization without firmware dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (2 × 512 M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8 V logic domains without level shifting |
| SPI Clock Frequency | Up to 133 MHz - delivers 532 MB/s effective throughput in Quad I/O Fast Read mode |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), plus 32 KB and 64 KB blocks - supports fine-grained firmware partitioning |
| Data Retention | 20+ years - validated under industrial temperature cycling, critical for long-life embedded deployments |
| Program-Erase Cycles | 100,000 minimum per sector - ensures robust field-upgrade durability in OTA applications |
| Operating Temperature | –40 °C to +85 °C - qualified for extended industrial and automotive under-hood environments |
| Security Features | Three 256-byte OTP-lockable security registers, individual sector lock (36h/39h), and SFDP-compliant parameter discovery |
Pinout & Package
W25Q01NWTBIM TR uses the 24-ball TFBGA 8×6-mm package (Package Code TB) with 5×5 ball array, optimized for high-density PCB layouts and thermal performance in compact modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A4 | /RESET | Dedicated active-low hardware reset input - forces full device initialization regardless of internal state |
| B2 | CLK | Serial clock input - synchronizes all SPI instruction and data transfers |
| B3 | GND | Ground reference - shared return path for all I/O and core logic |
| B4 | VCC | 1.8 V power supply - powers core memory array and I/O buffers |
| C2 | /CS | Chip select input - enables device communication only when asserted low |
| C4 | /WP (IO2) | Write protect input or Quad I/O data line 2 - hardware-locks status register when low |
| D2 | DO (IO1) | Data output or Quad I/O data line 1 - bidirectional in Dual/Quad modes; unidirectional in Standard SPI |
| D3 | DI (IO0) | Data input or Quad I/O data line 0 - bidirectional in Dual/Quad modes; unidirectional in Standard SPI |
| D4 | /HOLD (IO3) | Hold input or Quad I/O data line 3 - pauses ongoing operations when low; repurposed as IO3 when QE=1 |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Single 4 GB address space abstracts dual-die complexity - simplifies bootloader and OS memory mapping |
| Quad Enable (QE) bit | Non-volatile Status Register-2 bit controls IO2/IO3 assignment - enables seamless migration from Standard to Quad SPI |
| Erase/program suspend | 75h/7Ah instructions allow background operation interruption - essential for real-time interrupt handling during flash updates |
| JEDEC ID & SFDP support | 9Fh read returns manufacturer/device ID; 5Ah reads Serial Flash Discoverable Parameters - enables auto-configuration in generic drivers |
| Individual sector lock | 36h/39h commands lock/unlock specific 4 KB sectors - enforces firmware integrity boundaries without global protection |
| Power-down current | <0.4 µA typical - reduces system standby power in battery-backed or energy-harvesting edge nodes |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
Use Scenario: Storing certified firmware images and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic startup sequence and secure firmware validation before MCU execution. Use Value: 4 KB sector erase enables atomic firmware patching; 20-year data retention ensures reliability across 15+ year equipment lifecycles. |
Use Scenario: Hosting boot code and sensor calibration data for radar and camera modules requiring ASIL-B compliant storage. IC Role / Device Role / Timing Role: Primary XIP-capable flash executing safety-critical initialization routines directly from Quad SPI bus. Use Value: 133 MHz Quad I/O interface achieves >500 MB/s read bandwidth - meets real-time boot timing budgets under ISO 26262 constraints. |
| Medical IoT Device Configuration | Smart Energy Meter Data Logging |
Use Scenario: Securing patient-specific calibration profiles and regulatory audit logs in portable diagnostic instruments with limited PCB area. IC Role / Device Role / Timing Role: Trusted parameter store using OTP-locked security registers and individual sector protection. Use Value: Three 256-byte security registers with OTP locks prevent unauthorized modification of FDA-cleared calibration constants. |
Use Scenario: Recording time-stamped consumption metrics and tariff tables in utility meters deployed in outdoor substations. IC Role / Device Role / Timing Role: High-endurance data logger leveraging 100K program-erase cycles and wide-temperature operation. Use Value: Uniform 4 KB sectors allow wear-leveling across 32,768 addressable regions - extends field lifetime beyond 20 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JVTBIQ | Same 1G-bit dual-die density and TFBGA-24 package, but rated for –40°C to +105°C and features enhanced ESD robustness (±8 kV HBM). | Required for under-hood automotive ECUs exceeding +85°C ambient; not necessary for industrial control cabinets. | Select W25Q01JVTBIQ when extended temperature qualification or higher ESD immunity is mandated by system-level testing. |
| MX25L1G45GMI-13G | 1 G-bit single-die architecture, SOIC-16 package, max 104 MHz clock, no hardware /RESET pin in SOIC variant. | Lacks dual-die linear addressing and hardware reset - limits XIP performance and failsafe recovery in mission-critical boot paths. | Choose MX25L1G45GMI-13G only for cost-sensitive, non-XIP applications where 4 KB sector granularity and 100K P/E cycles remain sufficient. |
Compared with W25Q01JVTBIQ, W25Q01NWTBIM TR trades extended temperature range for lower unit cost and identical industrial-grade functionality; versus MX25L1G45GMI-13G, it delivers superior throughput, deterministic reset behavior, and dual-die scalability - making it optimal for next-generation firmware-centric embedded platforms.
