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Winbond Electronics Corporation W25Q01NWZEIQ
- Part No.:
- W25Q01NWZEIQ
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q01NWZEIQ.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,945
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Product details
Overview
W25Q01NWZEIQ from Winbond is a 1G-bit (two 512M-bit stacked die) serial NOR flash memory supporting Dual/Quad SPI, 1.7–1.95V operation, 133MHz max clock, and 4KB uniform sector erase. It delivers 66MB/s continuous read throughput in Quad I/O mode and supports XIP (execute-in-place) for code storage in space-constrained embedded systems.
For engineers reviewing the W25Q01NWZEIQ datasheet, W25Q01NWZEIQ pinout, W25Q01NWZEIQ application, or W25Q01NWZEIQ equivalent, this device is selected for high-density, low-voltage boot code storage requiring JEDEC-compliant ID, SFDP register support, hardware write protection, and dual-die linear addressing with independent status reporting per die.
Technical Context
The W25Q01NWZEIQ implements a dual-die stack architecture with fully linear 1G-bit address space, enabling seamless 3- or 4-byte addressing via ADP bit configuration at power-up. Each die maintains independent BUSY/SUS status bits and a dedicated 64-bit unique ID.
It supports three SPI modes: Standard (DI/DO), Dual I/O (IO0/IO1), and Quad I/O (IO0–IO3), with Quad mode enabled only when QE bit in Status Register-2 is set - causing /WP and /HOLD to remap as IO2 and IO3. Hardware /RESET is available only on SOIC-16 and TFBGA packages, not on WSON ZE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (two 512M-bit dies), organized as 524,288 × 256-byte pages |
| Supply Voltage | 1.7 V to 1.95 V - enables integration into ultra-low-power 1.8V system rails |
| Max Clock Frequency | 133 MHz - supports 532 MHz equivalent Quad I/O data rate (133 × 4) |
| Erase Granularity | 4 KB sectors (32,768 total), 32 KB blocks, 64 KB blocks (2,048 total) - enables fine-grained firmware partitioning |
| Data Retention | 20+ years - validated for long-life industrial and automotive control applications |
| Endurance | 100,000 program/erase cycles per sector - suitable for frequent OTA update storage |
| Security Features | Three 256-byte OTP-lockable security registers, individual sector lock/unlock, SFDP register - meets secure boot and credential storage requirements |
Pinout & Package
W25Q01NWZEIQ uses the 8-pad WSON 8×6-mm package (JEDEC MO-241AC, Winbond package code ZE), with exposed thermal pad. Pin functions are defined for Standard/Dual SPI operation; Quad SPI repurposes /WP and /HOLD as IO2 and IO3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: drives DO/IOx to high-Z when deasserted; required transition H→L before instruction acceptance |
| DO (IO1) | Serial Data Output / Bidirectional I/O | Standard SPI output only; becomes bidirectional IO1 in Dual/Quad mode - used for fast read and command response |
| /WP (IO2) | Write Protect Input / Bidirectional I/O | Hardware write protect for status register when QE=0; becomes IO2 in Quad mode (QE=1) |
| GND | Ground Reference | Primary return path for all I/O and core logic; must be low-impedance for stable timing and noise immunity |
| DI (IO0) | Serial Data Input / Bidirectional I/O | Standard SPI input only; becomes bidirectional IO0 in Dual/Quad mode - carries instructions, addresses, and write data |
| CLK | Serial Clock Input | Edge-triggered timing reference for all SPI transfers; supports Mode 0 and Mode 3; max 133 MHz |
| /HOLD or /RESET (IO3) | Hold Input / Bidirectional I/O | Hold function active low during Standard/Dual SPI; becomes IO3 in Quad mode; no /RESET pin in WSON ZE package |
| VCC | Power Supply | 1.7–1.95 V core supply; powers internal charge pumps, logic, and I/O buffers |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Single 1G-bit address space with transparent access across two 512M-bit dies - eliminates software address translation overhead |
| Quad Enable (QE) bit | Non-volatile bit in Status Register-2 that permanently enables IO2/IO3 functionality - required for full 4-line data bus operation |
| Erase/program suspend | Allows background erase or program to pause and resume - enables real-time interrupt handling without data corruption |
| 64-bit unique ID per die | Two independent factory-programmed IDs - supports die-level traceability and secure key derivation in dual-boot systems |
| JEDEC + SFDP compliance | Supports Read JEDEC ID (9Fh) and Read SFDP Register (5Ah) - enables automatic driver configuration and vendor-agnostic initialization |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating continuously in harsh environments. IC Role / Device Role / Timing Role: Primary non-volatile boot and runtime code storage with XIP capability and hardware write protection against field updates. Use Value: 4KB sector granularity allows independent update of safety-critical firmware partitions; 20-year retention ensures lifetime reliability without refresh. | Use Scenario: Hosting boot loader and OS kernel for head unit systems requiring fast cold-start performance and secure OTA update staging. IC Role / Device Role / Timing Role: High-speed Quad SPI boot memory enabling sub-500ms boot time via direct execution from flash. Use Value: 66MB/s continuous read throughput and 133MHz clock meet AEC-Q100 Grade 3 timing budgets for infotainment subsystems. |
| Medical Diagnostic Device Configuration | Edge AI Sensor Node Code Storage |
