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Winbond Electronics Corporation W25Q01NWTBIQ TR
- Part No.:
- W25Q01NWTBIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q01NWTBIQ TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,540
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Product details
Overview
W25Q01NWTBIQ TR from Winbond is a 1G-bit (dual-die 2×512M-bit) serial flash memory IC supporting Dual/Quad SPI, 1.7–1.95V single-supply operation, 133MHz max clock, and 4KB uniform sector erase - used for XIP code execution, firmware storage, and parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q01NWTBIQ TR datasheet, W25Q01NWTBIQ TR pinout, W25Q01NWTBIQ TR application, or W25Q01NWTBIQ TR equivalent, this page delivers verified package mapping (TFBGA 24-ball, 8×6 mm), confirmed Quad I/O timing (532MHz equivalent), JEDEC ID support, SFDP register compliance, and hardware /RESET functionality specific to the TBIQ ordering variant.
Technical Context
The W25Q01NWTBIQ TR implements a dual-die stacked architecture with independent 64-bit unique serial numbers per die and separate BUSY/SUS status bits, enabling concurrent or linear-addressed access across the full 1G-bit address space. It supports both 3-byte and non-volatile 4-byte address modes via ADP bit configuration.
Its SPI interface operates in Standard (DI/DO), Dual (IO0/IO1), and Quad (IO0–IO3) modes, with Quad mode requiring QE bit set in Status Register-2; /WP and /HOLD pins become IO2 and IO3 respectively when QE=1. Hardware /RESET is dedicated and functional only on TFBGA and SOIC-16 packages - confirmed for TBIQ (TFBGA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (2 × 512 M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables low-power operation in battery-backed or energy-efficient designs |
| Max Clock Frequency | 133 MHz (Standard/Dual/Quad SPI); enables 532 MHz equivalent throughput in Quad I/O Fast Read mode |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), 32 KB blocks, 64 KB blocks (2,048 total) - supports fine-grained firmware partitioning |
| Data Retention | 20+ years - validated for long-life industrial and automotive control applications |
| Endurance | 100,000 program/erase cycles per sector - suitable for frequent OTA update or logging use cases |
| Interface Modes | Standard SPI (CLK, /CS, DI, DO), Dual I/O (IO0/IO1), Quad I/O (IO0–IO3) - selectable via instruction and QE bit |
| Security Features | Three 256-byte OTP-lockable security registers, individual sector lock/unlock (36h/39h), SFDP register, JEDEC ID (9Fh) |
Pinout & Package
W25Q01NWTBIQ TR uses the 24-ball TFBGA 8×6 mm package (Package Code TB, 5×5 ball array), with /RESET implemented as a dedicated input pin (Ball A4) - distinct from /HOLD functionality on other variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A4 | /RESET | Dedicated hardware reset input; asserts power-on state within ~1 µs - required for deterministic recovery in safety-critical boot paths |
| B2 | CLK | Serial clock input; supports up to 133 MHz with defined AC timing (tCH/tCL ≥ 3.76 ns) |
| B3 | GND | Ground reference for all I/O and core logic - must be low-impedance and decoupled per layout guidelines |
| B4 | VCC | 1.7–1.95 V supply input; requires local 1 µF + 0.1 µF decoupling adjacent to ball |
| C2 | /CS | Chip select input; device enters high-Z output state when high - must track VCC during power-up/down |
| C4 | /WP (IO2) | Write protect input (active-low); functions as IO2 in Quad mode when QE=1 - enables hardware-based sector protection |
| D2 | DO (IO1) | Data output in Standard SPI; bidirectional IO1 in Dual/Quad modes - supports Fast Read Dual/Quad Output instructions |
| D3 | DI (IO0) | Data input in Standard SPI; bidirectional IO0 in Dual/Quad modes - used for all instruction/address/data writes |
| D4 | /HOLD (IO3) | Hold input (active-low); functions as IO3 in Quad mode when QE=1 - pauses ongoing transfers without deselecting device |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Single 32-bit address space spanning both 512M-bit dies - eliminates software address translation overhead in XIP systems |
| Quad Enable (QE) bit | Non-volatile bit in Status Register-2 that reassigns /WP and /HOLD to IO2/IO3 - enables seamless transition to 4-line I/O without pin change |
| Power-down current | 0.4 µA typical - reduces system standby power in always-on IoT edge nodes and wearables |
| Erase/program suspend | 75h/7Ah instructions allow pausing active erase/program to service urgent reads - critical for real-time interrupt latency control |
| Individual sector lock | 36h/39h instructions enable per-sector write-protection with OTP-capable security registers - prevents accidental firmware corruption |
| SFDP register support | 5Ah instruction returns JEDEC JESD216-compliant parameter table - enables automatic driver configuration in Linux/RTOS bootloaders |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing certified firmware images and calibration data in programmable logic controllers with strict revision control and field-upgrade requirements. IC Role / Device Role / Timing Role: Non-volatile code and parameter storage with hardware write-protection and 20-year data retention. Use Value: Enables secure, traceable firmware updates using individual sector lock (36h) and SFDP-driven bootloader configuration - meeting IEC 61131-3 and ISO 13849 validation needs. |
Use Scenario: Hosting boot code and sensor fusion algorithms for camera/radar ECUs where fast XIP execution and ASIL-B compliant reliability are mandatory. IC Role / Device Role / Timing Role: Quad SPI XIP memory with 133 MHz clock and 532 MHz equivalent throughput - reducing boot time by >40% vs. parallel flash. Use Value: Delivers deterministic <50 ms cold-boot latency via Fast Read Quad I/O (EBh) and hardware /RESET (A4) - satisfying ISO 26262 startup timing constraints. |
| Medical Imaging Device Configuration | Smart Energy Meter Data Logging |
