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Winbond Electronics Corporation W25Q128BVEJP

Part No.:
W25Q128BVEJP
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q128BVEJP.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,160

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Product details

Overview

W25Q128BVEJP from Winbond is a 128M-bit (16MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with up to 104 MHz clock rate, 4KB uniform sector architecture, and 1µA power-down current. It enables execute-in-place (XIP) code execution, firmware storage, and parameter retention in space-constrained embedded systems including IoT edge nodes and industrial controllers.

For engineers reviewing the W25Q128BVEJP datasheet, W25Q128BVEJP pinout, W25Q128BVEJP application, or W25Q128BVEJP equivalent, key selection criteria include Quad SPI timing compliance (EBh/E7h instructions), hardware write protection via /WP pin, 4KB sector erase granularity, and JEDEC-compliant 64-bit unique ID for device authentication.

Technical Context

The W25Q128BVEJP implements a SPI command decoder with dual-mode status register control (SR-1/SR-2), where non-volatile Quad Enable (QE) bit in SR-2 must be set to activate IO2/IO3 for Quad I/O operation. Its block diagram integrates a 256-byte page buffer, SFDP register for discoverable parameters, and three 256-byte security registers with OTP locks.

It supports SPI modes 0 and 3, with hold functionality active only during Standard/Dual SPI - disabled when QE=1 - and uses dedicated /CS tracking logic to ensure reliable power-up initialization. Erase/program suspend/resume capability allows interruptible background operations without data corruption.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 M-bit (16 MB), organized as 65,536 × 256-byte pages
Interface Support Standard SPI (DI/DO), Dual SPI (IO0/IO1), Quad SPI (IO0–IO3) with QE bit enable
Max Clock Frequency 104 MHz for Dual Output, 70 MHz for Quad I/O - enabling 208 Mbps / 280 Mbps effective throughput
Erase Granularity Uniform 4 KB sectors (4,096 total), plus 32 KB and 64 KB blocks - ideal for firmware partitioning
Write Endurance 100,000 program/erase cycles per sector, with >20-year data retention at +85°C
Power Supply Single 2.7 V to 3.6 V supply; 4 mA active current, <1 µA power-down current
Operating Temperature −40°C to +85°C industrial grade, validated across full voltage range

Pinout & Package

W25Q128BVEJP is packaged in an 8-pad WSON 8×6 mm (Package Code E) with exposed thermal pad. Pin functions are electrically identical across all W25Q128BV variants but physically mapped to this compact surface-mount footprint.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; high-impedance DO output and standby current when deasserted
DO (IO1) Data Output / Bidirectional I/O1 Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI for read/write data
/WP (IO2) Write Protect Input / Bidirectional I/O2 Hardware lock for status register; repurposed as IO2 when QE=1 in Quad mode
GND Ground Reference Primary return path for all internal logic and I/O circuits
DI (IO0) Data Input / Bidirectional I/O0 Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI for address/instruction/data
CLK Serial Clock Input Synchronous timing reference for all SPI transfers; supports Mode 0 and Mode 3
/HOLD (IO3) Hold Input / Bidirectional I/O3 Pauses ongoing SPI transaction; repurposed as IO3 when QE=1 in Quad mode
VCC Power Supply Single 2.7–3.6 V supply powering core logic, charge pumps, and I/O drivers

Key Features

Feature Design Value
Quad SPI XIP Support Enables true execute-in-place via Fast Read Quad I/O (EBh) with ≤8-clock instruction overhead
Hardware Write Protection /WP pin + BP/TB/SEC bits allow locking individual 4KB sectors or top/bottom array halves
Security Register Set Three 256-byte OTP-locked security registers for keys, calibration data, or secure boot assets
Continuous Read Mode Configurable 8/16/32/64-byte wrap reduces bus arbitration latency for streaming applications
JEDEC Compliance Full manufacturer/device ID (90h/9Fh), SFDP register (5Ah), and 64-bit unique serial number

Applications

Industrial HMI Firmware Storage IoT Edge Node Configuration

Use Scenario: Storing GUI assets, boot firmware, and localized language packs in panel-mounted HMIs with limited PCB real estate.

IC Role / Device Role / Timing Role: Primary non-volatile code and asset store accessed via Quad SPI XIP for deterministic UI response.

Use Value: 4KB sector erase enables over-the-air partial firmware updates without disrupting operational code partitions.

Use Scenario: Holding sensor calibration tables, network credentials, and OTA update staging buffers in battery-powered environmental sensors.

IC Role / Device Role / Timing Role: Low-power configuration and state retention element interfaced via Dual SPI during wake-up bursts.

Use Value: 1µA power-down current extends multi-year battery life while preserving critical device identity and settings.

Automotive Infotainment Boot Loader Medical Device Parameter Archive

Use Scenario: Hosting signed bootloader images and fail-safe recovery firmware in automotive head units requiring AEC-Q100 alignment.

