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Winbond Electronics Corporation W25Q01NWZEIM
- Part No.:
- W25Q01NWZEIM
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q01NWZEIM.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,669
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Product details
Overview
W25Q01NWZEIM from Winbond is a 1G-bit (two-die 512M-bit × 2) serial NOR flash memory supporting Dual/Quad SPI, 1.7–1.95V operation, 133MHz clock rate, and 4KB uniform sector erase. It delivers 66MB/s continuous read throughput and enables execute-in-place (XIP) for code storage in space-constrained embedded systems.
For engineers reviewing the W25Q01NWZEIM datasheet, W25Q01NWZEIM pinout, W25Q01NWZEIM application, or W25Q01NWZEIM equivalent, this device is selected for low-voltage, high-density boot code and firmware storage where quad I/O bandwidth, hardware write protection, and -40°C to +85°C industrial temperature stability are required.
Technical Context
The W25Q01NWZEIM implements a dual-die stacked architecture with linear 1G-bit addressing, independent status registers per die (including BUSY and SUS bits), and JEDEC-compliant SFDP register for auto-configuration. It supports both 3-byte and 4-byte address modes, with ADP bit controlling power-up default mode.
Its SPI interface operates in Mode 0 or Mode 3, with Quad I/O enabled via non-volatile QE bit in Status Register-2; when QE=1, /WP and /HOLD become IO2 and IO3. Hardware reset (/RESET) is available only on SOIC-16 and TFBGA packages - not on the ZE (WSON 8x6-mm) variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (two 512M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration into 1.8V logic domains without level shifting |
| Max Clock Frequency | 133 MHz - supports 532 MHz equivalent Quad I/O data rate for XIP performance |
| Erase Granularity | 4 KB sectors (32,768 total), 32 KB/64 KB blocks - allows fine-grained firmware update partitioning |
| Endurance & Retention | 100,000 program/erase cycles; >20 years data retention at +85°C - suitable for field-upgradable systems |
| Security Features | Three 256-byte OTP-lockable security registers; individual sector lock/unlock; SFDP v1.6 support - enables secure boot key storage |
| Operating Temp | -40°C to +85°C - qualified for industrial-grade embedded control and networking equipment |
Pinout & Package
W25Q01NWZEIM uses the 8-pad WSON 8×6-mm package (JEDEC MO-241AC, package code ZE), with exposed thermal pad. Pin functions are defined for Standard/Dual SPI operation; Quad SPI repurposes /WP and /HOLD as IO2 and IO3 upon QE bit enable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: drives device into active state only when low; high-impedance DO during deselect |
| DO (IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad SPI - carries read data or command responses |
| /WP (IO2) | Write Protect Input / I/O2 | Hardware lock for status register; becomes IO2 in Quad SPI when QE=1 - requires external pull-up if unused |
| GND | Ground Reference | Primary return path for all I/O and core logic; must be low-impedance for noise immunity in high-speed SPI |
| DI (IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad SPI - accepts commands, addresses, and page data |
| CLK | Serial Clock Input | Edge-triggered timing reference for all SPI transfers; supports Mode 0 and Mode 3 polarity/phase configurations |
| /HOLD or /RESET (IO3) | Hold Input / I/O3 | Pauses ongoing SPI transfer without deselecting; becomes IO3 in Quad SPI - not functional as /RESET in ZE package |
| VCC | Power Supply | 1.7–1.95V core supply; powers internal charge pumps for erase/program - decoupling capacitor mandatory |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad SPI Interface | Enables 266 MB/s (Dual) or 532 MB/s (Quad) effective bandwidth - eliminates need for parallel NOR in cost-sensitive XIP designs |
| Uniform 4KB Sector Architecture | Supports atomic firmware patching and parameter updates without erasing larger blocks - reduces wear and improves field reliability |
| Erase/Program Suspend & Resume | Allows background operations (e.g., logging) to pause flash writes - critical for real-time deterministic response in motor control |
| Hardware Write Protection | /WP pin + BP/TB/CMP bits provide layered protection against accidental overwrite of boot code - complements software-based locking |
| 64-bit Unique ID per Die | Two independent serial numbers enable traceability and anti-cloning in dual-die configuration - required for secure provisioning workflows |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing certified firmware images and runtime configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch for ARM Cortex-M7 microcontrollers during cold start and firmware update rollback. Use Value: 4KB sector granularity enables safe over-the-air (OTA) patching without corrupting operational firmware; 100K endurance ensures >10-year field life under frequent update cycles. | Use Scenario: Holding boot code and sensor calibration data for vision processing units in autonomous driving ECUs operating across extended temperature ranges. IC Role / Device Role / Timing Role: Primary boot flash interfaced via Quad SPI to reduce boot time and meet ASIL-B functional safety requirements for startup sequence validation. Use Value: 133MHz clock + Quad I/O achieves <150ms cold boot latency; -40°C to +85°C rating guarantees reliable operation in engine bay and camera module locations. |
| Medical Imaging Device Configuration | Network Equipment Secure Boot |
