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Winbond Electronics Corporation W25Q01NWZEIQ TR
- Part No.:
- W25Q01NWZEIQ TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25Q01NWZEIQ TR.pdf
- Description:
- IC FLASH 1GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,414
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Product details
Overview
W25Q01NWZEIQ TR from Winbond is a 1G-bit (two 512M-bit stacked die) serial flash memory IC supporting Dual/Quad SPI, 1.7–1.95V single-supply operation, 133MHz max clock, and 4KB uniform sector erase. It enables XIP (execute-in-place) code execution, data storage in space-constrained embedded systems, and supports hardware reset via /RESET pin in SOIC/TFBGA packages.
For engineers reviewing the W25Q01NWZEIQ TR datasheet, W25Q01NWZEIQ TR pinout, W25Q01NWZEIQ TR application, or W25Q01NWZEIQ TR equivalent, key selection considerations include 4-byte addressing mode support, Quad Enable (QE) bit configuration, dual-die linear address mapping, and package-specific /RESET availability (present in ZE, SF, TB variants but functionally mapped to /HOLD in WSON).
Technical Context
The W25Q01NWZEIQ TR implements a dual-die stacked architecture with independent status registers per die (BUSY, SUS), enabling concurrent or interleaved operations across 1G-bit linear address space. It supports three SPI modes (Standard/Dual/Quad) with configurable I/O pin remapping via non-volatile QE bit in Status Register-2.
It features JEDEC-compliant manufacturer/device ID (0xEF4021), SFDP register for discoverable parameters, and three 256-byte security registers with OTP lock capability. Addressing is configurable at power-up via ADP bit (non-volatile) for 3- or 4-byte mode - no runtime switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 G-bit (2 × 512 M-bit stacked die), 128 MB total capacity |
| Supply Voltage | 1.7 V to 1.95 V - enables low-power operation in battery-backed or energy-efficient systems |
| Max Clock Frequency | 133 MHz - supports 532 MB/s quad I/O throughput (Fast Read Quad I/O) |
| Erase Granularity | Uniform 4 KB sectors (32,768 total), 32 KB/64 KB blocks - enables fine-grained firmware partitioning |
| Endurance & Retention | 100,000 program/erase cycles; >20 years data retention - suitable for field-updatable firmware |
| Security Features | Three 256-byte OTP-lockable security registers; individual sector/block lock/unlock commands - meets secure boot and credential storage requirements |
| Operating Temp | –40°C to +85°C - qualified for industrial-grade embedded applications |
Pinout & Package
W25Q01NWZEIQ TR uses the 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond code ZE), with exposed thermal pad. Pin functions are shared across SPI modes: IO0–IO3 serve as DI/DO/WP/HOLD in Standard/Dual mode, and as full quad I/O when QE=1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; high-impedance DO during deselect; required high→low transition before instruction acceptance |
| DO (IO1) | Data Output / Quad I/O 1 | Unidirectional output in Standard SPI; bidirectional I/O in Dual/Quad mode when QE=1 |
| /WP (IO2) | Write Protect Input / Quad I/O 2 | Hardware write-protection of status register; remapped to IO2 in Quad mode (QE=1) |
| GND | Ground Reference | Primary return path for all I/O and core logic; must be low-impedance for timing integrity |
| DI (IO0) | Data Input / Quad I/O 0 | Unidirectional input in Standard SPI; bidirectional I/O in Dual/Quad mode when QE=1 |
| CLK | Serial Clock Input | Edge-triggered timing reference; supports SPI Mode 0 and Mode 3; max 133 MHz |
| /HOLD or /RESET (IO3) | Hold Input / Reset Input | In WSON package: /HOLD only (active-low pause); /RESET not available - differs from SF/TB packages |
| VCC | Power Supply | 1.7–1.95 V supply; decoupling capacitor required near pin for stable read/write timing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die linear addressing | Single 32-bit address space spanning both 512M-bit dies - eliminates software address translation overhead |
| Quad I/O with QE control | Non-volatile Quad Enable bit (SR-2, bit 1) configures /WP and /HOLD as IO2/IO3 - enables 4-line data transfer without external logic |
| Erase/program suspend | 75h/7Ah instructions allow background erase or program to pause/resume - critical for real-time interrupt handling |
| Individual sector lock | 36h/39h/3Dh commands provide per-sector write protection - supports secure bootloader + application partitioning |
| Unique ID per die | Two independent 64-bit serial numbers (one per die) - enables device-level traceability and anti-cloning |
Applications
| Secure Bootloader Storage | Firmware Over-the-Air (FOTA) |
|---|---|
Use Scenario: Storing immutable bootloader code and public key certificates in tamper-resistant flash. IC Role / Device Role / Timing Role: Non-volatile storage with hardware write-protection (/WP pin + BP bits) and OTP-locked security registers. Use Value: Prevents unauthorized modification of boot sequence using independent sector locks and CMP/SRP bits - validated in Winbond's secure boot reference designs. | Use Scenario: Receiving, verifying, and staging firmware updates in connected edge devices. IC Role / Device Role / Timing Role: High-throughput Quad I/O interface (532 MB/s) enables fast download; suspend/resume allows update interruption without corruption. Use Value: Reduces OTA window by >60% vs. standard SPI; erase/program suspend ensures safe power-loss recovery during update. |
| Execute-in-Place (XIP) Code Execution | Industrial HMI Configuration Storage |