Availability
W25Q01NWTBIM TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image hosting, and medical IoT device configuration requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for W25Q01NWTBIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W25Q series targets high-performance, secure, and space-efficient code storage - designed specifically for XIP-capable microcontrollers, real-time firmware updates, and safety-critical boot applications demanding deterministic timing and data integrity.
FAQ
What is the package type and footprint of W25Q01NWTBIM TR?
W25Q01NWTBIM TR uses a 24-ball TFBGA package measuring 8 mm × 6 mm with a 5×5 ball array (Package Code TB). Its footprint matches JEDEC MO-270AB standard, and pin assignments include dedicated /RESET at A4, VCC at B4, GND at B3, and Quad I/O lines IO0–IO3 mapped to D3, D2, C4, and D4 respectively - enabling drop-in compatibility with existing TFBGA-24 layouts.
Does W25Q01NWTBIM TR support 4-byte addressing, and how is it enabled?
Yes, W25Q01NWTBIM TR fully supports 4-byte addressing via the Enter 4-Byte Address Mode instruction (B7h) and Exit 4-Byte Address Mode instruction (E9h). The non-volatile ADP bit in Status Register-3 determines default power-up address mode; B7h must be issued before any 4-byte-addressed read/write/erase command - required for accessing the full 4 GB linear address space beyond the 3-byte 16 MB limit.
How does the dual-die architecture of W25Q01NWTBIM TR affect memory access?
W25Q01NWTBIM TR integrates two independent 512 M-bit dies into a single linear 4 GB address space, with automatic die selection handled internally. Each die maintains separate BUSY and SUS status bits, and both provide unique 64-bit serial numbers. This architecture eliminates external die-select logic while preserving per-die reliability metrics - simplifying driver development and enabling seamless firmware scaling across density tiers.
What security mechanisms does W25Q01NWTBIM TR provide for firmware protection?
W25Q01NWTBIM TR offers layered security: hardware write protection via /WP pin, volatile/non-volatile block protect bits (BP3–BP0), top/bottom/complement array locking, individual sector lock/unlock (36h/39h), three 256-byte OTP-lockable security registers, and SFDP-based parameter discovery. These features collectively enforce immutable boot code, prevent unauthorized firmware modification, and support secure key storage in regulated medical and industrial applications.
Can W25Q01NWTBIM TR operate in Quad SPI mode without modifying hardware connections?
Yes - W25Q01NWTBIM TR supports Quad SPI mode using its native TFBGA pinout: IO0 (D3), IO1 (D2), IO2 (C4), and IO3 (D4) are physically present and electrically functional. Enabling Quad SPI requires setting the non-volatile QE bit in Status Register-2 via Write Status Register-2 (31h) instruction; once set, /WP and /HOLD pins become IO2 and IO3, eliminating need for board redesign or additional signal routing.
W25Q01NWTBIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q01NWTBIM TR FAQ
1.How can I place an order for W25Q01NWTBIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWTBIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWTBIM TR reliable?
The price and inventory of W25Q01NWTBIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWTBIM TR is usually 5 days.
3.What payment methods are accepted for W25Q01NWTBIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWTBIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWTBIM TR?
W25Q01NWTBIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWTBIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWTBIM TR?
For technical support, including W25Q01NWTBIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWTBIM TR requirements.
6.How does Aetrix verify that W25Q01NWTBIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q01NWTBIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWTBIM TR meets industry standards.
7.What is the process for return or replacement of W25Q01NWTBIM TR?
All W25Q01NWTBIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWTBIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWTBIM TR part is unused and in its original packaging.
Return procedure for W25Q01NWTBIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25Q01NWTBIM TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