Use Scenario: Storing DICOM-compliant image processing algorithms and regulatory-cleared calibration profiles in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Trusted firmware repository accessed by secure bootloader to verify signature before loading diagnostic code into SRAM. Use Value: Three OTP-lockable 256-byte security registers store root-of-trust keys; SFDP register enables automatic driver initialization without hard-coded timing assumptions. | Use Scenario: Hosting signed bootloader and cryptographic keys in enterprise switches and 5G baseband units requiring FIPS 140-2 Level 3 compliance. IC Role / Device Role / Timing Role: Secure non-volatile memory for U-Boot SPL and verified boot chain, interfaced via hardware-isolated SPI bus with /WP pin tied to system security controller. Use Value: Hardware write protection prevents runtime tampering; individual sector lock allows separate provisioning of bootloader vs. application partitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1G45GMI-13G | 1G-bit, 1.65–2.0V supply, 133MHz max, same WSON8 package but no /RESET pin in ZE variant | Identical industrial temp range and Quad SPI support; lacks dual-die unique ID and SFDP v1.6 compliance | Select when legacy driver compatibility with Macronix instruction set is required and security register depth is secondary |
| S25FL132K0XMFI010 | 128M-bit (not 1G-bit), 2.7–3.6V supply, 80MHz max, SOIC-16 only - no WSON8 option | Lower density and voltage mismatch preclude drop-in replacement; supports HyperBus but not Quad I/O | Consider only for brownfield designs already using Spansion SPI flash and requiring pin-compatible upgrade within same voltage domain |
Compared with MX25L1G45GMI-13G, W25Q01NWZEIM provides dual-die traceability and enhanced security registers; versus S25FL132K0XMFI010, it offers 8× higher density, 1.8V operation, and true Quad I/O - making it the sole fit for new 1G-bit XIP designs in compact industrial modules.
Availability
W25Q01NWZEIM is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging device configuration requiring stable component supply, long-term lifecycle assurance, and guaranteed 1.8V-compatible serial flash sourcing.
Supply support for W25Q01NWZEIM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded and industrial markets.
The W25Q series targets high-performance, low-voltage embedded systems needing reliable code storage with advanced security, XIP capability, and multi-die scalability - directly addressing demands from automotive, medical, and industrial IoT applications.
FAQ
What is the package type and pin count of W25Q01NWZEIM?
W25Q01NWZEIM uses an 8-pad WSON 8×6-mm package (package code ZE) with no exposed pad variant. It has eight terminals: /CS, DO (IO1), /WP (IO2), GND, DI (IO0), CLK, /HOLD or /RESET (IO3), and VCC. The /RESET function is not available in this ZE package - only /HOLD is implemented.
Does W25Q01NWZEIM support Quad SPI operation out of the box?
No - W25Q01NWZEIM requires the Quad Enable (QE) bit in Status Register-2 to be set to '1' to activate Quad SPI mode. Until then, /WP and /HOLD remain dedicated hardware pins. QE can be set via Write Status Register-2 (31h) instruction and is non-volatile, persisting across power cycles.
Can W25Q01NWZEIM be used in a 3.3V system?
No - W25Q01NWZEIM is strictly a 1.7–1.95V device and is not 3.3V-tolerant. Connecting it to a 3.3V SPI bus will damage the I/O pins. Level translation is mandatory if interfacing with 3.3V microcontrollers; Winbond does not specify any 3.3V-compatible variant for this part number.
How many unique identifiers does W25Q01NWZEIM provide?
W25Q01NWZEIM provides two independent 64-bit unique serial numbers - one per 512M-bit die - accessible via Read Unique ID Number (4Bh) instruction. This enables die-level traceability and secure provisioning in dual-die stack configurations, unlike single-ID flash devices.
Is hardware reset (/RESET) available on W25Q01NWZEIM?
No - the /RESET pin is not available on the W25Q01NWZEIM (ZE package). Hardware reset is only supported on SOIC-16 (SF) and TFBGA (TB) variants. For W25Q01NWZEIM, system-level reset must be handled via software reset instructions (66h + 99h) or power cycle.
W25Q01NWZEIM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q01NWZEIM FAQ
1.How can I place an order for W25Q01NWZEIM through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWZEIM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWZEIM reliable?
The price and inventory of W25Q01NWZEIM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWZEIM is usually 5 days.
3.What payment methods are accepted for W25Q01NWZEIM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWZEIM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWZEIM?
W25Q01NWZEIM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWZEIM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWZEIM?
For technical support, including W25Q01NWZEIM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWZEIM requirements.
6.How does Aetrix verify that W25Q01NWZEIM is sourced from the original manufacturer or authorized distributors?
All W25Q01NWZEIM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWZEIM meets industry standards.
7.What is the process for return or replacement of W25Q01NWZEIM?
All W25Q01NWZEIM units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWZEIM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWZEIM part is unused and in its original packaging.
Return procedure for W25Q01NWZEIM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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