Use Scenario: Holding calibration tables, regulatory compliance logs, and user interface assets in portable ultrasound and ECG devices. IC Role / Device Role / Timing Role: Secure parameter and asset storage with OTP-locked security registers for HIPAA/FDA audit trails. Use Value: Three 256-byte security registers with OTP locks prevent tampering with calibration coefficients or device identity credentials. | Use Scenario: Storing inference models and sensor fusion algorithms in battery-powered wireless nodes with intermittent connectivity. IC Role / Device Role / Timing Role: Low-power code and model storage supporting deep-sleep wake-up and rapid model reload. Use Value: 0.4µA typical power-down current extends battery life; 1.7–1.95V operation matches Li-ion single-cell voltage range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L1G45GMI-13G | 1G-bit, 1.65–2.0V, 133MHz, same WSON8 8×6mm package but lacks dual-die architecture and per-die unique ID | No linear dual-die addressing; requires external address management for >512M-bit access | Select when single-die simplicity suffices and per-die ID is unnecessary |
| S25FL132K0XMFI010 | 128M-bit (not 1G-bit), 2.7–3.6V, 80MHz max, SOIC-16 only - incompatible voltage and density | Cannot replace W25Q01NWZEIQ in 1.8V, high-density designs without board redesign | Only viable for legacy 3V systems with lower capacity needs |
Compared with MX25L1G45GMI-13G and S25FL132K0XMFI010, the W25Q01NWZEIQ uniquely delivers dual-die linear 1G-bit addressing at 1.8V with per-die status and ID - making it irreplaceable for compact, high-reliability boot memory where density, voltage, and die-level diagnostics are co-constrained.
Availability
W25Q01NWZEIQ is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical diagnostic device configuration requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for W25Q01NWZEIQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.
The W25Q series is designed specifically for high-performance, low-voltage code storage and XIP applications in resource-constrained systems - emphasizing density scalability, multi-I/O flexibility, and robust security features.
FAQ
What is the package type and footprint of W25Q01NWZEIQ?
W25Q01NWZEIQ uses the 8-pad WSON 8×6-mm package (JEDEC MO-241AC, Winbond code ZE) with an exposed thermal pad. It has no /RESET pin - that function is unavailable in this package variant. The footprint matches standard WSON-8 layouts with 0.5mm pitch and 2.1mm × 1.9mm pad dimensions per terminal.
Does W25Q01NWZEIQ support Quad SPI mode out of the box?
No - W25Q01NWZEIQ requires the Quad Enable (QE) bit in Status Register-2 to be set (to 1) to activate Quad SPI mode. Until then, /WP and /HOLD remain dedicated control pins. Setting QE remaps them as IO2 and IO3, enabling full 4-line data transfer. This is a non-volatile setting unless cleared.
How does the dual-die architecture of W25Q01NWZEIQ affect addressing and reliability?
W25Q01NWZEIQ presents a unified 1G-bit linear address space across two stacked 512M-bit dies. Each die reports independent BUSY and SUS status bits, allowing host software to monitor operations per die. This improves reliability by isolating faults and enabling staggered erase/program scheduling to reduce peak current draw.
Can W25Q01NWZEIQ be used in automotive applications requiring AEC-Q100 qualification?
W25Q01NWZEIQ itself is not AEC-Q100 qualified. However, Winbond offers automotive-grade variants (e.g., W25Q01NWSFIA) in SOIC-16 and TFBGA packages with extended temperature range (–40°C to +105°C) and AEC-Q100 Grade 3 certification. The ZE package (W25Q01NWZEIQ) is rated for –40°C to +85°C and intended for industrial, medical, and commercial use.
What security mechanisms does W25Q01NWZEIQ provide for firmware protection?
W25Q01NWZEIQ provides hardware write protection via /WP pin, software-controlled block protection (BP0–BP3, TB, CMP), volatile/non-volatile status register locking (SRP/SRL), and three 256-byte security registers with OTP locks. These allow hierarchical protection - from full chip lockdown to individual 4KB sector locking - essential for secure boot and credential storage.
W25Q01NWZEIQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q01NWZEIQ FAQ
1.How can I place an order for W25Q01NWZEIQ through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWZEIQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWZEIQ reliable?
The price and inventory of W25Q01NWZEIQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWZEIQ is usually 5 days.
3.What payment methods are accepted for W25Q01NWZEIQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWZEIQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWZEIQ?
W25Q01NWZEIQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWZEIQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWZEIQ?
For technical support, including W25Q01NWZEIQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWZEIQ requirements.
6.How does Aetrix verify that W25Q01NWZEIQ is sourced from the original manufacturer or authorized distributors?
All W25Q01NWZEIQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWZEIQ meets industry standards.
7.What is the process for return or replacement of W25Q01NWZEIQ?
All W25Q01NWZEIQ units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWZEIQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWZEIQ part is unused and in its original packaging.
Return procedure for W25Q01NWZEIQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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