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Winbond Electronics Corporation W25Q02JVTBIM TR
- Part No.:
- W25Q02JVTBIM TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25Q02JVTBIM TR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,325
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Product details
Overview
W25Q02JVTBIM TR from Winbond is a 2G-bit (256MB) quad-die stacked serial flash memory IC supporting Dual/Quad SPI, QPI, and DTR read modes with 133MHz clock, 4KB uniform sector architecture, and hardware /RESET pin in 24-ball TFBGA 8×6-mm package - used for XIP code execution, firmware storage, and secure parameter retention in space-constrained embedded systems.
For engineers reviewing the W25Q02JVTBIM TR datasheet, W25Q02JVTBIM TR pinout, W25Q02JVTBIM TR application, or W25Q02JVTBIM TR equivalent, this page delivers verified pin functions, linear 4-byte addressing behavior, die-select capability, JEDEC SFDP compliance, and real-world trade-offs versus alternative high-density serial flash devices.
Technical Context
The W25Q02JVTBIM TR implements a four-die stack with independent BUSY/SUS status bits per die and factory-assigned Die ID# accessible via Software Die Select (C2h) instruction. It supports true linear 4-byte addressing across 00000000h–0FFFFFFFh, segmented into four 512M-bit address ranges, each mapped to one physical die.
Its interface dynamically reconfigures I/O roles: /WP and /HOLD become IO2 and IO3 when Quad Enable (QE) bit is set in Status Register-2; CLK operates up to 133MHz in standard SPI mode, enabling 532MHz equivalent bandwidth in Quad I/O Fast Read (EDh) with DTR, and supports Erase/Program Suspend & Resume for concurrent background operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2G-bit (256MB) total capacity across four 512M-bit stacked dies |
| Interface Modes | Standard/Dual/Quad SPI, QPI, and DTR-capable read instructions (e.g., EDh, BDh) |
| Max Clock Frequency | 133MHz SPI clock - enables 66MB/s continuous read throughput in Quad I/O DTR mode |
| Erase Granularity | Uniform 4KB sectors (32,768 total), plus 32KB/64KB blocks and full-chip erase |
| Write Endurance | Minimum 100,000 program/erase cycles per sector |
| Data Retention | Greater than 20 years at +25°C |
| Supply Voltage | 2.7V to 3.6V single supply - compatible with 3.3V logic systems |
| Operating Temp | –40°C to +85°C industrial grade temperature range |
Pinout & Package
Package: 24-ball TFBGA 8×6-mm (5×5 ball array), Package Code TB, top-side marking includes "W25Q02JV" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A4 | /RESET | Dedicated hardware reset input - forces power-on state when pulsed low ≥1µs; available only in TFBGA/SOIC16 packages |
| B2 | CLK | Serial clock input - controls timing of all SPI/QPI data transfers; supports up to 133MHz operation |
| B3 | GND | Ground reference - must be connected to system ground plane for stable operation |
| B4 | VCC | Primary power supply - 2.7–3.6V; powers internal charge pumps and logic |
| C2 | /CS | Chip select input - enables device communication; high = deselected (high-Z outputs, standby current) |
| C4 | /WP (IO2) | Write protect input or Quad I/O data line 2 - active-low hardware protection when QE=0; becomes IO2 when QE=1 |
| D2 | DO (IO1) | Data output or Quad I/O data line 1 - bidirectional in Dual/Quad modes; unidirectional DO in Standard SPI |
| D3 | DI (IO0) | Data input or Quad I/O data line 0 - bidirectional in Dual/Quad modes; unidirectional DI in Standard SPI |
| D4 | /HOLD (IO3) | Hold input or Quad I/O data line 3 - pauses ongoing read/write when low; becomes IO3 when QE=1 |
Key Features
| Feature | Design Value |
|---|---|
| Software Die Select (C2h) | Enables independent access to each of four stacked dies without external multiplexing or address translation |
| JEDEC SFDP Register | Provides standardized, discoverable configuration parameters - eliminates hard-coded timing assumptions in host drivers |
| 64-bit Unique ID per die | Supports device-level traceability and secure boot key binding per physical die in multi-die package |
| Erase/Program Suspend & Resume | Allows interruption of long erase/program operations to service time-critical reads - critical for real-time firmware updates |
| Three 256-byte Security Registers | OTP-lockable storage for cryptographic keys or calibration data - protected independently from main array |
| Power-down current <4µA | Enables ultra-low-power sleep states in battery-operated IoT edge nodes without compromising memory retention |
Applications
| Industrial HMI Firmware Storage | Automotive ADAS Boot Image |
|---|---|
Use Scenario: Storing GUI assets, configuration profiles, and firmware update payloads in panel-mounted HMIs with limited PCB area. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP support - executes boot loader directly from flash via Quad SPI at 133MHz. Use Value: Eliminates need for external RAM loading; 4KB sector granularity enables atomic over-the-air patching without erasing full application image. |
Use Scenario: Holding certified boot firmware and sensor calibration tables in automotive camera ECUs requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability storage with hardware write-protection and 20-year data retention - accessed via QPI for deterministic boot timing. Use Value: Prevents unauthorized firmware modification using /WP pin lock and OTP security registers; linear 4-byte addressing simplifies linker script management for >16MB images. |
| Medical Device Parameter Logging | Networking Equipment Configuration |
Use Scenario: Recording patient session logs and device calibration history in portable diagnostic tools with strict power budget. IC Role / Device Role / Timing Role: Low-power persistent storage - leverages <4µA power-down mode between logging intervals and fast Quad I/O reads for timestamped entries. Use Value: Enables 5+ year battery life in Class II medical devices while maintaining full 256MB capacity for longitudinal data archiving. |
Use Scenario: Storing switch/router configuration templates, MAC address tables, and firmware recovery images in compact network appliances. IC Role / Device Role / Timing Role: High-throughput configuration storage - uses DTR Fast Read Quad I/O (EDh) to load 1MB config in <160ms at 66MB/s. Use Value: Reduces boot time by 40% vs. legacy 8-pin SOIC flash; 24-ball TFBGA footprint saves >35% board area versus 16-pin SOIC alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25Q02JVSNIM TR | Same die stack and density but in 8-pin SOIC-16 package; lacks dedicated /RESET pin - uses /HOLD pin for reset via SR setting | No TFBGA footprint; requires larger PCB area; no hardware /RESET assertion - unsuitable for systems needing guaranteed cold reset | Select when board layout constraints permit SOIC-16 and hardware reset is managed via software or external circuitry |
| MX25L25673EZN-137I | 256MB SPI flash in 24-ball TFBGA; supports only Standard/Dual SPI (no QPI/DTR); max clock 133MHz but no DTR mode | Lacks Quad I/O and DTR - limits max read throughput to ~33MB/s; no software die select or individual die status reporting | Select when QPI/DTR features are unused and cost sensitivity outweighs performance/security requirements |
Compared with W25Q02JVTBIM TR, W25Q02JVSNIM TR trades TFBGA miniaturization for SOIC-16 manufacturability and loses hardware /RESET, while MX25L25673EZN-137I omits die-select, DTR, and QPI - reducing both flexibility in multi-image architectures and peak bandwidth by 50%.
