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Winbond Electronics Corporation W25Q128BVEJP TR

Part No.:
W25Q128BVEJP TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixW25Q128BVEJP TR.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,837

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Product details

Overview

W25Q128BVEJP TR from Winbond is a 128M-bit (16MB) serial NOR flash memory IC supporting Standard, Dual, and Quad SPI interfaces with 4KB uniform sectors, 104MHz dual-output/70MHz quad-output clock rates, and true execute-in-place (XIP) capability for embedded code storage. It operates from 2.7V to 3.6V, draws 4mA active current and <1µA in power-down mode, and targets boot code storage in microcontroller-based systems.

For engineers reviewing the W25Q128BVEJP TR datasheet, W25Q128BVEJP TR pinout, W25Q128BVEJP TR application, or W25Q128BVEJP TR equivalent, key selection criteria include Quad SPI XIP support, hardware write protection via /WP and /HOLD pins, JEDEC ID and SFDP register compatibility, 4KB sector granularity for firmware partitioning, and WSON-8 package suitability for space-constrained PCB layouts.

Technical Context

The W25Q128BVEJP TR implements a SPI command-set architecture with three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), where Quad mode requires non-volatile QE bit enablement in Status Register-2. Its internal block diagram includes a 256-byte page buffer, sector/block erase logic, and dedicated security registers with OTP locks.

It supports full instruction set compliance including Fast Read Quad I/O (EBh), Word Read Quad I/O (E7h), and Octal Word Read Quad I/O (E3h), enabling up to 280MHz equivalent throughput. Erase granularity spans 4KB sectors, 32KB blocks, 64KB blocks, and full chip, with ≥100,000 program/erase cycles and >20-year data retention confirmed per specification.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 M-bit (16 MB), organized as 65,536 × 256-byte pages
Interface Support Standard/Dual/Quad SPI with IO0–IO3; QE bit required for Quad I/O mode
Max Clock Frequency 104 MHz (Dual Output), 70 MHz (Quad I/O); enables 208/280 MHz equivalent bandwidth
Erase Granularity Uniform 4KB sectors (4,096 total), 32KB/64KB blocks, and chip-erase
Power Supply Single 2.7V–3.6V supply; 4mA active current, <1µA power-down current
Data Retention Minimum 20 years at +85°C; validated across industrial temperature range (−40°C to +85°C)
Security Features 64-bit unique serial number, SFDP register, 3×256-byte security registers with OTP locks

Pinout & Package

W25Q128BVEJP TR uses an 8-pad WSON 8×6-mm package (Package Code E), surface-mount, lead-free, moisture-sensitive level 3 (MSL3). Pin assignments are fixed per JEDEC MO-241AC standard.

Pin/Terminal Circuit Role Design Meaning
/CS Chip Select Input Active-low enable; high-impedance DO output when deasserted; required low-to-high transition before new instruction acceptance
DO (IO1) Data Output / Bidirectional I/O1 Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for read data and status
/WP (IO2) Write Protect Input / Bidirectional I/O2 Hardware write lock for status register; repurposed as IO2 in Quad SPI when QE=1
GND Ground Reference Primary return path for VCC and all I/O signals; must be low-impedance connection
DI (IO0) Data Input / Bidirectional I/O0 Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and program data
CLK Serial Clock Input Edge-triggered timing source; supports SPI Modes 0 and 3; rising edge for input, falling edge for output
/HOLD (IO3) Hold Input / Bidirectional I/O3 Pauses active operation without deselecting device; repurposed as IO3 in Quad SPI when QE=1
VCC Power Supply 2.7V–3.6V single supply; decoupling capacitor (0.1µF) required near pad

Key Features

Feature Design Value
Continuous Read Mode Enables true XIP with ≤8-clock instruction overhead per 24-bit address; eliminates external RAM buffering for boot code
Quad SPI Performance Delivers 35 MB/s continuous transfer rate-5× faster than baseline serial flash-supporting real-time firmware updates
Flexible Protection Scheme Combines hardware (/WP, /HOLD) and software (BP0–BP2, TB, SEC, CMP) write protection down to 4KB sector level
Security Register Architecture Three 256-byte security registers with one-time-programmable (OTP) lock bits for secure key or calibration storage
JEDEC & SFDP Compliance Supports standardized manufacturer/device ID (9Fh), Unique ID (4Bh), and Serial Flash Discoverable Parameters (5Ah)

Applications

Boot Code Storage Firmware Update Storage

Use Scenario: Storing primary bootloader and application firmware for ARM Cortex-M or RISC-V microcontrollers during cold start.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable Quad SPI interface; provides deterministic read latency for first-instruction fetch.

Use Value: Eliminates need for parallel NOR flash or external RAM loading; reduces BOM count and boot time by enabling direct execution from flash.

Use Scenario: Holding field-upgradable firmware images in industrial gateways and IoT edge nodes.

IC Role / Device Role / Timing Role: Dual-bank update storage with independent 4KB sector erasure; supports atomic swap between active/inactive image partitions.

Use Value: Enables safe over-the-air (OTA) updates with rollback capability; 4KB granularity prevents corruption of critical configuration sectors during partial writes.

Secure Configuration Storage Embedded GUI Asset Storage

Use Scenario: Storing cryptographic keys, device certificates, and factory-calibrated sensor offsets in medical or automotive ECUs.

IC Role / Device Role / Timing Role: Tamper-resistant storage using OTP-locked security registers and hardware write protection.

Use Value: Prevents unauthorized modification of security-critical parameters; meets ISO 13849 PLd and IEC 62443-3-3 requirements for secure boot integrity.