IC Role / Device Role / Timing Role: Secure boot source verified via 64-bit unique ID and SFDP-defined memory map before MCU initialization.

Use Value: Hardware /WP pin + volatile/non-volatile status register protection prevents accidental corruption during CAN bus noise events.

Use Scenario: Archiving patient-specific therapy parameters, usage logs, and regulatory audit trails in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Tamper-resistant parameter vault using OTP-locked security registers and sector-level write lock.

Use Value: 100,000-cycle endurance ensures >10 years of daily recalibration logging under IEC 62304 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L12833F 128 M-bit, 3V, SOIC-8 package only; no TFBGA/WSON; max Quad SPI clock 80 MHz Lacks 8×6-mm WSON option and 104 MHz Dual SPI support; lower continuous transfer bandwidth Select when legacy SOIC-8 footprint compatibility is required and 208 Mbps throughput is not needed.
S25FL128S 128 M-bit, 3V, supports HyperBus interface; different command set; 133 MHz read clock Requires HyperFlash controller; incompatible SPI instruction set; no /HOLD pin or SFDP register Choose only for designs already committed to Cypress/Infineon HyperBus ecosystem and higher bandwidth needs.

Compared with MX25L12833F and S25FL128S, the W25Q128BVEJP delivers superior flexibility through its 8×6-mm WSON package, full SPI mode compatibility (0/3), and integrated security features - making it optimal for new designs prioritizing miniaturization, interoperability, and firmware integrity.

Availability

W25Q128BVEJP is available at Aetrix Electronics and suitable for industrial HMIs, IoT edge nodes, automotive infotainment systems, and medical diagnostics equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for W25Q128BVEJP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR flash, RAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W25Q series was designed specifically for embedded systems needing high-speed, low-power, and secure serial code storage - emphasizing Quad SPI performance, sector-level protection, and JEDEC-standardized identification.

FAQ

What is the package type and footprint of the W25Q128BVEJP?

The W25Q128BVEJP uses an 8-pad WSON 8×6 mm package (Package Code E) with exposed thermal pad. It shares pinout compatibility with other W25Q128BV variants in SOIC-16 and TFBGA-24 packages, but the 'EJP' suffix specifically denotes the WSON variant. This footprint enables high-density PCB layouts while maintaining thermal performance for sustained read/write operations.

Does the W25Q128BVEJP support execute-in-place (XIP) operation?

Yes, the W25Q128BVEJP supports true XIP via Continuous Read Mode with Fast Read Quad I/O (EBh) and Word Read Quad I/O (E7h) instructions. With as few as 8 clocks of instruction overhead per 24-bit address, it enables deterministic code execution directly from flash without RAM shadowing - validated across its full −40°C to +85°C operating range.

How is hardware write protection implemented on the W25Q128BVEJP?

Hardware write protection on the W25Q128BVEJP uses the /WP pin in conjunction with Block Protect (BP2–BP0), Top/Bottom (TB), and Sector Protect (SEC) bits in Status Register-1. When /WP is pulled low, writes to protected sectors or the status register are blocked - independent of software commands - providing immunity to noise-induced corruption during power transients.

What is the function of the /HOLD pin on the W25Q128BVEJP, and when is it active?

The /HOLD pin on the W25Q128BVEJP pauses active SPI transactions while /CS remains low, placing DO in high-impedance and ignoring DI/CLK inputs. It is active only during Standard and Dual SPI operation; when the Quad Enable (QE) bit is set, /HOLD is reassigned as IO3 and the hold function is disabled per datasheet specification.

Can the W25Q128BVEJP be used in automotive applications?

The W25Q128BVEJP operates across −40°C to +85°C and meets industrial reliability standards, but it is not AEC-Q100 qualified. For automotive infotainment or body control modules requiring qualification, Winbond offers the AEC-Q100 Grade 3 W25Q128JW variant. The W25Q128BVEJP remains suitable for under-hood-adjacent industrial controls where extended temperature and robustness are needed without formal automotive certification.

W25Q128BVEJP Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q128BVEJP FAQ

1.How can I place an order for W25Q128BVEJP through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128BVEJP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128BVEJP reliable?

The price and inventory of W25Q128BVEJP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128BVEJP is usually 5 days.

3.What payment methods are accepted for W25Q128BVEJP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128BVEJP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128BVEJP?

W25Q128BVEJP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128BVEJP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128BVEJP?

For technical support, including W25Q128BVEJP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128BVEJP requirements.

6.How does Aetrix verify that W25Q128BVEJP is sourced from the original manufacturer or authorized distributors?

All W25Q128BVEJP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128BVEJP meets industry standards.

7.What is the process for return or replacement of W25Q128BVEJP?

All W25Q128BVEJP units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128BVEJP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128BVEJP part is unused and in its original packaging.

Return procedure for W25Q128BVEJP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W25Q128BVEJP Tags

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