Use Scenario: Retaining DICOM metadata, calibration profiles, and regulatory audit logs across power cycles in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability parameter storage with 100K endurance and OTP-locked security registers. Use Value: Guarantees HIPAA-compliant data integrity using three 256-byte security registers (42h/44h/48h) and individual sector lock - preventing unauthorized profile modification. |
Use Scenario: Recording time-stamped consumption data, tariff schedules, and firmware version history in ANSI C12.22-compliant smart meters with 15+ year field life. IC Role / Device Role / Timing Role: Low-power, long-retention data logger with 0.4 µA power-down current and 20-year data retention. Use Value: Extends battery life beyond 10 years using deep power-down (B9h) and automatic wake-on-interrupt - meeting DLMS/COSEM meter certification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JVTBIQ | Same 1G-bit dual-die density and TFBGA-24 package, but rated for -40°C to +105°C extended temperature range | Required for under-hood automotive or outdoor industrial deployments exceeding +85°C ambient | Select W25Q01JVTBIQ only if operating temperature exceeds +85°C; otherwise W25Q01NWTBIQ TR provides identical functionality at lower cost |
| MX25L1G45GM | 1G-bit single-die MXIC flash in 24-ball TFBGA; lacks dual-die linear addressing, unique die IDs, and ADP-controlled 4-byte mode persistence | Suitable for cost-sensitive consumer devices where die-level redundancy and advanced address management are unnecessary | Choose MX25L1G45GM only when dual-die features (e.g., independent BUSY/SUS, die-specific IDs) are not required - W25Q01NWTBIQ TR offers superior XIP determinism and security |
Compared with W25Q01JVTBIQ, the W25Q01NWTBIQ TR trades extended temperature rating for tighter cost control while retaining identical pinout, Quad I/O performance, and security register implementation; versus MX25L1G45GM, it delivers dual-die architectural advantages essential for robust firmware update and diagnostic logging in mission-critical systems.
Availability
W25Q01NWTBIQ TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, medical imaging configuration, smart energy meter data logging, and embedded IoT edge node applications requiring stable component supply and long-term lifecycle support.
Supply support for W25Q01NWTBIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including serial flash, RAM, and TrustME secure memory products.
The W25Q series targets high-performance embedded systems requiring reliable, low-voltage, multi-I/O serial flash for code execution, firmware storage, and secure parameter retention - with emphasis on XIP capability and industrial temperature resilience.
FAQ
What is the package type and pin count of the W25Q01NWTBIQ TR?
The W25Q01NWTBIQ TR uses a 24-ball TFBGA package measuring 8 mm × 6 mm with a 5×5 ball array. It includes dedicated /RESET (Ball A4), /CS (C2), CLK (B2), VCC (B4), GND (B3), and bidirectional I/O pins (D2, D3, C4, D4) supporting Standard/Dual/Quad SPI operation - fully documented in Winbond's datasheet Section 3.5 and 3.6.
Does the W25Q01NWTBIQ TR support hardware reset, and how is it implemented?
Yes, the W25Q01NWTBIQ TR supports hardware reset via a dedicated /RESET pin (Ball A4). When driven low for ≥1 µs, the device terminates all operations and returns to its power-on state - independent of software commands or status register settings. This function is exclusive to TFBGA and SOIC-16 packages and is confirmed for the TBIQ ordering variant.
How does Quad SPI mode activate on the W25Q01NWTBIQ TR?
Quad SPI mode on the W25Q01NWTBIQ TR activates when the Quad Enable (QE) bit in Status Register-2 is set to '1' using instruction 31h. Once enabled, /WP (C4) and /HOLD (D4) become IO2 and IO3, completing the four-line I/O bus. The device then accepts Quad I/O instructions like EBh (Fast Read Quad I/O) - verified in datasheet Sections 4.2 and 7.4.18.
What is the memory organization and erase granularity of the W25Q01NWTBIQ TR?
The W25Q01NWTBIQ TR contains two 512M-bit dies totaling 1G-bit, organized into 524,288 pages of 256 bytes each. Erase operations support 4 KB sectors (32,768 total), 32 KB blocks, 64 KB blocks (2,048 total), and full-chip erase. This uniform 4 KB granularity enables precise firmware partitioning and secure OTA update staging - specified in Section 1 and Table 7.4.25–7.4.30.
Is the W25Q01NWTBIQ TR compatible with JEDEC-standard identification and configuration protocols?
Yes, the W25Q01NWTBIQ TR fully supports JEDEC-standard protocols: Manufacturer/Device ID (90h/9Fh), SFDP Register (5Ah), and Unique ID (4Bh). The SFDP register returns JESD216-compliant parameters for automatic driver initialization in Linux, Zephyr, and FreeRTOS environments - confirmed in datasheet Sections 7.3.1, 7.3.40, and 7.4.38–7.4.39.
W25Q01NWTBIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q01NWTBIQ TR FAQ
1.How can I place an order for W25Q01NWTBIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWTBIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWTBIQ TR reliable?
The price and inventory of W25Q01NWTBIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWTBIQ TR is usually 5 days.
3.What payment methods are accepted for W25Q01NWTBIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWTBIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWTBIQ TR?
W25Q01NWTBIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWTBIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWTBIQ TR?
For technical support, including W25Q01NWTBIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWTBIQ TR requirements.
6.How does Aetrix verify that W25Q01NWTBIQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q01NWTBIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWTBIQ TR meets industry standards.
7.What is the process for return or replacement of W25Q01NWTBIQ TR?
All W25Q01NWTBIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWTBIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWTBIQ TR part is unused and in its original packaging.
Return procedure for W25Q01NWTBIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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