Use Scenario: Caching bitmap assets, font tables, and UI strings for smart display modules in HMI applications.

IC Role / Device Role / Timing Role: High-bandwidth asset repository accessed via Fast Read Quad I/O (EBh) for rapid screen rendering.

Use Value: Sustains >25 MB/s burst reads to feed LCD controllers without frame tearing; 16MB capacity accommodates full-color 800×480 GUI resources.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L12833FZNI-08G 128M-bit, 104MHz max clock, SOIC-16 and WSON-8 packages; lacks SFDP register and Octal Word Read instruction Compatible for basic code storage but not optimized for XIP-heavy workloads requiring SFDP auto-configuration Select when legacy SPI controller compatibility is prioritized over advanced Quad I/O features and parameter discovery
S25FL128SAGMFI000 128M-bit, 80MHz Quad SPI, TFBGA-24 and SOIC-16; includes HyperBus interface option and enhanced ECC Supports higher reliability in extended-temp automotive environments but requires different pinout and layout Choose for AEC-Q100 Grade 2 automotive designs needing ECC and wider temp range (−40°C to +105°C)

Compared with MX25L12833FZNI-08G and S25FL128SAGMFI000, the W25Q128BVEJP TR delivers superior Quad SPI bandwidth (70MHz vs. 80MHz/104MHz), integrated SFDP for automatic driver initialization, and smaller WSON-8 footprint-making it optimal for cost-sensitive, space-constrained consumer and industrial MCU platforms requiring fast XIP.

Availability

W25Q128BVEJP TR is available at Aetrix Electronics and suitable for boot code storage, firmware update staging, secure configuration management, and embedded GUI asset caching requiring stable component supply across production lifecycles.

Supply support for W25Q128BVEJP TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, and serial flash memory solutions for embedded, communications, and consumer markets.

The W25Q series is designed specifically for high-performance, low-power code storage in resource-constrained microcontroller systems-emphasizing Quad SPI XIP, sector-level flexibility, and industrial-grade reliability.

FAQ

What is the package type and footprint of the W25Q128BVEJP TR?

The W25Q128BVEJP TR uses an 8-pad WSON 8×6-mm package (JEDEC MO-241AC), with exposed thermal pad and lead-free finish. Its compact footprint measures 8.0mm × 6.0mm × 0.75mm height, making it suitable for dense PCB layouts in portable and industrial control applications. The pinout matches Winbond's standard WSON-8 assignment for /CS, DO, /WP, GND, DI, CLK, /HOLD, and VCC.

Does the W25Q128BVEJP TR support execute-in-place (XIP) operation?

Yes, the W25Q128BVEJP TR supports true XIP via its Continuous Read Mode and Fast Read Quad I/O (EBh) instruction, achieving ≤8-clock address overhead and sustained 35 MB/s throughput. This allows ARM Cortex-M or RISC-V cores to execute firmware directly from flash without RAM shadowing-reducing system memory requirements and boot latency in the W25Q128BVEJP TR implementation.

How is hardware write protection implemented on the W25Q128BVEJP TR?

The W25Q128BVEJP TR implements hardware write protection through the /WP (pin 3) signal, which-when held low-prevents writes to the status register regardless of software commands. Combined with software-configurable BP0–BP2, TB, and SEC bits, it enables selective locking of 4KB sectors or top/bottom array regions. Note that /WP is disabled in Quad SPI mode when the QE bit is set, as pin 3 becomes IO2.

What is the role of the /HOLD pin on the W25Q128BVEJP TR?

The /HOLD pin (pin 7) on the W25Q128BVEJP TR pauses ongoing SPI operations while maintaining /CS assertion, allowing shared bus arbitration without resetting internal state. It is active-low and functional only in Standard and Dual SPI modes; in Quad SPI, pin 7 serves as IO3. During /HOLD, DO goes high-impedance and DI/CLK are ignored-enabling priority interrupt handling in multi-peripheral systems using the W25Q128BVEJP TR.

Is the W25Q128BVEJP TR compatible with JEDEC-standard identification and parameter discovery?

Yes, the W25Q128BVEJP TR fully supports JEDEC-standard identification via Read JEDEC ID (9Fh), Manufacturer/Device ID (90h/92h/94h), and 64-bit Unique ID (4Bh). It also implements the Serial Flash Discoverable Parameters (SFDP) register (5Ah), enabling host drivers to auto-detect timing, erase, and protection capabilities-eliminating hardcoded configuration in bootloader firmware for the W25Q128BVEJP TR.

W25Q128BVEJP TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
SpiFlash®
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
50µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (8x6)

W25Q128BVEJP TR FAQ

1.How can I place an order for W25Q128BVEJP TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W25Q128BVEJP TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W25Q128BVEJP TR reliable?

The price and inventory of W25Q128BVEJP TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25Q128BVEJP TR is usually 5 days.

3.What payment methods are accepted for W25Q128BVEJP TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25Q128BVEJP TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W25Q128BVEJP TR?

W25Q128BVEJP TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W25Q128BVEJP TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W25Q128BVEJP TR?

For technical support, including W25Q128BVEJP TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25Q128BVEJP TR requirements.

6.How does Aetrix verify that W25Q128BVEJP TR is sourced from the original manufacturer or authorized distributors?

All W25Q128BVEJP TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25Q128BVEJP TR meets industry standards.

7.What is the process for return or replacement of W25Q128BVEJP TR?

All W25Q128BVEJP TR units undergo pre-shipment inspection (PSI). If there is an issue with W25Q128BVEJP TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W25Q128BVEJP TR part is unused and in its original packaging.

Return procedure for W25Q128BVEJP TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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