Use Scenario: Running application code directly from flash on Cortex-M7/M33 microcontrollers without RAM copy. IC Role / Device Role / Timing Role: Low-latency Fast Read Quad I/O (6Bh/6Ch) with <8 ns output hold time supports deterministic XIP timing. Use Value: Eliminates 128 MB RAM requirement for code storage; reduces BOM cost and power by 15–20% in display controller subsystems. | Use Scenario: Persisting calibration data, user preferences, and UI theme assets in factory HMIs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: 4KB sector granularity enables atomic writes of configuration blocks; 100K-cycle endurance exceeds 10-year field life. Use Value: Guarantees data integrity across 100,000+ power cycles; avoids EEPROM wear leveling complexity in temperature-cycled environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q01JWZEIQ | Same density, voltage, and pinout; differs in die stack configuration (single 1G-bit die vs. dual 512M-bit) and lacks per-die unique IDs | No independent die status reporting; no dual-die suspend/resume concurrency | Select W25Q01JWZEIQ only if linear addressing simplicity outweighs need for die-level diagnostics or concurrent operations |
| MX25L1G45GZUI | 1G-bit, 1.65–2.0V, 133MHz, SOIC/TFBGA; lacks /RESET in WSON; no dual-die architecture or per-die unique IDs | Lower security register count (1×256B vs. 3×256B); no individual sector lock commands (36h/39h) | Choose MX25L1G45GZUI for cost-sensitive designs where OTP security and die-level traceability are non-critical |
Compared with W25Q01JWZEIQ and MX25L1G45GZUI, the W25Q01NWZEIQ TR uniquely delivers dual-die linear addressing with independent status registers and two 64-bit unique IDs - essential for secure, high-reliability firmware architectures requiring die-level fault isolation and cryptographic binding.
Availability
W25Q01NWZEIQ TR is available at Aetrix Electronics and suitable for industrial HMIs, secure bootloaders, FOTA-capable gateways, and XIP-based edge AI accelerators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for W25Q01NWZEIQ TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial NOR/NAND flash memory solutions for industrial, automotive, and computing markets.
The W25Q series targets high-performance, secure embedded storage - designed specifically for XIP, firmware update resilience, and cryptographic key storage in resource-constrained systems.
FAQ
What is the package type and footprint of the W25Q01NWZEIQ TR?
The W25Q01NWZEIQ TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-252, Winbond code ZE) with exposed thermal pad. It has identical footprint and solder mask layout to industry-standard WSON-8 packages, including compatible reflow profiles per J-STD-020. Pin 1 is marked by a dot; pinout matches Figure 1a in the official datasheet.
Does the W25Q01NWZEIQ TR support hardware reset, and how is it implemented?
No - the W25Q01NWZEIQ TR in WSON-8 package (ZE) does not include a dedicated /RESET pin. The /HOLD pin (Pin 7) serves only as hold input. Hardware reset is available only on SOIC-16 (SF) and TFBGA-24 (TB) variants. For W25Q01NWZEIQ TR, system-level reset must use software reset (66h + 99h) or power cycle.
How does the dual-die architecture of the W25Q01NWZEIQ TR affect addressing and command execution?
The W25Q01NWZEIQ TR presents a unified 32-bit linear address space (0x00000000–0x07FFFFFF). Internally, addresses above 0x03FFFFFF map to the second die. Both dies share instruction decoding but maintain independent status registers (BUSY, SUS), enabling true concurrent erase/program operations across dies when using con-current commands (e.g., 25h).
What is required to enable Quad SPI mode on the W25Q01NWZEIQ TR?
To enable Quad SPI on the W25Q01NWZEIQ TR, the non-volatile Quad Enable (QE) bit (Status Register-2, bit 1) must be set to '1' using Write Status Register-2 (31h) instruction. Once set, /WP (Pin 3) and /HOLD (Pin 7) become IO2 and IO3. QE remains active after power cycle unless explicitly cleared.
Can the W25Q01NWZEIQ TR be used in place of older W25Q80 or W25Q16 devices without design changes?
No - the W25Q01NWZEIQ TR is not pin-compatible or drop-in replaceable with W25Q80/W25Q16 due to higher density, dual-die architecture, mandatory 4-byte addressing support, and different security register layout. Firmware must be updated to handle 32-bit addressing, QE bit initialization, and dual-die status polling. PCB layout requires verification of /HOLD pin usage and VCC decoupling.
W25Q01NWZEIQ TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- 7 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25Q01NWZEIQ TR FAQ
1.How can I place an order for W25Q01NWZEIQ TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q01NWZEIQ TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q01NWZEIQ TR reliable?
The price and inventory of W25Q01NWZEIQ TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q01NWZEIQ TR is usually 5 days.
3.What payment methods are accepted for W25Q01NWZEIQ TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q01NWZEIQ TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q01NWZEIQ TR?
W25Q01NWZEIQ TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q01NWZEIQ TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q01NWZEIQ TR?
For technical support, including W25Q01NWZEIQ TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q01NWZEIQ TR requirements.
6.How does Aetrix verify that W25Q01NWZEIQ TR is sourced from the original manufacturer or authorized distributors?
All W25Q01NWZEIQ TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q01NWZEIQ TR meets industry standards.
7.What is the process for return or replacement of W25Q01NWZEIQ TR?
All W25Q01NWZEIQ TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q01NWZEIQ TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q01NWZEIQ TR part is unused and in its original packaging.
Return procedure for W25Q01NWZEIQ TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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