Availability
W25Q02JVTBIM TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive ADAS boot image retention, and medical device parameter logging requiring stable component supply across extended product lifecycles.
Supply support for W25Q02JVTBIM TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including serial flash, PSRAM, and code storage products for embedded and industrial markets.
The W25Q series targets high-density, high-performance code storage applications - designed for XIP execution, secure firmware updates, and reliable data logging in constrained-footprint systems.
FAQ
What is the difference between W25Q02JVTBIM TR and W25Q02JV-DTR?
W25Q02JVTBIM TR is the orderable part number for the 24-ball TFBGA 8×6-mm packaged version of the W25Q02JV-DTR device. The "-DTR" suffix denotes Double Transfer Rate support, which is implemented identically in both part numbers. The "TBIM TR" suffix specifies TFBGA package (TB), industrial temperature grade (I), moisture sensitivity level 3 (M), and tape-and-reel packaging (TR). All electrical, functional, and timing specifications match the W25Q02JV-DTR datasheet.
Does W25Q02JVTBIM TR support true 4-byte addressing across the full 2G-bit range?
Yes, W25Q02JVTBIM TR supports linear 4-byte addressing from 00000000h to 0FFFFFFFh. Its four-die stack is mapped contiguously: Die #0 (00000000h–03FFFFFFh), Die #1 (04000000h–07FFFFFFh), Die #2 (08000000h–0BFFFFFFh), and Die #3 (0C000000h–0FFFFFFFh). The ADP bit in Status Register-1 determines default address mode at power-up, and B7h/E9h instructions enable/disable 4-byte mode dynamically.
How does the /RESET pin on W25Q02JVTBIM TR differ from /HOLD functionality?
The /RESET pin on W25Q02JVTBIM TR is a dedicated hardware reset input (ball A4) that forces the device into its power-on state when pulsed low for ≥1µs - terminating all internal operations immediately. In contrast, /HOLD (ball D4) only pauses active read/write sequences while /CS remains low and does not affect status register state or erase/program progress. /RESET is unavailable in SOIC-8 packages but is physically present and functional in W25Q02JVTBIM TR's TFBGA package.
Can W25Q02JVTBIM TR be used in Quad SPI mode without modifying the PCB layout?
Yes, W25Q02JVTBIM TR supports Quad SPI mode out-of-box via non-volatile Quad Enable (QE) bit in Status Register-2. When QE=1, pins C4 (/WP) and D4 (/HOLD) automatically become IO2 and IO3 - no PCB changes needed. However, host firmware must issue Write Status Register (01h/31h/11h) to set QE and use Quad-compatible instructions (e.g., 6Bh, EBh, EDh); standard SPI instructions remain functional with QE=0.
What security mechanisms does W25Q02JVTBIM TR provide for firmware protection?
W25Q02JVTBIM TR provides layered security: hardware /WP pin lock, volatile/non-volatile block protect bits (BP3–BP0), top/bottom/complement array protection, individual sector lock (36h/39h), global lock (7Eh/98h), and three 256-byte OTP-locked Security Registers. Each die has a unique 64-bit ID for binding cryptographic keys, and the SFDP register enables standardized secure configuration discovery - all enforced without external controllers.
W25Q02JVTBIM TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O, QPI, DTR
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 3.5ms
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25Q02JVTBIM TR FAQ
1.How can I place an order for W25Q02JVTBIM TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25Q02JVTBIM TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25Q02JVTBIM TR reliable?
The price and inventory of W25Q02JVTBIM TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q02JVTBIM TR is usually 5 days.
3.What payment methods are accepted for W25Q02JVTBIM TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q02JVTBIM TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25Q02JVTBIM TR?
W25Q02JVTBIM TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25Q02JVTBIM TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25Q02JVTBIM TR?
For technical support, including W25Q02JVTBIM TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q02JVTBIM TR requirements.
6.How does Aetrix verify that W25Q02JVTBIM TR is sourced from the original manufacturer or authorized distributors?
All W25Q02JVTBIM TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q02JVTBIM TR meets industry standards.
7.What is the process for return or replacement of W25Q02JVTBIM TR?
All W25Q02JVTBIM TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q02JVTBIM TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25Q02JVTBIM TR part is unused and in its original packaging.
Return procedure for W25Q02JVTBIM TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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